Patent classifications
H01Q13/02
High-performance dual-polarized antenna feed chain
Antenna feed chains and methods are disclosed. An antenna feed chain, include a feed horn having a first cross-polarization performance over a solid angle of interest and a frequency band of interest and a polarizer having a second cross-polarization performance over the solid angle of interest and the frequency band of interest. The polarizer is coupled to the feed horn. The first cross-polarization performance of the feed horn compensates for the second cross-polarization performance of the polarizer over the solid angle of interest and the frequency band of interest.
Lens Antenna Systems and Method
An electromagnetic antenna includes a channel configured to serve as a waveguide for electromagnetic radiation, a first and second feed disposed next to each other inside the channel at a first end thereof, the first and second feed being configured to radiate electromagnetic waves into the channel, an aperture lens disposed inside the channel near a second end thereof opposite to the first end, the aperture lens being configured to output collimated beams, a first focal lens disposed inside the channel adjacent to an outlet of the first feed, the first focal lens being configured to squint a beam radiated from the first feed toward a center of the aperture lens, and a second focal lens disposed inside the channel adjacent to an outlet of the second feed, the second focal lens being configured to squint a beam radiated from the second feed toward the center of the aperture lens.
Microwave dielectric component and manufacturing method thereof
A microwave dielectric component (100) comprises a microwave dielectric substrate (101) and a metal layer, the metal layer being bonded to a surface of the microwave dielectric substrate (101). The metal layer comprises a conductive seed layer and a metal thickening layer (105). The conductive seed layer comprises an ion implantation layer (103) implanted into the surface of the microwave dielectric substrate (101) and a plasma deposition layer (104) adhered on the ion implantation layer (103). The metal thickening layer (105) is adhered on the plasma deposition layer (104). A manufacturing method of the microwave dielectric component (100) is further disclosed.
MICROWAVE BEAM-FORMING ANTENNA
A microwave beam-forming antenna may include: a main reflector installed on one surface of an antenna body; an array feed horn installed on a center portion of the main reflector; a sub-reflector disposed to be spaced apart from the array feed horn on the main reflector; and a plurality of waveguide feeds respectively connected to a plurality of horn antennas arranged in the array feed horn.
MICROWAVE BEAM-FORMING ANTENNA
A microwave beam-forming antenna may include: a main reflector installed on one surface of an antenna body; an array feed horn installed on a center portion of the main reflector; a sub-reflector disposed to be spaced apart from the array feed horn on the main reflector; and a plurality of waveguide feeds respectively connected to a plurality of horn antennas arranged in the array feed horn.
Waveguide antenna element based beam forming phased array antenna system for millimeter wave communication
An antenna system includes a first substrate, a plurality of chips and a waveguide antenna element based beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. The first pin includes a first and a second current path, the first current path being longer than the second current path. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells.
Dielectric resonator antenna system
An electromagnetic device includes: an electrically conductive ground structure; at least one dielectric resonator antenna (DRA) disposed on the ground structure; at least one electromagnetic (EM) beam shaper disposed proximate a corresponding one of the DRA; and, at least one signal feed disposed electromagnetically coupled to a corresponding one of the DRA. The at least one EM beam shaper having: an electrically conductive horn; a body of dielectric material having a dielectric constant that varies across the body of dielectric material in a specific direction; or, both the electrically conductive horn and the body of dielectric material.
Dielectric resonator antenna system
An electromagnetic device includes: an electrically conductive ground structure; at least one dielectric resonator antenna (DRA) disposed on the ground structure; at least one electromagnetic (EM) beam shaper disposed proximate a corresponding one of the DRA; and, at least one signal feed disposed electromagnetically coupled to a corresponding one of the DRA. The at least one EM beam shaper having: an electrically conductive horn; a body of dielectric material having a dielectric constant that varies across the body of dielectric material in a specific direction; or, both the electrically conductive horn and the body of dielectric material.
IN-PACKAGE MMWAVE ANTENNAS AND LAUNCHERS USING GLASS CORE TECHNOLOGY
Embodiments disclosed herein include package substrates with antennas on the core. In an embodiment, a package substrate comprises a core with a first surface and a second surface. In an embodiment, a first conductive plane is formed into the core, where the first conductive plane is substantially orthogonal to the first surface, and a second conductive plane is formed into the core, where the second conductive plane is substantially orthogonal to the first surface. In an embodiment, an antenna is on the core, where the antenna is between the first conductive plane and the second conductive plane.
IN-PACKAGE MMWAVE ANTENNAS AND LAUNCHERS USING GLASS CORE TECHNOLOGY
Embodiments disclosed herein include package substrates with antennas on the core. In an embodiment, a package substrate comprises a core with a first surface and a second surface. In an embodiment, a first conductive plane is formed into the core, where the first conductive plane is substantially orthogonal to the first surface, and a second conductive plane is formed into the core, where the second conductive plane is substantially orthogonal to the first surface. In an embodiment, an antenna is on the core, where the antenna is between the first conductive plane and the second conductive plane.