An antenna structure includes a metal shell including a grounded middle frame provided with a main body and sides bent and extending from two sides of the main body and a radiating part serving as an antenna radiating body. The radiating part forms an insulation filled gap with the middle frame. Two ends of the radiating part are arranged opposed to each other for forming an insulation filled breaking joint. A circuit board is arranged below the metal shell, and one side of the circuit board adjacent to the radiating part forms a clearance zone between the circuit board and the radiating part. The antenna further includes a feeding point, at least one ground point, and a tuning circuit. The feeding point is close to the breaking joint, and the ground point includes a first ground point and a second ground point.

An antenna structure includes a metal shell including a grounded middle frame provided with a main body and sides bent and extending from two sides of the main body and a radiating part serving as an antenna radiating body. The radiating part forms an insulation filled gap with the middle frame. Two ends of the radiating part are arranged opposed to each other for forming an insulation filled breaking joint. A circuit board is arranged below the metal shell, and one side of the circuit board adjacent to the radiating part forms a clearance zone between the circuit board and the radiating part. The antenna further includes a feeding point, at least one ground point, and a tuning circuit. The feeding point is close to the breaking joint, and the ground point includes a first ground point and a second ground point.

An antenna including a substrate; top and bottom grounded conductive layers formed on respective larger faces of the substrate; an antenna feed coupled to at least one of the top and bottom grounded conductive layers, and configured to feed radio signals to the antenna; and at least one conductive wall formed to the top and bottom grounded conductive layers, and configured to form a short-circuit between the top and bottom grounded conductive layers, wherein the substrate and the at least one conductive wall forms a plurality of antenna cavities configured to operate at specific, respective frequencies, and each of the plurality of antenna cavities comprises at least two sides not covered by a conductive layer.

An antenna including a substrate; top and bottom grounded conductive layers formed on respective larger faces of the substrate; an antenna feed coupled to at least one of the top and bottom grounded conductive layers, and configured to feed radio signals to the antenna; and at least one conductive wall formed to the top and bottom grounded conductive layers, and configured to form a short-circuit between the top and bottom grounded conductive layers, wherein the substrate and the at least one conductive wall forms a plurality of antenna cavities configured to operate at specific, respective frequencies, and each of the plurality of antenna cavities comprises at least two sides not covered by a conductive layer.

Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.

Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.

An antenna device according to an embodiment of the present invention includes a dielectric layer, a radiation pattern disposed on a top surface of the dielectric layer, a signal pad electrically connected to the radiation pattern, and a ground pad spaced apart from the signal pad and having an isolation space. A length of the isolation space is greater than a length of the signal pad.

An antenna device according to an embodiment of the present invention includes a dielectric layer, a radiation pattern disposed on a top surface of the dielectric layer, a signal pad electrically connected to the radiation pattern, and a ground pad spaced apart from the signal pad and having an isolation space. A length of the isolation space is greater than a length of the signal pad.

An antenna device according to an embodiment of the present invention includes a substrate layer, an antenna unit formed on a top surface of the substrate layer, a circuit wiring disposed on the top surface of the substrate layer and directly connected to the antenna unit, a stress compensation layer covering the circuit wiring on the top surface of the substrate layer and having a thickness greater than a thickness of the substrate layer, a first dielectric layer formed on a bottom surface of the substrate layer to overlap the circuit wiring in a planar view, and a first ground layer overlapping the circuit wiring in the planar view with the first dielectric layer or the stress compensation layer interposed therebetween.

An antenna device according to an embodiment of the present invention includes a substrate layer, an antenna unit formed on a top surface of the substrate layer, a circuit wiring disposed on the top surface of the substrate layer and directly connected to the antenna unit, a stress compensation layer covering the circuit wiring on the top surface of the substrate layer and having a thickness greater than a thickness of the substrate layer, a first dielectric layer formed on a bottom surface of the substrate layer to overlap the circuit wiring in a planar view, and a first ground layer overlapping the circuit wiring in the planar view with the first dielectric layer or the stress compensation layer interposed therebetween.