According to one embodiment, disclosed is an antenna comprising: a first waveguide having a first signal transmission path; a second waveguide connected to the first waveguide; and an antenna unit connected to the second waveguide and having a first opening, wherein the second waveguide comprises a first separator for separating the signal transmission path, and the antenna unit comprises a first antenna unit and a second antenna unit.

According to one embodiment, disclosed is an antenna comprising: a first waveguide having a first signal transmission path; a second waveguide connected to the first waveguide; and an antenna unit connected to the second waveguide and having a first opening, wherein the second waveguide comprises a first separator for separating the signal transmission path, and the antenna unit comprises a first antenna unit and a second antenna unit.

Disclosed are embodiments of a microelectronics package that includes: first and second substrates (each having first and second sides); a chip; and a multi-element antenna connected to the chip. The chip is mounted on the first side of the first substrate. A first antenna element of the antenna is on the second side of the first substrate and electrically connected to the chip. The first side of the second substrate is adhered to the second side of the first substrate (i.e., covering the first antenna element). A second antenna element of the antenna is on the second side of the second substrate overlaying the first antenna element and physically separated therefrom by at least one ultra-low-K dielectric region within the first side of the second substrate and/or the second side of the first substrate. Optionally, the package includes multiple chips and/or multiple antennas. Also disclosed are associated method embodiments.

Disclosed are embodiments of a microelectronics package that includes: first and second substrates (each having first and second sides); a chip; and a multi-element antenna connected to the chip. The chip is mounted on the first side of the first substrate. A first antenna element of the antenna is on the second side of the first substrate and electrically connected to the chip. The first side of the second substrate is adhered to the second side of the first substrate (i.e., covering the first antenna element). A second antenna element of the antenna is on the second side of the second substrate overlaying the first antenna element and physically separated therefrom by at least one ultra-low-K dielectric region within the first side of the second substrate and/or the second side of the first substrate. Optionally, the package includes multiple chips and/or multiple antennas. Also disclosed are associated method embodiments.

A system includes a radio frequency (RF) connector terminal that is configured to connect to an antenna, and a RF transmitter that transmits RF power to the RF connector terminal. The system further includes a power measurement unit that measures, as a first power measurement, first RF power of the RF transmitter power that is reflected via the RF connector terminal, and a controller that causes a transmission path discontinuity between the RF transmitter and the RF connector terminal. The power measurement unit further measures, as a second power measurement, second RF power of the RF transmitter power that is reflected from the discontinuity. The controller further determines if a first antenna is connected to the RF connector terminal based on the first and second power measurements.

A system includes a radio frequency (RF) connector terminal that is configured to connect to an antenna, and a RF transmitter that transmits RF power to the RF connector terminal. The system further includes a power measurement unit that measures, as a first power measurement, first RF power of the RF transmitter power that is reflected via the RF connector terminal, and a controller that causes a transmission path discontinuity between the RF transmitter and the RF connector terminal. The power measurement unit further measures, as a second power measurement, second RF power of the RF transmitter power that is reflected from the discontinuity. The controller further determines if a first antenna is connected to the RF connector terminal based on the first and second power measurements.

Designs and techniques for manufacturing microelectronic antenna tuners are provided. An example microelectronic antenna system includes a radio frequency integrated circuit comprising a plurality of radio frequency signal ports disposed in a first area, a plurality of tuning devices disposed in a second area of the radio frequency integrated circuit, at least one antenna element disposed on a substrate coupled to the radio frequency integrated circuit, and at least one feedline disposed in the substrate and configured to communicatively couple the at least one antenna element, at least one of the plurality of tuning devices, and one of the plurality of radio frequency signal ports.

Designs and techniques for manufacturing microelectronic antenna tuners are provided. An example microelectronic antenna system includes a radio frequency integrated circuit comprising a plurality of radio frequency signal ports disposed in a first area, a plurality of tuning devices disposed in a second area of the radio frequency integrated circuit, at least one antenna element disposed on a substrate coupled to the radio frequency integrated circuit, and at least one feedline disposed in the substrate and configured to communicatively couple the at least one antenna element, at least one of the plurality of tuning devices, and one of the plurality of radio frequency signal ports.

An electronic device includes a first communication circuit including a first transmission port which outputs a transmission signal of first communication and a first reception port which receives a reception signal of the first communication, a second communication circuit including a second transmission port which outputs a transmission signal of second communication and a second reception port which receives a reception signal of the second communication, a first branching filter connected to a first antenna and the first communication circuit, a second branching filter connected to a second antenna and the first communication circuit, a first switch connected to the second communication circuit through the second transmission port and the second reception port and connected to switch between the first branching filter, the second branching filter, and a third antenna, and a fourth antenna connected to the second communication circuit through the second reception port.

An electronic device includes a first communication circuit including a first transmission port which outputs a transmission signal of first communication and a first reception port which receives a reception signal of the first communication, a second communication circuit including a second transmission port which outputs a transmission signal of second communication and a second reception port which receives a reception signal of the second communication, a first branching filter connected to a first antenna and the first communication circuit, a second branching filter connected to a second antenna and the first communication circuit, a first switch connected to the second communication circuit through the second transmission port and the second reception port and connected to switch between the first branching filter, the second branching filter, and a third antenna, and a fourth antenna connected to the second communication circuit through the second reception port.