To suppress downward radiation of electromagnetic waves from an antenna unit.

An antenna unit to be used by being installed so as to face a window glass for a building, the antenna unit comprising a plurality of array antennas, wherein each of the plurality of array antennas has a plurality of radiating elements and at least one conductor situated on an interior side relative to the plurality of radiating elements, and where the effective wavelength of the plurality of array antennas at the operation frequency is λ, and an integer of 0 or more is n, the distance from the center of the upper radiating element among the plurality of radiating elements to the upper edge of the conductor in the up-and-down direction is (0.5+n)λ±0.22λ, as seen in a plan view of the antenna unit.

Disclosed is an electronic device. The electronic device includes: a housing including a side wall at least partially configured as an antenna, a first printed circuit board disposed in the housing and including at least one ground part, a second printed circuit board, wherein the second printed circuit board includes an extension part extending along the side wall of the housing, a first part extending from one end of the extension part and connected to the first printed circuit board, and a second part extending from an opposite end of the extension part and electrically connected to the at least one ground part, at least one component disposed on the extension part, and a processor disposed on the first printed circuit board, and operatively connected to the at least one component through the first part of the second printed circuit board.

A multi-input multi-output (MIMO) antenna system includes a metal plate, a background scanning antenna, a plurality of working antennas, and an isolator module. The isolator module is mountable on the metal plate and includes a plurality of isolators that are in a ring configuration to form an isolated space therein, so that the background scanning antenna can be located in the isolated space and a plurality of working antennas are located outside of the isolated space, thereby ensuring good isolation of the background scanning antenna from the working antennas by the design of the isolator module.

There is disclosed an antenna system comprising: i) first and second antennas, the second antenna being disposed laterally from the first along a longitudinal axis, and ii) an isolation structure disposed between the first and second antennas. The isolation structure comprises a first resonator element having a first arm with upper and lower ends, the first arm connected to ground at its lower end, and a lateral second arm connected to the upper end of the first arm. At least a portion of the first resonator element is disposed adjacent to a portion of the first antenna such that the first resonator element is strongly coupled to the first antenna.

A multiple-antenna device including a printed circuit board, a first antenna formed into a first corner of the printed circuit board, a second antenna formed into a second corner of the printed circuit board, and a dual-band decoupler formed in the printed circuit board between the first antenna and the second antenna. The multiple-antenna device includes WLAN circuitry located on the printed circuit board between the first antenna and the decoupler. The first and second antennas have polarizations orthogonal to each other.

Systems and methods for extracting polarized sub-signals from a dual-polarized signal includes isolating the polarized sub-signals using one or more filters. When a single filter is used to derive a first sub-signal, analog interference cancellation may be used to derive the second sub-signal. When two filters are used, the first and second sub-signals may each be derived using a corresponding filter.

A socket antenna module includes a patch antenna, a ground plane, and a shield can, the ground plane having a first side and second side, and the patch antenna being coupled to the first side, whereas the shield can is coupled to the second side opposite the first side. In another embodiment, a socket antenna module and transceiver assembly is disclosed that integrates the socket antenna module with a conventional transceiver.

A device includes a radiating system comprising: at least one of a radiation booster or a radiating element; a ground plane layer having at least two connecting points; a radiofrequency system electrically connected to the radiation booster and/or the radiating element and comprising at least one matching network; at least one external port electrically connected to the radiofrequency system; and at least first and second electrically conductive elements each comprising one or more components and being adapted to electrically connect first and second connecting points, respectively, of the at least two connecting points to an electrically conductive body of an apparatus at a distance from the ground plane layer, the distance being less than λ/15, wherein λ is a free-space wavelength at a lowest frequency of operation of the radiating system.

Designs and techniques to enhance power-efficiency and incorporate new features in millimeter-wave MIMO transceivers are described. A new mechanism for built-in dual-band, per-element self-interference cancellation (SIC) is introduced to enable multi-antenna frequency-division duplex (FDD) and full-duplex (FD) operation. Additionally, several innovative circuit concepts are introduced, including low-loss wideband antenna interface design, dual-band power combining PA, dual-band RF-SIC design, and bi-directional MIMO signal.

A semiconductor package includes a front redistribution structure having a first surface and a second surface, opposite to the first surface, a dielectric layer, an antenna substrate including a plurality of antenna members in the dielectric layer, a semiconductor chip having a connection pad connected to the plurality of antenna members, a conductive core structure having a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip, and a rear redistribution structure including a conductive cover layer exposing an upper portion of the antenna substrate and covering an upper portion of the semiconductor chip, and a conductive via connecting the conductive cover layer to the conductive core structure.