A semiconductor package includes: a lower package; and an upper package stacked on the lower package, wherein the lower package includes: a first redistribution structure; a semiconductor chip mounted on the first redistribution structure; a first molding layer surrounding the semiconductor chip on the first redistribution structure; and first vertical connection conductors disposed on the first redistribution structure and vertically passing through the first molding layer, wherein the upper package includes: a second molding layer disposed on the lower package; second vertical connection conductors vertically passing through the second molding layer and electrically connected to the first vertical connection conductors; and an antenna structure disposed on the second molding layer.

A semiconductor package includes: a lower package; and an upper package stacked on the lower package, wherein the lower package includes: a first redistribution structure; a semiconductor chip mounted on the first redistribution structure; a first molding layer surrounding the semiconductor chip on the first redistribution structure; and first vertical connection conductors disposed on the first redistribution structure and vertically passing through the first molding layer, wherein the upper package includes: a second molding layer disposed on the lower package; second vertical connection conductors vertically passing through the second molding layer and electrically connected to the first vertical connection conductors; and an antenna structure disposed on the second molding layer.

A Yagi-Uda monopolar antenna configured to be mounted on the conductive surface of a vehicle, especially an aircraft. The antenna comprises: a radiating element, taking the form of a conductive plate, for example one having the shape of a disc, which plate is equipped with a return conductor; a reflecting element; and at least one directing element taking the form of a monopole that is folded on itself. The various elements are mounted on a substantially planar surface such as the skin of the fuselage of an aircraft. The antenna simultaneously has a wide operating band, a good compactness and a good directivity. It may especially serve as joint antenna for a plurality of air-ground communication systems of an aircraft.

A Yagi-Uda monopolar antenna configured to be mounted on the conductive surface of a vehicle, especially an aircraft. The antenna comprises: a radiating element, taking the form of a conductive plate, for example one having the shape of a disc, which plate is equipped with a return conductor; a reflecting element; and at least one directing element taking the form of a monopole that is folded on itself. The various elements are mounted on a substantially planar surface such as the skin of the fuselage of an aircraft. The antenna simultaneously has a wide operating band, a good compactness and a good directivity. It may especially serve as joint antenna for a plurality of air-ground communication systems of an aircraft.

The disclosure concerns an antenna assembly having a substrate with an antenna radiating element and a ground conductor disposed on the substrate, the ground conductor further characterized by a plurality of ground resonators, wherein a length associated with each of the ground resonators increases as the ground resonators are distanced from the antenna radiating element. Additionally, a coaxial cable is routed around the antenna assembly for configuring the coaxial cable as an additional ground resonator associated with the antenna assembly. The resulting antenna provides wide band performance between 700 MHz and 2700 MHz with improved efficiency compared with conventional antennas.

The disclosure concerns an antenna assembly having a substrate with an antenna radiating element and a ground conductor disposed on the substrate, the ground conductor further characterized by a plurality of ground resonators, wherein a length associated with each of the ground resonators increases as the ground resonators are distanced from the antenna radiating element. Additionally, a coaxial cable is routed around the antenna assembly for configuring the coaxial cable as an additional ground resonator associated with the antenna assembly. The resulting antenna provides wide band performance between 700 MHz and 2700 MHz with improved efficiency compared with conventional antennas.

Reflectarray antenna elements, reflectarrays, and a method of operating an antenna element are described. A reflectarray antenna element includes a patch (14) of electrically conductive material for reflecting an electromagnetic field; a dielectric substrate (12) providing an RF ground; first and second phase control lines (16, 18) of electrically conductive material arranged to interact with electromagnetic radiation with a first polarisation; a first binary switching device (24) having an ON or OFF state disposed between the patch and ground, and configured to selectively electrically couple the patch to ground via the first phase control line; a second binary switching device (26) having an ON or OFF state disposed between the patch and ground, and configured to selectively electrically couple the patch to ground via the second phase control line; a single DC bias input electrically coupled to the patch and configurable to different discrete voltage levels for selectively controlling the states of the switching devices. Selective operation of the first and second binary switching devices occurs by means of the DC bias input provides phase control of electromagnetic radiation dependent on the state of the switching devices. Described is a phase control mechanism of unit cells to enable a reconfigurable/smart reflectarray platform.

Reflectarray antenna elements, reflectarrays, and a method of operating an antenna element are described. A reflectarray antenna element includes a patch (14) of electrically conductive material for reflecting an electromagnetic field; a dielectric substrate (12) providing an RF ground; first and second phase control lines (16, 18) of electrically conductive material arranged to interact with electromagnetic radiation with a first polarisation; a first binary switching device (24) having an ON or OFF state disposed between the patch and ground, and configured to selectively electrically couple the patch to ground via the first phase control line; a second binary switching device (26) having an ON or OFF state disposed between the patch and ground, and configured to selectively electrically couple the patch to ground via the second phase control line; a single DC bias input electrically coupled to the patch and configurable to different discrete voltage levels for selectively controlling the states of the switching devices. Selective operation of the first and second binary switching devices occurs by means of the DC bias input provides phase control of electromagnetic radiation dependent on the state of the switching devices. Described is a phase control mechanism of unit cells to enable a reconfigurable/smart reflectarray platform.

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.