The present invention concerns a vehicle antenna glazing antenna element. According to the present invention, the antenna element is placed on an outwardly oriented face of the glazing and the antenna is working at a frequency comprised between 750 MHZ and 28 GHZ. The antenna 5 element is connected to a co-axial cable.

The present invention concerns a vehicle antenna glazing antenna element. According to the present invention, the antenna element is placed on an outwardly oriented face of the glazing and the antenna is working at a frequency comprised between 750 MHZ and 28 GHZ. The antenna 5 element is connected to a co-axial cable.

Base station antennas are provided herein. A base station antenna includes a plurality of vertical columns of low-band radiating elements configured to transmit RF signals in a first frequency band. The base station antenna also includes a plurality of vertical columns of high-band radiating elements configured to transmit RF signals in a second frequency band that is higher than the first frequency band. The vertical columns of high-band radiating elements extend in parallel with the vertical columns of low-band radiating elements in a vertical direction.

An electronic device is provided. The electronic devices includes a housing at least partially including a conductive portion, an antenna structure including a printed circuit board including a plurality of insulating layers, at least one first conductive patch including a first feeding point, and a second feeding point, and at least one second conductive patch including a third feeding point, and a fourth feeding point, and an antenna module including a wireless communication circuit configured to transmit or receive a first signal through the at least one first conductive patch and to transmit or receive a second signal of a second frequency band through the at least one second conductive patch.

The disclosed coil-integrated housing component may include an injection-molded housing dimensioned to house a display module of a computing device. Additionally, the coil-integrated housing component may include a conductive coil integrated into the injection-molded housing to surround a periphery of the display module, wherein the conductive coil may be electronically coupled to the computing device. Various other apparatuses, systems, and methods are also disclosed.

An antenna stack structure according to an embodiment includes an antenna substrate layer, an antenna unit disposed on one surface of the antenna substrate layer and including a radiator and an antenna pad, and a pad ground and an insulating layer disposed at the same level on an opposite surface of the antenna substrate layer facing the one surface. The antenna pad is superimposed over the pad ground in a thickness direction. Radiation properties can be improved utilizing the antenna pad.

A communication device includes a dielectric substrate, a radiating element that has a flat shape and that is formed on the dielectric substrate, a housing that covers the dielectric substrate, and a rib. The rib is disposed in contact with the housing and the dielectric substrate. Feed points to which a radio frequency signal from an RFIC is supplied are formed in the radiating element. The rib and the dielectric substrate are in contact with each other in a center side region of the radiating element relative to the feed points, in a plan view from a normal direction of the dielectric substrate.

A communication device includes a dielectric substrate, a radiating element that has a flat shape and that is formed on the dielectric substrate, a housing that covers the dielectric substrate, and a rib. The rib is disposed in contact with the housing and the dielectric substrate. Feed points to which a radio frequency signal from an RFIC is supplied are formed in the radiating element. The rib and the dielectric substrate are in contact with each other in a center side region of the radiating element relative to the feed points, in a plan view from a normal direction of the dielectric substrate.

The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.

A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.