H01Q1/40

FLEXIBLE PRINTED CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME

A flexible printed circuit board (FPCB) assembly includes an electrically conductive layer configured to transmit a signal, a dielectric layer provided on the electrically conductive layer, a ground layer provided on the dielectric layer, and an auxiliary metal layer provided on or under the ground layer, and connecting a plurality of regions of the ground layer to each other, where the electrically conductive layer, the dielectric layer, the ground layer, and the auxiliary metal layer are flexible.

WEARABLE ANTENNA AND WEARABLE DEVICE
20220359979 · 2022-11-10 ·

A wearable device includes a wearable body that in use is worn on or proximate a skin of a wearer and a wearable antenna embedded in the wearable body and insulated from the wearable body. The wearable antenna includes a microwave dielectric substrate having a first major surface, a second major surface opposed to the first major surface, and a relative permittivity of at least 90. An electrically conductive patch is disposed on the first major surface, a feed line is connected to a feed point of the electrically conductive patch, and an electrically conductive ground plane is disposed on a far side of the second major surface relative to the first major surface.

WEARABLE ANTENNA AND WEARABLE DEVICE
20220359979 · 2022-11-10 ·

A wearable device includes a wearable body that in use is worn on or proximate a skin of a wearer and a wearable antenna embedded in the wearable body and insulated from the wearable body. The wearable antenna includes a microwave dielectric substrate having a first major surface, a second major surface opposed to the first major surface, and a relative permittivity of at least 90. An electrically conductive patch is disposed on the first major surface, a feed line is connected to a feed point of the electrically conductive patch, and an electrically conductive ground plane is disposed on a far side of the second major surface relative to the first major surface.

Package structure and method of manufacturing the same

A package structure includes a first RDL structure, a die, an encapsulant, a film, a TIV and a second RDL structure. The die is located over the first RDL structure. The encapsulant laterally encapsulates sidewalls of the die. The film is disposed between the die and the first RDL structure, and between the encapsulant and the first RDL structure. The TIV penetrates through the encapsulant and the film to connect to the first RDL structure. The second RDL structure is disposed on the die, the TIV and the encapsulant and electrically connected to die and the TIV.

Antenna device and manufacturing method thereof

An example antenna device may includes a base member, an antenna that is attached to the base member, and a cover member that is attached to surround at least a part of the base member and at least a part of the antenna. A first part of the base member that is attached to the cover member has a melting temperature equal to or lower than that of the cover member. A second part of the base member to which the antenna is attached has a higher melting temperature than the cover member.

Antenna device and manufacturing method thereof

An example antenna device may includes a base member, an antenna that is attached to the base member, and a cover member that is attached to surround at least a part of the base member and at least a part of the antenna. A first part of the base member that is attached to the cover member has a melting temperature equal to or lower than that of the cover member. A second part of the base member to which the antenna is attached has a higher melting temperature than the cover member.

Antenna floor tile for a raised floor system

An antenna floor tile for a raised floor system comprises a frame; an insert supported by the frame, the insert including a top surface; a recess disposed below the top surface; an antenna attached to the insert within the recess; and a protective layer disposed over the antenna.

Antenna floor tile for a raised floor system

An antenna floor tile for a raised floor system comprises a frame; an insert supported by the frame, the insert including a top surface; a recess disposed below the top surface; an antenna attached to the insert within the recess; and a protective layer disposed over the antenna.

APPARATUS AND METHODS FOR GEOLOCATING AN INDIVIDUAL WITH RESPECT TO A PERIMETER

An improved wearable locator has an ultra-low power RF transceiver, GPS receiver, cellular network RF transceiver, processor, programmable non-volatile memory, LCD display, accelerometer and rechargeable battery. To ensure that the locator is within a perimeter, it can cooperate with a subordinate unit that includes an ultra-low power RF transceiver, processor, power supply, DC charging output, rechargeable battery, visual, audible and tactile enunciators and pushbutton, and can be plugged into an outlet or be unplugged and be mobile. Other wireless units can be used to define a perimeter.

APPARATUS AND METHODS FOR GEOLOCATING AN INDIVIDUAL WITH RESPECT TO A PERIMETER

An improved wearable locator has an ultra-low power RF transceiver, GPS receiver, cellular network RF transceiver, processor, programmable non-volatile memory, LCD display, accelerometer and rechargeable battery. To ensure that the locator is within a perimeter, it can cooperate with a subordinate unit that includes an ultra-low power RF transceiver, processor, power supply, DC charging output, rechargeable battery, visual, audible and tactile enunciators and pushbutton, and can be plugged into an outlet or be unplugged and be mobile. Other wireless units can be used to define a perimeter.