H01Q17/008

Network creation process for internet supply to the earth's complete land surface, the payload and aircraft enabling it's implementation
11139885 · 2021-10-05 · ·

The invention concerns a network creation process for the provision of internet and/or television type data signals across the complete land surface, Linking through a digital wireless link at least one aircraft (300) with the earth station (200) on one hand, and on the other hand, with at least one means of emission and receipt, whether fixed or borne by at least one user (400), moving to an altitude lower than or equal to ten kilometers above the global land surface, and
being equipped with one or several payloads powered by the energy of the aircraft (300) in such a way as to use emission and receipt relays for the provision of at least one type of signal on the global land surface. The said process is remarkable in that the power of signals (radiation) emitted by the payload is modulated to vary according to the altitude of the aircraft (300) and can thus vary from 0% on earth to 100% during cruising. The invention also concerns the payload and the aircraft that enable implementing the said process.

Additive manufacturing technology (AMT) low profile radiator

Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.

Electromagnetic-wave-absorbing materials for various applications

One subject of the present invention is an electromagnetic-wave-absorbing composite material comprising a carrier matrix (11) and an electromagnetic-wave-absorbing filler (12). According to the invention, the carrier matrix (11) is a cork matrix, which is formed of particles the equivalent diameter D.sub.el of which is comprised between 10 μm and 5 mm, and the composite material (1) has a real permittivity higher than 1.2 and a dielectric loss tangent tan δ higher than 0.1. Another subject of the present invention is a method for producing such a material, and the use of this material as an absorber, in particular in an anechoic chamber, or as a radar absorber in stealth devices, or even to improve the electromagnetic compatibility of electronic devices.

Multiple phase shifter for electromagnetic waves operating in particular in a three-dimensional manner
11095018 · 2021-08-17 ·

A multiple phase shifter for electromagnetic waves, having a plurality of phase-shifting modules. Each phase-shifting module includes at least two homothetic loops, electrically insulated from each other and connected together by two distinct interloop electrical connection elements at a first opening in each of the loops. The phase-shifting modules are electrically connected to at least one other phase-shifting module by two intermodule connection elements and are arranged in a plurality of groups. Each group includes at least two homothetic, concentric, interconnected phase-shifting modules. At least the outer loop of each group includes intergroup connectors having at least one pair of intergroup connection elements arranged at a first opening in the loop.

RADIO WAVE ABSORBING MEMBER, RADIO WAVE ABSORBING STRUCTURE, AND INSPECTION APPARATUS

A radio wave absorbing member 1a includes a radio wave absorber 10 and a support 20 having a sheet shape. The radio wave absorber 10 includes a resistive layer 12, a reflective layer 14, and a dielectric layer 13. The reflective layer 14 reflects a radio wave. The dielectric layer 13 is disposed between the resistive layer 12 and the reflective layer 14 in the thickness direction of the reflective layer 14. The support 20 supports the radio wave absorber 10. The support 20 includes a matrix resin 20m and a flame retardant 20p.

WIRELESS SYSTEM ON FLEXIBLE SUBSTRATE
20210305720 · 2021-09-30 ·

A wireless system includes an apparatus comprising: a flexible substrate; a radar sensor device disposed on the flexible substrate; and an electrically conductive path communicatively coupled to the radar sensor device. The apparatus further includes one or more integrated circuit chips (components such as semiconductor devices) connected to the radar sensor device; the circuit chips provide radar sensor functionalities. The integrated circuit chips are in contact with (such as disposed on) the flexible substrate and/or the electrically conductive circuit paths. The flexible radar system generates and receives wireless signals during conditions in which the circuitry disposed on the flexible substrate is bent to one or more non-planar states.

ABSORBING METAMATERIAL
20210151897 · 2021-05-20 ·

The disclosure discloses a absorbing metamaterial, including a plurality of metamaterial units that are periodically arranged, where the metamaterial unit includes: a first loop disposed on a first plane; and a second loop disposed on a second plane, where the first plane is perpendicular to the second plane, so that the first loop and the second loop are orthogonal. According to the foregoing technical solution in the disclosure, wave absorption in a large angle range can be implemented while ensuring wideband wave absorption.

SUPERCONDUCTING WIRE AND WAVEGUIDES WITH ENHANCED CRITICAL TEMPERATURE, INCORPORATING FRACTAL PLASMONIC SURFACES
20210123693 · 2021-04-29 ·

Systems according to the present disclosure provide one or more surfaces that function as power radiating surfaces for which at least a portion of the radiating surface includes or is composed of “fractal cells” placed sufficiently closed close together to one another so that a surface wave causes near replication of current present in one fractal cell in an adjacent fractal cell. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges. The fractal plasmonic surfaces can be utilized to facilitate electrical conduction with lower ohmic resistance than would otherwise be possible in the absence of the fractal plasmonic surface(s) at the same temperature.

INTEGRATED WAVE-ABSORBING AND WAVE-TRANSPARENT APPARATUS AND RADOME
20210143537 · 2021-05-13 ·

The disclosure provides an integrated wave-absorbing and wave-transparent apparatus and a radome. The integrated wave-absorbing and wave-transparent apparatus includes: a wave-transparent structure, including a first substrate and a metal patch unit located on opposite surfaces of the substrate; and a wave-absorbing structure, disposed on the wave-transparent structure and including a first wave-absorbing unit and a second wave-absorbing unit that are perpendicular to each other, where the first wave-absorbing unit and the second wave-absorbing unit each includes: a second substrate; and a plurality of metal sections and a plurality of stop-bands that are located on surfaces of the second substrate, where the plurality of metal sections and the plurality of stop-bands are connected alternately to form an absorption ring, and the metal patch unit is configured to be perpendicular to each of an absorption ring of the first wave-absorbing unit and an absorption ring of the second wave-absorbing unit.

ELECTROMAGNETIC WAVE ABSORBER, ARTICLE WITH ELECTROMAGNETIC WAVE ABSORBER, AND METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE ABSORBER

An electromagnetic wave absorber (1a) includes a resistive layer (10), an electrically conductive layer (20) and a dielectric layer (30). The electrically conductive layer (20) has a sheet resistance lower than a sheet resistance of the resistive layer (10). The dielectric layer (30) is disposed between the resistive layer (10) and the electrically conductive layer (20). The electromagnetic wave absorber (1a) has a first slit (15). The first slit (15) extends, in the resistive layer (10), from a first principal surface (10a) distal to the dielectric layer (30) toward the dielectric layer (30) in a direction perpendicular to the first principal surface (10a) and divides the resistive layer (10) into a plurality of first blocks (17). Each of the first blocks (17) has a minimum dimension (D1) of 2 mm or more at the first principal surface (10a).