A RF antenna or sensor has a substrate, a resonator operable at UHF disposed on the substrate, the resonator preferably having a quartz bar or body with electrodes disposed on opposing major surfaces thereof and with a magnetostrictive material disposed on or covering at least one of the electrodes. A pair of trapezoidal, triangular or wing shaped high permeability pole pieces preferably supported by that substrate are disposed confronting the resonator, one of the pair being disposed one side of the resonator and the other one of the pair being disposed on an opposing side of said resonator, the pair of high permeability pole pieces being spaced apart by a gap G, the resonator being disposed within that gap G. The size of gap G is preferably less than 100 μm.

A RF antenna or sensor has a substrate, a resonator operable at UHF disposed on the substrate, the resonator preferably having a quartz bar or body with electrodes disposed on opposing major surfaces thereof and with a magnetostrictive material disposed on or covering at least one of the electrodes. A pair of trapezoidal, triangular or wing shaped high permeability pole pieces preferably supported by that substrate are disposed confronting the resonator, one of the pair being disposed one side of the resonator and the other one of the pair being disposed on an opposing side of said resonator, the pair of high permeability pole pieces being spaced apart by a gap G, the resonator being disposed within that gap G. The size of gap G is preferably less than 100 μm.

A single-layer Wide Angle Impedance Matching (WAIM) and method for using the same are described. In one embodiment, the antenna comprises: an aperture having a plurality of antenna elements operable to radiating radio-frequency (RF) energy; and a single-layer wide angle impedance matching (WAIM) structure coupled to the aperture to provide impedance matching between the antenna aperture and free space.

Disclosed herein is an antenna device that includes a first molded substrate having first and second surfaces opposite to each other, a second molded substrate having third and fourth surfaces opposite to each other, a first electrode formed on the first surface of the first molded substrate, a feed electrode formed on the second surface of the first molded substrate so as to overlap the first electrode in a plan view, and a first ground electrode formed on the third surface of the second molded substrate. The first and second molded substrates overlap each other such that the second surface of the first molded substrate and the fourth surface of the second molded substrate face each other.

A foldable apparatus is provided. The foldable apparatus includes a first foldable part, a middle bending part, and a second foldable part that are connected in sequence. The first foldable part and the second foldable part can rotate relative to each other based on the middle bending part. A first wireless communication chip is disposed in the first foldable part. A second wireless communication chip is disposed in the second foldable part. In the foldable apparatus, wireless communication is used to replace conventional physical wiring for internal signal transmission. The loss of a communication carrier is reduced through wireless communication. This ensures that stable transmission performance between the first foldable part and the second foldable part.

Package substrates employing integrated slot-shaped antenna(s), and related integrated circuit (IC) packages and fabrication methods. The package substrate can be provided in a radio-frequency (RF) IC (RFIC) package. The package substrate includes one or more slot-shaped antennas each formed from a slot disposed in the metallization substrate that can be coupled to the RFIC die for receiving and radiating RF signals. The slot-shaped antenna includes a conductive slot disposed in at least one metallization layer in the package substrate. A metal interconnect in a metallization layer in the package substrate is coupled to the conductive slot to provide an antenna feed line for the slot-shaped antenna. In this manner, the slot-shaped antenna being integrated into the metallization substrate of the IC package can reduce the area in the IC package needed to provide an antenna and/or provide other directions of antenna radiation patterns for enhanced directional RF performance.

Package substrates employing integrated slot-shaped antenna(s), and related integrated circuit (IC) packages and fabrication methods. The package substrate can be provided in a radio-frequency (RF) IC (RFIC) package. The package substrate includes one or more slot-shaped antennas each formed from a slot disposed in the metallization substrate that can be coupled to the RFIC die for receiving and radiating RF signals. The slot-shaped antenna includes a conductive slot disposed in at least one metallization layer in the package substrate. A metal interconnect in a metallization layer in the package substrate is coupled to the conductive slot to provide an antenna feed line for the slot-shaped antenna. In this manner, the slot-shaped antenna being integrated into the metallization substrate of the IC package can reduce the area in the IC package needed to provide an antenna and/or provide other directions of antenna radiation patterns for enhanced directional RF performance.

An electronic device may comprise: a display; an antenna module including at least one antenna; a conductive connection member comprising a conductive material; and at least one antenna structure. The display may be arranged in the inner space of a housing to be visible from the outside and may include a curved side surface portion. The antenna module may be arranged in the inner space of the housing. The conductive connection member may be electrically connected to the antenna module. The at least one antenna structure may be arranged on a side surface portion of the display. The conductive connection member may electrically connect the antenna structure to the antenna module. The antenna structure may include at least one first-type antenna and at least one second-type antenna configured to radiate radio waves in different directions.

The present invention relates to a base station antenna. The base station antenna comprises: a reflector that is configured to provide a ground plane; a first radiating element array including at least one first cross-polarized radiating element that is arranged on the reflector; and a first parasitic element array including first through third parasitic element pairs, wherein each of the first through third parasitic element pairs includes a pair of parasitic elements that are arranged substantially symmetrically on both sides of the first longitudinal axis, and distances from the first through third parasitic element pairs respectively to the first longitudinal axis increase sequentially, wherein projections of any two of the first parasitic element pair, the second parasitic element pair, the third parasitic element pair, and the at least one first cross-polarized radiating element on the first longitudinal axis at least partly overlap.

An antenna module (10) includes a ground electrode (30) in which a slit (33) is formed in such a manner as to form an opening along a perimeter of the ground electrode, a first antenna (110) and a second antenna (110A) arranged in or on the ground electrode (30), and a coupling reducing electrode (200) connected to the ground electrode (30) within the slit (33). The slit (33) is formed on a path leading from the first antenna (110) to the second antenna (110A) along the perimeter of the ground electrode. The coupling reducing electrode (200) includes a first conductor (220) having a length corresponding to a first frequency and a second conductor (230) having a length corresponding to a second frequency, which is higher than the first frequency.