An antenna structure includes a main radiator element, a parasitic radiator element, a feeder and at least one first high-impedance member. The parasitic radiator element is disposed in parallel with the main radiator element. The feeder is configured to electrically or electromagnetically couple the main radiator element. The at least one first high-impedance member directly contacts the parasitic radiator element and is configured to be electrically grounded.

The present invention provides a single-fed wideband circularly-polarized dielectric resonant antenna. The antenna includes a lower antenna portion configured as a twisted inverted-frustum having a twist angle θ between its top and bottom surfaces, wherein the twist angle θ is greater than zero degrees and less than 5 degrees. An upper antenna portion extends from the lower antenna portion top surface. The upper portion includes plural interleaved slabs of first and second dielectric materials having respective first and second dielectric constants, the interleaved slabs having a stepwise-varying height between adjacent slabs. The antenna may be mounted on a printed circuit substrate at a 45 degree angle to an excitation slot. The antenna may be compact and easily manufactured using 3-D printing techniques.

The disclosed systems, structures, and methods are directed to an antenna comprising: a plurality of Composite Right Left Handed (CRLH) magneto-electric unit-cell based structures, each CRLH magneto-electric unit-cell based structure comprising: a ground electrode for common electrical contacts, a first coaxial connector and a second coaxial connector, a first ground surface and a second ground surface, the first ground surface connected to a second end of the first coaxial connector and the second ground surface connected to a second end of the second coaxial connector, a coaxial line included in the second coaxial connector, a microstrip feed line connected to the coaxial line and electromagnetically coupled with the first and the second ground surfaces, and a first non-resonant meta-surface patch and a second non-resonant meta-surface patch, each of the first and second non-resonant meta-surface patches placed above a series-capacitor gap between the first ground surface and the second ground surface.

An antenna array assembly comprises at least a first and second antenna element, each comprising at least one radiator element in a substantially parallel relationship to a respective ground plate, and an isolator bar disposed between the respective ground plates of the first and second antenna elements, the isolator bar being elongate having a cross-section comprising a T shape, the cross-section being across a long axis. The isolator bar comprises a support bar in contact with the ground plates forming the stem of the T shape, and a cross piece forming the top of the T shape. The cross piece of the isolator bar has a width in the cross-section of at least a quarter of a wavelength at an operating frequency of the antenna array, whereby to provide radio frequency isolation between the first and second antenna elements.

A wireless communication device includes: an antenna including an antenna element, and a ground conductor; an IC connected to the antenna; and a metal member arranged to face the antenna. The ground conductor includes one end and the other end in the X direction. The metal member includes a metal plate, and a projection protruding from the metal plate toward the antenna. The projection is arranged at a position of overlapping with the end of the ground conductor as viewed in the −Z direction. Such a configuration improves the transmission and reception gains at the communication frequency of a radio element.

Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.

An electronically scanned antenna comprising a travelling wave guiding structure having a bottom conductor and a top conductor developing each along a first direction, the top conductor comprising a plurality of first conductive patches arranged periodically along said first direction and connected in series by tuning circuits; the electronically scanned antenna further comprising a plurality of amplifiers arranged for compensating resistive and radiation losses along the length of the travelling wave guiding structure.

An antenna device according to an embodiment of the present invention includes a dielectric layer, a radiation pattern disposed on a top surface of the dielectric layer, a signal pad electrically connected to the radiation pattern, and a ground pad spaced apart from the signal pad and having an isolation space. A length of the isolation space is greater than a length of the signal pad.

A package structure is provided that includes a planar core structure comprising a first side and a second side opposite the first side. The package structure also includes an antenna structure disposed on the first side of the planar core structure. The antenna structure comprises a plurality of first laminated layers, each first laminated layer comprising a first patterned conductive layer formed on a first insulating layer, an antenna formed on one or more first patterned conductive layers of the first laminated layers, the antenna including at least one L-shaped structure. The package structure also includes an interface structure disposed on the second side of the planar core structure, and an antenna feed line structure formed in, and routed through, the interface structure and the planar core structure, wherein the antenna feed line structure is not connected to the planar antenna.

An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.