A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

The present invention provides a radio frequency module including: an interposer; a plurality of antenna element groups that include first electrodes and a second electrode and are configured such that the first electrodes are aligned in line shapes in at least a first direction on a first surface of the interposer; and meta material portions that are provided at the interposer and affect electromagnetic properties of the plurality of antenna elements. The meta material portions include electromagnetic band gap structures provided by forming predetermined geometric patterns near both sides of the first electrodes along at least the first direction. The radio frequency module can thus have a reduced size and a broad band/a high gain.

A semiconductor package includes a front redistribution structure having a first surface and a second surface, opposite to the first surface, a dielectric layer, an antenna substrate including a plurality of antenna members in the dielectric layer, a semiconductor chip having a connection pad connected to the plurality of antenna members, a conductive core structure having a first through-hole accommodating the antenna substrate and a second through-hole accommodating the semiconductor chip, and a rear redistribution structure including a conductive cover layer exposing an upper portion of the antenna substrate and covering an upper portion of the semiconductor chip, and a conductive via connecting the conductive cover layer to the conductive core structure.

An antenna device includes a circuit substrate, first and second radiators each including an open end, and a coupler to electromagnetically couple the first and second radiators, the antenna device being provided in a housing of an electronic apparatus. Shield cases each including a planar conductor portion parallel or substantially parallel to a first main surface are mounted on the circuit substrate, the first radiator, the second radiator, and the shield cases are located on a side of the first main surface of the circuit substrate, and the first radiator includes a portion overlapping a first region between the multiple shield cases in plan view of the circuit substrate.

An antenna assembly according to the present disclosure includes a dielectric substrate, and antenna elements configured as conductive patterns on the dielectric substrate to radiate radio signals. The antenna elements may include a first radiation structure and a second radiation structure. The first radiation structure includes a first conductive pattern electrically connected a first feeding portion, a second conductive pattern and a third conductive pattern electrically connected a ground. The second radiation structure includes a fourth conductive pattern electrically connected a second feeding portion and a fifth conductive pattern and a sixth conductive pattern electrically connected the ground. The first conductive pattern may be disposed between the second conductive pattern and the third conductive pattern.

A multi-band antenna includes a reflector, and a plurality of first radiating elements on the reflector. The plurality of first radiating elements are configured to radiate a first antenna beam(s) in a first frequency band responsive to at least one feed signal. A passive radiation-filtering element is provided, which extends proximate the first antenna beam(s). The passive radiation-filtering element includes at least one of a low-pass LC circuit, a band-pass LC circuit, and a high-pass LC circuit therein, which is configured to provide a lower frequency-dependent impedance to radiation within the first frequency band relative to radiation at frequencies outside the first frequency band. The passive radiation-filtering element may be configured as a multi-segment fence having capacitive and inductive elements therein, which are electrically coupled in series.

A system having a radiating element is disclosed. The radiating element may include a plurality of higher order floquet mode scattering (HOFS) layers including at least a lowest layer unit cell, a middle layer unit cell, and a highest layer unit cell. The radiating element may also include a stripline feed layer having a ground plane layer. The ground plane layer is configured in at least one of a non-equilateral triangular grid unit cell or an equilateral triangular grid., one or more horizontal and vertical polarization stripline feeds, one or more horizontal and vertical polarization ground plane slots, and one or more ground vias to create an evanescent waveguide for resonance free stripline to radiating element coupling. The radiating element may be dual-polarized aperture coupled with an active electronically scanned array (AESA) in a manner so as to enable the AESA to electronically steer a beam of radio waves to point in different directions without moving the AESA and radiate beams of radio waves at multiple frequencies simultaneously.

A sensor probe with reduced coupling between the various antenna elements and suppression of radio frequency interference. In one embodiment the sensor probe comprises a first antenna and a second antenna. A first and a second decoupling loop is electrically connected to one of the first and second antennas with current flow in opposite directions in the first and second decoupling loops. A third decoupling loop is electrically connected to another one of the first and second antennas and physically disposed between the first and second decoupling loops. Coupling between the first and second antennas is responsive to a location of the third decoupling loop relative to the first and second decoupling loops.

A non-invasive analyte sensor includes at least one transmit antenna and at least one receive antenna. A transmit circuit is electrically connectable to the at least one transmit antenna, where the transmit circuit is configured to generate a transmit signal in a radio or microwave frequency range of the electromagnetic spectrum. A receive circuit is electrically connectable to the at least one receive antenna. A trigger mechanism is associated with the non-invasive analyte sensor that triggers an analyte reading by the non-invasive analyte sensor.

A terminal device according to an embodiment of the present application includes a circuit board and a display module stacked on the front surface of the circuit board. A side surface of the display module facing the circuit board comprises a metal area covered with metal and a first radiation area without metal covering. The first radiation area is provided with an antenna electrically connected with an RF module of the circuit board. The circuit board is provided with a mounting opening corresponding to the antenna. A structure of the terminal device on the back surface of the circuit board is provided with a metal-free second radiation area corresponding to the antenna.