Patent classifications
H01Q5/40
Sub-reflector and feeding device for a dipole
An antenna element includes a reflector plate and a radiator comprising a balun device and a dipole device for operating in a first frequency band. The dipole device is connected to the reflector plate by the balun device. A distance from the dipole device to the reflector plate is more than ¼ of a wavelength at a central frequency of the first frequency band. The balun device comprises a short-circuit at a distance from the dipole device of 15 to 35 percent of said wavelength.
Sub-reflector and feeding device for a dipole
An antenna element includes a reflector plate and a radiator comprising a balun device and a dipole device for operating in a first frequency band. The dipole device is connected to the reflector plate by the balun device. A distance from the dipole device to the reflector plate is more than ¼ of a wavelength at a central frequency of the first frequency band. The balun device comprises a short-circuit at a distance from the dipole device of 15 to 35 percent of said wavelength.
Dual-polarized retrodirective array and multi-frequency antenna element
Systems, methods, and circuitries are disclosed for providing a retrodirective array. One example retrodirective array includes a plurality of dual-polarized antenna elements configured to receive a pilot signal having a first polarization and phase conjugation circuitry. The phase conjugation circuitry includes, for each of the plurality of antenna elements, a mixer configured to mix the pilot signal with an LO signal to generate a phase conjugated signal and excitation circuitry configured to generate an excitation signal for the antenna element to transmit the phase conjugated signal with a second polarization that is different from the first polarization.
Dual-polarized retrodirective array and multi-frequency antenna element
Systems, methods, and circuitries are disclosed for providing a retrodirective array. One example retrodirective array includes a plurality of dual-polarized antenna elements configured to receive a pilot signal having a first polarization and phase conjugation circuitry. The phase conjugation circuitry includes, for each of the plurality of antenna elements, a mixer configured to mix the pilot signal with an LO signal to generate a phase conjugated signal and excitation circuitry configured to generate an excitation signal for the antenna element to transmit the phase conjugated signal with a second polarization that is different from the first polarization.
COUPLING ANTENNA APPARATUS AND ELECTRONIC DEVICE
An antenna apparatus includes a feeding antenna inside an electronic device and one or more antenna elements, such as a floating metal antenna, disposed on a rear cover of the electronic device. The floating metal antenna and a feeding antenna inside the electronic device may form a coupling antenna structure. The feeding antenna may be an antenna fastened on an antenna support (which may be referred to as a support antenna). The feeding antenna may alternatively be a slot antenna formed by slitting on a metal middle frame of the electronic device. The antenna apparatus may be implemented in limited design space, thereby effectively saving antenna design space inside the electronic device. The antenna apparatus may generate excitation of a plurality of resonance modes, so that antenna bandwidth and radiation characteristics can be improved.
CHIP ANTENNA MODULE ARRAY AND CHIP ANTENNA MODULE
A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.
ANTENNA MODULE
An antenna module includes a grounding plane, a first high-frequency radiator, a second high-frequency radiator, and a low-frequency grounding component. The first high-frequency radiator includes a first feeding portion, a first grounding portion, and a first radiating portion. The first grounding portion is coupled to the grounding plane. The second high-frequency radiator includes a second feeding portion, a second grounding portion, and a second radiating portion. The second grounding portion is coupled to the grounding plane. The low-frequency grounding component located between the first and second high-frequency radiators. The low-frequency grounding component includes a third grounding portion which is coupled to the grounding plane, a first coupling portion, and a second coupling portion. The low-frequency grounding component extends from the third grounding portion and extends in a first direction and a second direction of a first axis respectively to form the first and second coupling portions.
ANTENNA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
Disclosed is an antenna module including a first antenna and a second antenna, the first antenna being configured to shield a first surface of the second antenna, shield at least some of a first side of the second antenna by using a first bending part downwardly bent from a first end of the first surface, shield at least some of a second side of the second antenna by using a second bending part downwardly bent from a second end of the first surface opposite to the first end of the first surface, have a first end coupled to a housing by fastening a first fastener to a first fastening hole elongated and formed in a first direction from one end of the first bending part, and have a second end coupled to the housing by fastening a second fastener to a second fastening hole elongated and formed in a second direction from one end of the second bending part.
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
A wiring board (10) includes a substrate (11) that is transparent, a wiring pattern region (20) disposed on the substrate (11) and having first-direction wiring lines (21), and a feeding unit (40) electrically connected to the first-direction wiring lines (21) of the wiring pattern region (20). Each first-direction wiring line (21) has a first region (26) positioned near the feeding unit (40) and a second region (27) that is a region other than the first region (26). A line width (W.sub.3) of the first-direction wiring line (21) in the first region (26) is larger than a line width (W.sub.1) of the first-direction wiring line (21) in the second region (27).
Multiband Patch Antenna
Examples relate to concepts for patch antennas and particular to a method for forming a multiband patch antenna. A multiband patch antenna may comprise a ground layer and an excitation layer, comprising a first excitation patch, a second excitation patch and a feeding patch, wherein the patch is arranged to excite the first excitation patch and the second excitation simultaneously.