A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

An antenna radiation module for assembling to an antenna inlay for a component carrier or to a component carrier. The module includes a dielectric layer structure and an antenna radiation layer structure. The antenna radiation layer structure is embedded in the first dielectric layer structure. Further, an antenna inlay, a component carrier, and a manufacturing method are described.

An antenna radiation module for assembling to an antenna inlay for a component carrier or to a component carrier. The module includes a dielectric layer structure and an antenna radiation layer structure. The antenna radiation layer structure is embedded in the first dielectric layer structure. Further, an antenna inlay, a component carrier, and a manufacturing method are described.

An RFID tag is provided that has reduced size while a decrease in communication distance is prevented. The RFID tag includes an inductor element having a coiled antenna built in a substrate and an RFIC element mounted on a mounting surface of the substrate and electrically connected to the coiled antenna. The coiled antenna is disposed such that a winding axis becomes parallel to or inclined with respect to the mounting surface of the substrate. The area of the RFIC element viewed in a direction orthogonal to the mounting surface of the substrate is larger than opening area of the coiled antenna viewed in winding axis direction of the coiled antenna. The RFIC element is disposed without overlapping at least a portion of opening region of the coiled antenna when viewed in winding axis direction of the coiled antenna.

An example electronic device includes an antenna; a switching regulator; a communication chip including an amplifier, a first linear regulator operably connected to the amplifier and the switching regulator and configured to be supplied with a first voltage from the switching regulator, and a second linear regulator operably connected to the amplifier and the switching regulator and configured to be supplied with a second voltage higher than the first voltage from the switching regulator, the communication chip configured to transmit a radio-frequency signal outside of the electronic device through the antenna; and a control circuit. The control circuit is configured to produce an envelope of an input signal input to the amplifier in connection with the radio-frequency signal and to provide the produced envelope to at least one of the first linear regulator or the second linear regulator. The first linear regulator is configured to provide a third voltage corresponding to the envelope to the amplifier using the first voltage based on the envelope having a voltage in a first range. The second linear regulator is configured to provide a fourth voltage higher than the third voltage to the amplifier using the second voltage based on the voltage of the envelope being in a second range including values larger than values included in the first range.

An example electronic device includes an antenna; a switching regulator; a communication chip including an amplifier, a first linear regulator operably connected to the amplifier and the switching regulator and configured to be supplied with a first voltage from the switching regulator, and a second linear regulator operably connected to the amplifier and the switching regulator and configured to be supplied with a second voltage higher than the first voltage from the switching regulator, the communication chip configured to transmit a radio-frequency signal outside of the electronic device through the antenna; and a control circuit. The control circuit is configured to produce an envelope of an input signal input to the amplifier in connection with the radio-frequency signal and to provide the produced envelope to at least one of the first linear regulator or the second linear regulator. The first linear regulator is configured to provide a third voltage corresponding to the envelope to the amplifier using the first voltage based on the envelope having a voltage in a first range. The second linear regulator is configured to provide a fourth voltage higher than the third voltage to the amplifier using the second voltage based on the voltage of the envelope being in a second range including values larger than values included in the first range.

In an antenna element, a planar ground conductor layer on an insulation substrate is connected to ground. A radiation conductor layer radiates and/or receives high-frequency signals. The radiation conductor layer is in or on the insulation substrate and above the planar ground conductor layer. A lower principal surface of the radiation conductor layer overlaps an upper principal surface of the planar ground conductor layer as viewed in an up-down direction. The ground conductor is in the insulation substrate and connected to the ground potential. An upper end of the ground conductor is above the radiation conductor layer. The ground conductor layer is spaced away from the radiation conductor layer as viewed in the up-down direction. Only a conductor through which the high-frequency signals are transmitted and a conductor connected to the ground potential are between the ground conductor and the radiation conductor layer.

A stacked patch antenna array includes: a conductive ground plane configured to connect to a plurality of electrical transmission lines for transmitting and/or receiving electrical signals; a driven layer adjacent to the conductive ground plane formed of a dielectric material and comprising a plurality of first resonant circular patches, each electrically connecting to a respective electrical transmission line such that a received electrical signal excites and generates an electromagnetic signal and/or a received electromagnetic signal excites and generates an electrical signal; an electrically insulating spacer adjacent to the driven layer; and a coupled layer adjacent to the electrically insulating spacer formed of a dielectric material and comprising a plurality of second resonant circular patches which are symmetrically positioned with respect to the first circular resonant patches of the driven layer and excited by the electromagnetic waves generated by the first resonant circular patches, wherein the electrically insulating spacer electrically separates the driven layer and the coupled layer having a thickness such that the resonances of the first and second resonant circular patches constructively combine.

The present invention relates to an RFID label comprising an RFID tag which tag comprises an RFID antenna and an IC, which IC is attached onto the antenna such that the antenna and the IC forms the RFID tag. The inventive label further comprising an elongated substrate with a first surface and a second surface, wherein the first surface is siliconized, and the second surface is carrying the RFID tag, and a sticky adhesive layer which is arranged onto the second surface of the substrate and over the RFID tag.

A radar sensing system for a vehicle includes a radar sensor disposed at the vehicle so as to sense exterior of the vehicle. The radar sensor includes a plurality of transmitters that transmit radio signals and a plurality of receivers that receive radio signals. The received radio signals are transmitted radio signals that are reflected from an object. A processor is operable to process an output of the receivers. The radar sensor includes a printed circuit board having circuitry disposed thereat. The radar sensor includes a radome. At least some of the antennas are embedded or encapsulated in the radome.