A film antenna according to an embodiment of the present invention includes a dielectric layer, a first electrode on the dielectric layer, an insulation layer covering the first electrode, and a second electrode on the insulation layer to be electrically connected to the first electrode. The second electrode has a thickness different from that of the first electrode and has a transmittance lower than that of the first electrode. The film antenna having high transmittance and providing high frequency operation may be provided by a construction of the first electrode and the second electrode.

A film antenna according to an embodiment of the present invention includes a dielectric layer, a first electrode on the dielectric layer, an insulation layer covering the first electrode, and a second electrode on the insulation layer to be electrically connected to the first electrode. The second electrode has a thickness different from that of the first electrode and has a transmittance lower than that of the first electrode. The film antenna having high transmittance and providing high frequency operation may be provided by a construction of the first electrode and the second electrode.

Electronic device having at least one main antenna (1) where such antenna is formed as a conductive layer on walls of a housing (10) of the electronic device through a laser direct structuring process and has a first portion (2, 3) on an internal part of the housing, a second portion (4) forming a junction area on an edge between an interior part and an exterior part of the housing and a third portion (5) on an outer part of the housing in electrical continuity with the first portion through the junction area.

Electronic device having at least one main antenna (1) where such antenna is formed as a conductive layer on walls of a housing (10) of the electronic device through a laser direct structuring process and has a first portion (2, 3) on an internal part of the housing, a second portion (4) forming a junction area on an edge between an interior part and an exterior part of the housing and a third portion (5) on an outer part of the housing in electrical continuity with the first portion through the junction area.

An electromagnetic pulse (EMP) resistant telecommunications (telecom) system includes core components mounted within and shielded by a Faraday cage. The components include a data source or storage device. An ethernet switch selectively connects the data source or storage device to a primary satellite router and a post-EMP satellite router. Telecom signals are output from and input to the core components via low noise blocks (LNBs) and block upconverters (BUCs). A method of resisting EMP interference for a telecommunications system includes the steps of enclosing and shielding core components in a Faraday cage and providing output via LNBs and BUCs to an antenna subsystem. The antenna subsystem can include one or more antenna elements with configurations chosen from the group comprising: parabolic dish; array; unidirectional; and omnidirectional. The EMP-resistant telecom can optionally be combined with a signal regenerating subsystem and used with a signal regenerating method.

An electromagnetic pulse (EMP) resistant telecommunications (telecom) system includes core components mounted within and shielded by a Faraday cage. The components include a data source or storage device. An ethernet switch selectively connects the data source or storage device to a primary satellite router and a post-EMP satellite router. Telecom signals are output from and input to the core components via low noise blocks (LNBs) and block upconverters (BUCs). A method of resisting EMP interference for a telecommunications system includes the steps of enclosing and shielding core components in a Faraday cage and providing output via LNBs and BUCs to an antenna subsystem. The antenna subsystem can include one or more antenna elements with configurations chosen from the group comprising: parabolic dish; array; unidirectional; and omnidirectional. The EMP-resistant telecom can optionally be combined with a signal regenerating subsystem and used with a signal regenerating method.

An RFID includes a first conductive layer; a second conductive layer in which an antenna is formed; an insulating layer; and an IC chip. The antenna includes a first slot; a second slot facing the first slot; a coupling slot to couple the first slot with the second slot; a first adjustment slot coupled with one end of the first slot, and being wider than the first slot; a second adjustment slot coupled with another end of the first slot, and being wider than the first slot; a third adjustment slot coupled with one end of the second slot, and being wider than the second slot; a fourth adjustment slot coupled with another end of the second slot, and being wider than the second slot.

An antenna element according to the present invention includes a substrate, an emitting element disposed on the substrate, and metal patterns formed in the same surface of the same substrate as those of the emitting element, and disposed so as to be in an electrically floating state, in which the metal patterns are disposed at such positions that the metal patterns have a specific distance from the emitting element.

According to certain embodiments, an electronic device includes a display configured to output visual information to the front of the electronic device, a support structure configured to support at least one of electronic components accommodated in the electronic device, the support structure having a first surface and a second surface, and an antenna including a ground portion disposed on the first surface and a radiation portion disposed on the second surface that are disposed respectively on both surfaces of the support structure.

A method for manufacturing a liquid-crystal antenna device is provided. The method includes step (a) providing a first mother substrate. The first mother substrate includes a first region and a second region. The first region has a plurality of first sides. An extension line of at least one of the first sides divides the second region into a first part and a second part. The method also includes the following steps: (b) forming a first electrode layer on the first region and the second region, and (c) cutting the first mother substrate along the first sides of the first region.