In a wireless communication network that operates according to a communication protocol that defines one or more first transmission modes that provide extended range communications as compared to one or second transmission modes defined by the communication protocol, a communication device generates a communication frame that includes information indicating that the one or more first transmission modes should not be used when transmitting in the wireless communication network. The communication device transmits the communication frame to instruct one or more other communication devices in the wireless communication network to not use the one or more first transmission modes when transmitting in the wireless communication network.

A fan-out package structure is disclosed. The fan-out package structure includes an antenna main body; a redistribution layer (RDL); and an antenna auxiliary body in the RDL. An antenna system is also disclosed. The antenna system includes: an antenna main body, arranged to provide a first resonance; and an antenna auxiliary body, arranged to provide a second resonance through parasitic coupling to the antenna main body; wherein a dimension of the antenna main body is greater than a dimension of the antenna auxiliary body. An associated semiconductor packaging method is also disclosed.

The present disclosure provides a system and methods for mitigating, or reducing, the intermodulation of an adaptive antenna array's radiating elements. A tunable element or tunable material, such as a phase change material or a state change material, may be used to increase linearity of the RF transmission properties. These phase or state change materials may modify a radiating element's electromagnetic response. In some embodiments, variable couplers may further be added to a system to reduce intermodulation. An adaptive antenna array using the techniques described herein may have all or some of the elements co-located.

The present disclosure provides a system and methods for mitigating, or reducing, the intermodulation of an adaptive antenna array's radiating elements. A tunable element or tunable material, such as a phase change material or a state change material, may be used to increase linearity of the RF transmission properties. These phase or state change materials may modify a radiating element's electromagnetic response. In some embodiments, variable couplers may further be added to a system to reduce intermodulation. An adaptive antenna array using the techniques described herein may have all or some of the elements co-located.

A compensation circuit reduces the negative effects of antenna-to-antenna coupling between proximately located antennas. The compensation circuit is coupled between first and second antenna ports. A first transmit/receive path extends from radio frequency (RF) circuitry to the first antenna port. A second transmit/receive path extends from the RF circuitry to the second antenna port. Antennas are coupled to each of the antenna ports. The compensation circuit includes negatively coupled first and second inductors, which are coupled in series between the first antenna port and the second antenna port. At least one shunt acoustic resonator is coupled between a fixed voltage node and a common node between the first and second inductors. In operation, the compensation circuit presents a negative capacitance between the first antenna port and the second antenna port over the first frequency range to reduce the effects of the antenna-antenna coupling.

An antenna radiates signals in Band41 whose center frequency is λ.sub.1 and Band42 whose center frequency is λ.sub.2. A medium substrate is used as a carrier of a top radiating element, a phase inversion unit, and a bottom radiating element; an end of the top radiating element is connected to an end of the phase inversion unit; the other end of the phase inversion unit is connected to an end of the bottom radiating element, a length of the phase inversion unit is 3λ.sub.2/2, and the length of the phase inversion unit is greater than λ.sub.1/2; and the phase inversion unit includes at least two current phase inversion points, a part between the at least two current phase inversion points does not produce radiation, and the top radiating element and the bottom radiating element horizontally radiate the signal in the Band41 and the signal in the Band42 omnidirectionally.

A multi-band antenna includes at least one structure usable at multiple frequency ranges. The structure includes at least two levels of detail, with one level of detail making up another level of detail. The levels of detail are composed of closed plane figures bounded by the same number of sides. An interconnection circuit links the multi-band antenna to an input/output connector and incorporates adaptation networks, filters or diplexers. Each of the closed plane figures is linked to at least one other closed plane figure to exchange electromagnetic power. For at least 75% of the closed plane figures, the region or area of contact, intersection, or interconnection between the closed plane figures is less than 50% of their perimeter or area. Not all of the closed plane figures have the same size, and the perimeter of the structure has a different number of sides than its constituent closed plane figures.

A multi-band antenna includes at least one structure usable at multiple frequency ranges. The structure includes at least two levels of detail, with one level of detail making up another level of detail. The levels of detail are composed of closed plane figures bounded by the same number of sides. An interconnection circuit links the multi-band antenna to an input/output connector and incorporates adaptation networks, filters or diplexers. Each of the closed plane figures is linked to at least one other closed plane figure to exchange electromagnetic power. For at least 75% of the closed plane figures, the region or area of contact, intersection, or interconnection between the closed plane figures is less than 50% of their perimeter or area. Not all of the closed plane figures have the same size, and the perimeter of the structure has a different number of sides than its constituent closed plane figures.

A printed circuit board (‘PCB’) including a substrate integrated waveguide (‘SIW’) formed using two ground planes representing the top and bottom walls of the waveguide, tightly pitched ground vias to act as two side walls and two back walls, and a pair of monopole antennas placed at each end of the SIW acting as signal feeding/receiving structures is disclosed. The waveguide dominant mode cut off frequency is determined by the spacing between the two side walls. Within each monopole antenna pair, the first monopole antenna operates at a first frequency while the second monopole antenna operates at another frequency. For each monopole antenna pair, the first monopole antenna and the second monopole antenna are located in the SIW at a distance from the back wall optimal for each operating frequency.

A printed circuit board (‘PCB’) including a substrate integrated waveguide (‘SIW’) formed using two ground planes representing the top and bottom walls of the waveguide, tightly pitched ground vias to act as two side walls and two back walls, and a pair of monopole antennas placed at each end of the SIW acting as signal feeding/receiving structures is disclosed. The waveguide dominant mode cut off frequency is determined by the spacing between the two side walls. Within each monopole antenna pair, the first monopole antenna operates at a first frequency while the second monopole antenna operates at another frequency. For each monopole antenna pair, the first monopole antenna and the second monopole antenna are located in the SIW at a distance from the back wall optimal for each operating frequency.