A roof antenna for a vehicle has a cover that is connected to a baseplate via a latching unit. The latching unit comprises latching hooks that releasably engage behind elastic latching lugs.

Disclosed antenna unit includes first substrate and second substrate opposite to each other, phase shifting units and driver circuit. Region facing the first substrate and the second substrate form phase shifting region. In first direction, the first substrate formed with first step region, and used for connecting radio-frequency signal terminal; in second direction, the second substrate formed with second step region, and included angle between the first direction and the second direction greater than or equal to 0° and smaller than 180°. At least part of the first step region does not overlap at least part of the second step region. Phase shifting units used for radiating radio-frequency signal and distributed in phase shifting region, each phase shifting unit. At least part of the driver circuit disposed in the second step region and the driver circuit electrically connected to each phase shifting unit to adjust radio-frequency signal.

An antenna device according to an embodiment includes a dielectric layer including a high transmittance area and a low transmittance area, and an antenna unit disposed on the dielectric layer. The antenna unit includes a radiator disposed on the high transmittance area of the dielectric layer and having a mesh structure, a signal pad disposed on the low transmittance area of the dielectric layer and having a solid pattern structure, and an impedance matching pattern connecting the radiator and the signal pad on the low transmittance area of the dielectric layer. The impedance matching pattern has a larger width than that of the signal pad and has a solid pattern structure.

The present invention relates to an antenna assembly. The antenna assembly comprises a feed board, a backplane, and a calibration board. A plurality of radiating elements are mounted on the feed board and extend forwardly from the feed board. The feed board is mounted on a first major surface of the backplane, and the calibration board is mounted on a second major surface of the backplane opposite the first major surface. The antenna assembly further includes a conductive structure, which extends through openings in at least two of the feed board, the backplane and the calibration board so as to electrically connect a first transmission line on the calibration board with a second transmission line on the feed board. The antenna assembly according to embodiments of the present invention can also achieve high integration and miniaturization of the overall antenna construction. Further, the present invention relates to a base station antenna comprises an antenna assembly.

The present invention relates to an antenna assembly. The antenna assembly comprises a feed board, a backplane, and a calibration board. A plurality of radiating elements are mounted on the feed board and extend forwardly from the feed board. The feed board is mounted on a first major surface of the backplane, and the calibration board is mounted on a second major surface of the backplane opposite the first major surface. The antenna assembly further includes a conductive structure, which extends through openings in at least two of the feed board, the backplane and the calibration board so as to electrically connect a first transmission line on the calibration board with a second transmission line on the feed board. The antenna assembly according to embodiments of the present invention can also achieve high integration and miniaturization of the overall antenna construction. Further, the present invention relates to a base station antenna comprises an antenna assembly.

The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed and then flow downward along wave-pattern flow paths having zigzag shapes, thereby providing an advantage of improving heat dissipation performance without increasing a size thereof.

The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed and then flow downward along wave-pattern flow paths having zigzag shapes, thereby providing an advantage of improving heat dissipation performance without increasing a size thereof.

Disclosed are photo-curable compositions and processes to produce a 3D high-frequency dielectric material for use as an insulator in a circuit such as, for example, a high-performance RF component such as, for example, an antenna for electromagnetic transmission, a filter, a transmission line, or a high frequency interconnect. The high frequency circuit structures have a very low dielectric loss at operating frequencies (1-60 GHz).

Disclosed are photo-curable compositions and processes to produce a 3D high-frequency dielectric material for use as an insulator in a circuit such as, for example, a high-performance RF component such as, for example, an antenna for electromagnetic transmission, a filter, a transmission line, or a high frequency interconnect. The high frequency circuit structures have a very low dielectric loss at operating frequencies (1-60 GHz).

In one embodiment of the present disclosure, an antenna apparatus includes a housing assembly including a radome portion and a lower enclosure portion, wherein the radome portion and lower enclosure portion are couplable to form an inner compartment for housing antenna components of the antenna assembly, an antenna stack assembly disposed within the inner compartment, wherein the antenna stack assembly generates heat when in operation, and a heat transfer system within the inner compartment configured to facilitate the flow of heat toward the radome portion.