A patch antenna includes a dielectric substrate formed by a high dielectric coefficient material covered with a soft material. The dielectric substrate has a first surface, an opposite second surface, and surrounding side surfaces there between. The patch antenna further includes a radiating metal arm formed on at least the first surface with a thin metal layer in a specific shape, a grounding metal plate disposed on the second surface, and a parasitic metal arm extending from the grounding metal plate towards the first surface via at least one of the side surfaces. The parasitic metal arm is approximate but not connected to the radiating metal arm. The radiation metal arm further includes an enclosed slot, together with the parasitic metal arm, improve the working bandwidth and high directivity of the antenna.

The structure includes a first conductor that extends in a second direction; a second conductor, a third conductor, a fourth conductor, and a feeding line. The second conductor faces the first conductor in a first direction and extends along the second direction. The third conductor is configured to capacitively connect the first conductor and the second conductor. The fourth conductor is configured to be electrically connected to the first conductor and the second conductor and extends along a first plane. The feeding line is connected to the third conductor. The feeding line includes a first constituting part that extends along the first direction, and a second constituent part that extends along the second direction. The first constituting part is positioned on an inside of both ends of the fourth conductor in a third direction.

In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.

An antenna includes feed pads; a radiating portion disposed on one side of the feed pads and spaced apart from the feed pads, the radiating portion being constituted by a single conductor plate; and a ground part disposed on an opposite side of the feed pads from the radiating portion; wherein each of the feed pads has a polygonal shape.

An antenna device is a device of 0th-resonance antenna, which includes: a ground plate providing a ground potential; an opposed conductor arranged to have a predetermined distance from the ground plate in a plate thickness direction of the ground plate and configured for connection to a feeder line; and a short-circuit part electrically connecting the opposed conductor and the ground plate. The antenna device further includes an intermediate conductor having a same potential as the ground plate and arranged in between the ground plate and the opposed conductor in the plate thickness direction. The intermediate conductor includes a penetration part that includes the opposed conductor in a plan view in the plate thickness direction.

An electronic device may have an antenna module with a triplet of antennas on a substrate. The triplet may include a first antenna with a radiating element formed from a patch on the substrate and second and third antennas having radiating elements formed from patches on that extend across a smaller lateral area than the patch in the first antenna. The patches in the second and third antennas may have extended electrical lengths formed from parasitic patches embedded within the substrate that are coupled to opposing edges of the patches by fences of conductive vias. The antenna module may include phased antenna arrays for conveying centimeter/millimeter wave signals. Signal conductors for the antennas may be distributed across multiple metallization layers of the substrate.

A structure includes first to fourth conductors. The first conductor extends along a second plane including a second direction and a third direction intersecting with the second direction. The second conductor faces the first conductor along a first direction intersecting with the second plane and extends along the second plane. The third conductor capacitively connects the first conductor and the second conductor. The fourth conductor is electrically connected to the first conductor and the second conductor, and extends along a first plane including the first direction and the third direction. The third conductor includes a first conductive layer and a second conductive layer capacitively connected to the first conductive layer. The second conductive layer is positioned between the first conductive layer and the fourth conductor in the second direction. The first conductive layer has more thickness in the second direction as compared to thickness of the second conductive layer.

A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.

A technique is described where the switch and/or tunable control circuit for use with an active multi-mode antenna is positioned remote from the antenna structure itself for integration into host communication systems. Electrical delay and impedance characteristics are compensated for in the design and configuration of transmission lines or parasitic elements as the active multi-mode antenna structure is positioned in optimal locations such that significant electrical delay is introduced between the RF front-end circuit and multi-mode antenna. This technique can be implemented in designs where it is convenient to locate switches in a front-end module (FEM) and the FEM is located in vicinity to the transceiver.

An antenna device according to an embodiment may include a dielectric layer, a first radiator disposed on an upper surface of the dielectric layer, a transmission line whose one end is connected with the first radiator on the upper surface of the dielectric layer, a signal pad connected to the other end of the transmission line, ground pads disposed around the signal pad, and a second radiator extending from the ground pad parallel to the transmission line and including one or more uneven parts.