Patent classifications
H01Q17/001
WIRELESS THROUGHPUT VIA BEAM REFLECTION REDUCTION
Techniques for improved wireless throughput via beam reflection reduction are provided. A wireless communication device can include a device enclosure that at least partially encompasses an interior of the wireless communication device, the device enclosure comprising a cover assembly that defines a surface of the wireless communication device, wherein the cover assembly is composed of at least a first material; an antenna embedded within the interior of the wireless communication device substantially adjacent to the cover assembly, wherein the antenna is situated at a position relative to the cover assembly; and an aperture formed into the cover assembly at the position, wherein the aperture is not composed of the first material. Alternatively, the aperture can be coated with a non-reflective material that is distinct from the first material.
RADAR MODULE INCORPORATED WITH A PATTERN-SHAPING DEVICE
A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.
ANTENNA SYSTEMS AND DEVICES AND METHODS OF MANUFACTURE THEREOF
Embodiments of the present disclosure provide methods, apparatuses, devices and systems related to the implementation of a multi-layer printed circuit board (PCB) radio-frequency antenna featuring, a printed radiating element coupled to an absorbing element embedded in the PCB. The embedded element is configured within the PCB layers to prevent out-of-phase reflections to the bore-sight direction.
Back cover for portable terminal and back cover-integrated antenna module including the same
Provided are a back cover for a portable terminal and a back cover-integrated antenna module including the same. A back cover for a portable terminal according to an embodiment of the present invention is disposed on the back surface of a portable terminal body, and includes a pattern portion, which is formed to pass through the back cover formed of a metal material at a region corresponding to at least one antenna and configured to reduce generation of an eddy current.
ANTENNA UNIT, ANTENNA UNIT-EQUIPPED WINDOW GLASS, ATTACHMENT METHOD FOR ANTENNA UNIT
An antenna unit to be used by being installed so as to face window glass of a building, the antenna unit including a radiating element, a reflective member configured to reflect electromagnetic waves radiated from the radiating element toward outside of the building, and a support unit configured to removably support the reflective member. An antenna unit attachment method includes installing an antenna unit so as to face window glass for a building, the antenna unit having a radiating element and a support unit, and supporting a reflective member that reflects electromagnetic waves radiated from the radiating element by the support unit on an outdoor side relative to the radiating element.
Antennas and unmanned aerial vehicle
An unmanned aerial vehicle (UAV) includes a fuselage, a power system arranged at the fuselage, and an antenna assembly arranged at the fuselage. The antenna assembly includes an antenna operating in a first frequency band and a second frequency band different from each other, a first parasitic unit configured to change a radiation direction of the antenna in the first frequency band, and a second parasitic unit configured to change a radiation direction of the antenna in the second frequency band.
Radar module incorporated with a pattern-shaping device
A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.
DC offset correction in an antenna aperture
A method and apparatus for DC offset correction in an antenna aperture are described. In one embodiment, the antenna comprises: an array of antenna elements having liquid crystal (LC); drive circuitry coupled to the array and having a plurality of drivers, each driver of the plurality of drivers coupled to an antenna element of the array and operable to apply a drive voltage to the antenna element; and voltage correction logic coupled to the drive circuitry adjust drive voltages to compensate for an offset between a first magnitude of a first voltage applied to the LC of each antenna element during a first interval of drive polarity and a second magnitude of a second voltage applied to the LC of said each antenna element during a second interval of drive polarity opposite the drive polarity of the first interval.
Beacon network, moving-object positioning system, and logistics management system
A beacon network includes a plurality of beacons arranged at predetermined positions to periodically or intermittently emit a signal wave including identification information, and a radio wave absorber to adjust an emission angle of the signal wave emitted from at least one of the plurality of beacons.
Antenna systems and devices, and methods of manufacture thereof
Embodiments of the present disclosure provide methods, apparatuses, devices and systems related to the implementation of a multi-layer printed circuit board (PCB) radio-frequency antenna featuring, a printed radiating element coupled to an absorbing element embedded in the PCB. The embedded element is configured within the PCB layers to prevent out-of-phase reflections to the bore-sight direction.