A semiconductor package having a thinner shape and including an antenna is provided. A semiconductor package comprises a first substrate, a second substrate on the first substrate and including a first face facing the first substrate and a second face opposite to the first face, a pillar extending from the second face of the second substrate to the first substrate, and a first semiconductor chip on the second face of the second substrate and connected to the pillar. The second substrate may include an antenna pattern, and the antenna pattern may be connected to the first semiconductor chip, and may be on the second face of the second substrate such that the antenna pattern is isolated from direct contact with the first semiconductor chip.

A semiconductor package having a thinner shape and including an antenna is provided. A semiconductor package comprises a first substrate, a second substrate on the first substrate and including a first face facing the first substrate and a second face opposite to the first face, a pillar extending from the second face of the second substrate to the first substrate, and a first semiconductor chip on the second face of the second substrate and connected to the pillar. The second substrate may include an antenna pattern, and the antenna pattern may be connected to the first semiconductor chip, and may be on the second face of the second substrate such that the antenna pattern is isolated from direct contact with the first semiconductor chip.

Embodiments provide mobile device comprising a body frame; processing circuitry affixed to the body frame; a first antenna and a second antenna arranged adjacent to each other in the body frame, the first antenna and the second antenna electrically coupled to the processing circuitry to provide radiation, wherein the first antenna and the second antenna share a common ground defined by the body frame, wherein the first antenna is configured to provide radiation of a first polarization, and wherein the second antenna is configured to provide radiation of a second polarization substantially orthogonal to the first polarization to provide a signal isolation between the first antenna and the second antenna.

Embodiments provide mobile device comprising a body frame; processing circuitry affixed to the body frame; a first antenna and a second antenna arranged adjacent to each other in the body frame, the first antenna and the second antenna electrically coupled to the processing circuitry to provide radiation, wherein the first antenna and the second antenna share a common ground defined by the body frame, wherein the first antenna is configured to provide radiation of a first polarization, and wherein the second antenna is configured to provide radiation of a second polarization substantially orthogonal to the first polarization to provide a signal isolation between the first antenna and the second antenna.

In an antenna element, a planar ground conductor layer on an insulation substrate is connected to ground. A radiation conductor layer radiates and/or receives high-frequency signals. The radiation conductor layer is in or on the insulation substrate and above the planar ground conductor layer. A lower principal surface of the radiation conductor layer overlaps an upper principal surface of the planar ground conductor layer as viewed in an up-down direction. The ground conductor is in the insulation substrate and connected to the ground potential. An upper end of the ground conductor is above the radiation conductor layer. The ground conductor layer is spaced away from the radiation conductor layer as viewed in the up-down direction. Only a conductor through which the high-frequency signals are transmitted and a conductor connected to the ground potential are between the ground conductor and the radiation conductor layer.

In an antenna element, a planar ground conductor layer on an insulation substrate is connected to ground. A radiation conductor layer radiates and/or receives high-frequency signals. The radiation conductor layer is in or on the insulation substrate and above the planar ground conductor layer. A lower principal surface of the radiation conductor layer overlaps an upper principal surface of the planar ground conductor layer as viewed in an up-down direction. The ground conductor is in the insulation substrate and connected to the ground potential. An upper end of the ground conductor is above the radiation conductor layer. The ground conductor layer is spaced away from the radiation conductor layer as viewed in the up-down direction. Only a conductor through which the high-frequency signals are transmitted and a conductor connected to the ground potential are between the ground conductor and the radiation conductor layer.

The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.

The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.

An antenna structure includes a substrate, a radiator mounted at an upper portion of a front surface of the substrate, and a grounding element mounted at a lower portion of the front surface of the substrate. The radiator has a first radiating portion. A lower edge of the first radiating portion extends downward to form a second radiating portion. Two portions of a middle of the lower edge of the first radiating portion extend downward to form a third radiating portion and a feeding portion. A free end of the feeding portion is a feeding end. One side edge of the first radiating portion is recessed inward to form a recess. The grounding element has a first grounding portion and a second grounding portion. The first grounding portion and the second grounding portion are located to two sides of the feeding portion, respectively.

An antenna structure includes a substrate, a radiator mounted at an upper portion of a front surface of the substrate, and a grounding element mounted at a lower portion of the front surface of the substrate. The radiator has a first radiating portion. A lower edge of the first radiating portion extends downward to form a second radiating portion. Two portions of a middle of the lower edge of the first radiating portion extend downward to form a third radiating portion and a feeding portion. A free end of the feeding portion is a feeding end. One side edge of the first radiating portion is recessed inward to form a recess. The grounding element has a first grounding portion and a second grounding portion. The first grounding portion and the second grounding portion are located to two sides of the feeding portion, respectively.