Patent classifications
H01Q19/005
ANTENNA UNIT AND WINDOW GLASS
An antenna unit to be used by being installed so as to face window glass for a building includes a radiating element, a phase control member situated on an exterior-side with reference to the radiating element and configured to control a phase of an electromagnetic wave radiated from the radiating element, and a conductor situated on an interior-side with reference to the radiating element, wherein the phase control member is a member including a dielectric and a plurality of conductor portions.
Ultra compact ultra broad band dual polarized base station antenna
The invention refers to a radiating element comprising a support structure, a first dipole arranged on the support structure, and at least one electrically closed ring arranged on the support structure, wherein the ring surrounds the first dipole and is galvanically isolated from the first dipole, wherein a resonance frequency of the first dipole is higher than a center frequency of an operational bandwidth of the radiating element.
Antenna device, antenna module, and communication apparatus
A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. The second surface region of the at least one main surface is exposed.
Communications device
A communications device is provided, including a metal carrier having a mounting plane with at least one mounting area, and further includes an antenna element disposed in each mounting area. The mounting area is where the mounting plane intersects a circle centered at a feedpoint of the antenna element in the area and whose radius does not exceed a specified radius. When a boundary line of the mounting area includes a boundary line, a distance from the feedpoint to the boundary line is less than or equal to a specified distance; and/or when a boundary line of the mounting area includes a vertex of the mounting plane, a distance from the feedpoint to the vertex is less than or equal to a specified distance. A feed position on the antenna element is designed to obtain relatively good antenna roundness performance and enhance an antenna signal coverage effect.
Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave
A packaged radar includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna and a receive antenna associated with at least one of the laminate layers, and an electromagnetic band gap structure between the transmit antenna and the receive antenna for isolating the transmit antenna and the receive antenna, the electromagnetic band gap structure including elementary cells forming adjacent columns each coupled to the ground plane, and each elementary cell including a conductive planar element and a columnar element coupled to the conductive planar element.
FILTERED DUAL-BAND PATCH ANTENNA
A dual-band patch antenna is described. The antenna includes a ground plane. The antenna also includes an inner conductor disposed above the ground plane. The inner conductor forms a high-frequency patch for receiving radio waves at an upper frequency band. The antenna further includes an outer conductor surrounding the inner conductor. The outer conductor and the inner conductor collectively form a low-frequency patch for receiving radio waves at a lower frequency band. The antenna further includes a filter disposed between the inner conductor and the outer conductor. The filter is configured to at least partially block electrical signals at the upper GNSS frequency band and to let pass electrical signals at the lower GNSS frequency band.
Electronic devices having multilayer millimeter wave antennas
An electronic device may have a phased antenna array. An antenna in the array may include a rectangular patch element with diagonal axes. The antenna may have first and second antenna feeds coupled to the patch element along the diagonal axes. The antenna may be rotated at a forty-five degree angle relative to other antennas in the array. The antenna may have one or two layers of parasitic elements overlapping the patch element. For example, the antenna may have a layer of coplanar parasitic patches separated by a gap. The antenna may also have an additional parasitic patch that is located farther from the patch element than the layer of coplanar parasitic patches. The additional parasitic patch may overlap the patch element and the gap in the coplanar parasitic patches. The antenna may exhibit a relatively small footprint and minimal mutual coupling with other antennas in the array.
ANTENNA DEVICE
An antenna device is provided. The antenna device includes a first antenna patch configured to transmit and receive an RF signal in a first frequency bandwidth and disposed a first dielectric layer; a second antenna patch disposed on a second dielectric layer and coupled to the first antenna patch; a third antenna patch disposed on a third dielectric layer and coupled to the second antenna patch; and a fourth antenna patch configured to transmit and receive an RF signal in the second frequency bandwidth, wherein the second antenna patch includes a plurality of first sub-antenna patches that do not overlap the first antenna patch, and the third antenna patch includes a plurality of second sub-antenna patches that overlap the first sub-antenna patches.
Antenna module
An antenna module configured to receive a radio communication signal includes: a circuit board on which a signal processing circuit is placed; a patch antenna stacked on the circuit board; a parasitic element disposed above the patch antenna, having held portions having at least two sides opposed to each other, and configured to improve elevation angle reception characteristics of the patch antenna; an integrated resin holder supporting the circuit board and the parasitic element, having at least a pair of parasitic element locking pawls that sandwich and support the two sides of the held portions of the parasitic element from both sides such that the distance between the patch antenna and the parasitic element is kept constant.
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
The present disclosure provides an antenna module. The antenna module includes a first layer, a second layer, a first antenna, and a second antenna. The first layer has a first dielectric constant. The second layer is adjacent to the first layer. The second layer has a second Dk lower than the first Dk. The first antenna is disposed on the first layer and is configured for operating at a first frequency. The second antenna is disposed on the second layer and is configured for operating at a second frequency higher than the first frequency.