H01Q13/02

Antenna device
11482776 · 2022-10-25 · ·

An antenna device is disclosed. The disclosed antenna device comprises: a printed circuit board; and a waveguide antenna formed on the printed circuit board, wherein the waveguide antenna comprises; a first conductive area formed under the printed circuit board; a second conductive area formed above the printed circuit board and disposed to face the first conductive area; and a plurality of vias, formed at predetermined intervals along edges of the first conductive area, for electrically connecting the first conductive area and the second conductive area.

Antenna device
11482776 · 2022-10-25 · ·

An antenna device is disclosed. The disclosed antenna device comprises: a printed circuit board; and a waveguide antenna formed on the printed circuit board, wherein the waveguide antenna comprises; a first conductive area formed under the printed circuit board; a second conductive area formed above the printed circuit board and disposed to face the first conductive area; and a plurality of vias, formed at predetermined intervals along edges of the first conductive area, for electrically connecting the first conductive area and the second conductive area.

Near-field microwave heating system and method

A microwave heating device includes a variable frequency microwave power supply, a waveguide launcher, and a fixture to contain a material to be heated, with the fixture located directly adjacent to the end of the launcher. All heating occurs in the near-field region. This condition may be insured by keeping the thickness of the fixture or workpiece under one wavelength (at all microwave frequencies being used). The launcher is preferably a horn or waveguide configured to apply the microwave power to a small area to perform spot curing or repair operations involving adhesives and composites. The spot curing may secure components in place for further handling, after which a thermal or oven treatment will cure the remaining adhesive to develop adequate strength for service. A related method is also disclosed.

Antenna in package structure and manufacturing method therefor
11637381 · 2023-04-25 · ·

In an antenna in package structure, a plurality of supporting blocks spaced apart from each other are disposed between a first substrate and a second substrate, and an antenna cavity is formed between every two adjacent supporting blocks. Therefore, a height of the supporting block determines a height of the antenna cavity. The supporting blocks spaced apart from each other are located between the first substrate and the second substrate, and at least one of the first substrate or the second substrate adheres to the supporting blocks spaced apart from each other using an adhesive layer.

Rapid over-the-air production line test platform

Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Rapid over-the-air production line test platform

Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Seeker sequential lobing radar antenna system
11598867 · 2023-03-07 · ·

A radar antenna includes a plurality of horns in the annular space of a munition nose cone. The horns are disposed near the exterior surface of the nose cone. In a further aspect, the nose cone may be injection molded or additively manufactured so that the horns are embedded a known distance from the exterior surface. In a further aspect, the horns placed in either a transmit mode or a receive mode so as to maintain a minimum special separation between transmitting horns and receiving horns.

Communication system
11476560 · 2022-10-18 · ·

A communication system disposed in a housing includes multiple communication devices each of which performing a wireless communication with one another. The communication devices include a specific communication device disposed on a mounting surface. The specific communication device includes at least one antenna structure, and the at least one antenna structure includes at least one antenna. The at least one antenna structure is disposed between the mounting surface and a predetermined wall surface of the housing. A gap between an outer shell of the at least one antenna structure and the predetermined wall surface of the housing is smaller than a wavelength of a radio wave used in the wireless communication of the communication devices. The at least one antenna of the specific communication device has a directivity in a direction parallel to the mounting surface.

Antenna-on-package including multiple types of antenna

An AIP includes a package substrate including a top layer including a top metal layer including a first antenna type and a second antenna type, and a bottom layer including a bottom dielectric and a metal layer including a first and second contact pad and filled vias, and an IC embedded therein. Bond pads of an IC are coupled by a connection including ≥1 filled via for connecting to the top and/or bottom metal layer. A first metal pillar is between the first contact pad and first antenna, and a second metal pillar is between the second contact pad and second antenna. A first filled via is coupled to the first metal pillar providing a transmission line from the first contact pad to the first antenna. A second filled via is coupled to the first metal pillar providing a transmission line from the second contact pad to the second antenna.

ANTENNA USING HORN STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

An electronic device in provided, including an antenna using a horn structure capable of using at least a portion of a metal member as a signal waveguide structure of the antenna. The device includes a housing, a display, a printed circuit board, and at least one wireless communication circuit, where a waveguide hole is provided to connect at least a portion of a through hole and an electronic component and is used as an operating channel of the electronic component together with the waveguide hole.