Shroud isolation, including choke shroud isolation, apparatuses for wireless antennas for point-to-point or point-to-multipoint transmission/communication of high bandwidth signals, and integrated reflectors including a shroud or choke shroud. A choke shroud systems may include a cylindrical body with an isolation choke boundary at the distal opening to attenuate electromagnetic signals to, from, or within the antenna. The isolation choke boundary region may have ridges that may be tuned to a band of interest. The isolation choke boundary may provide RF isolation when used near other antennas.

Methods of preparing composite dielectric materials used in lenses for communications antennas. The methods can include one or more of: using induction heating to expand expandable dielectric particles; combining expandable dielectric particles with pre-expanded dielectric material prior to expansion; and/or performing the expansion of the expandable dielectric particles within a lens or other container.

Methods of preparing composite dielectric materials used in lenses for communications antennas. The methods can include one or more of: using induction heating to expand expandable dielectric particles; combining expandable dielectric particles with pre-expanded dielectric material prior to expansion; and/or performing the expansion of the expandable dielectric particles within a lens or other container.

An aperture feed network includes a substrate having a first surface and a parallel second surface, first and second conductive traces on the first surface of the substrate, a third conductive trace on the second surface of the substrate, a conductive via extending through a thickness of the substrate, and one or more ground plane structures on the second surface of the substrate. The substrate comprises a dielectric material. The first and second conductive traces together form a differential signal line. The third conductive trace comprises a first branch and a second branch. The conductive via contacts the first branch of the third conductive trace on the second surface of the substrate and the second conductive trace on the first surface of the substrate. The one or more ground plane structures have irregular shapes.

Even when at least one of a capacitor (C.sub.1) connected to a main loop and a capacitor (C.sub.2) connected to an amplification loop cannot be set to an optimal value, a current value of a current (I.sub.2) flowing on the amplification loop can be made sufficiently large by setting the capacitors (C.sub.1, C.sub.2) based on any of an optimal C2 curved line, an optimal C1 curved line, and an optimal C1 straight line that pass through an optimal point (C.sub.1.sup.opt, C.sub.2.sup.opt) of the capacitors (C.sub.1, C.sub.2) and extend along a ridge of contour lines each joining the points where the magnitude of the current (I.sub.2) is equal on a diagram showing a relation of values of the capacitors (C.sub.1, C.sub.2) with the magnitude of the current (I.sub.2).

Even when at least one of a capacitor (C.sub.1) connected to a main loop and a capacitor (C.sub.2) connected to an amplification loop cannot be set to an optimal value, a current value of a current (I.sub.2) flowing on the amplification loop can be made sufficiently large by setting the capacitors (C.sub.1, C.sub.2) based on any of an optimal C2 curved line, an optimal C1 curved line, and an optimal C1 straight line that pass through an optimal point (C.sub.1.sup.opt, C.sub.2.sup.opt) of the capacitors (C.sub.1, C.sub.2) and extend along a ridge of contour lines each joining the points where the magnitude of the current (I.sub.2) is equal on a diagram showing a relation of values of the capacitors (C.sub.1, C.sub.2) with the magnitude of the current (I.sub.2).

Even when at least one of a capacitor (C.sub.1) connected to a main loop and a capacitor (C.sub.2) connected to an amplification loop cannot be set to an optimal value, a current value of a current (I.sub.2) flowing on the amplification loop can be made sufficiently large by setting the capacitors (C.sub.1, C.sub.2) based on any of an optimal C2 curved line, an optimal C1 curved line, and an optimal C1 straight line that pass through an optimal point (C.sub.1.sup.opt, C.sub.2.sup.opt) of the capacitors (C.sub.1, C.sub.2) and extend along a ridge of contour lines each joining the points where the magnitude of the current (I.sub.2) is equal on a diagram showing a relation of values of the capacitors (C.sub.1, C.sub.2) with the magnitude of the current (I.sub.2).

Even when at least one of a capacitor (C.sub.1) connected to a main loop and a capacitor (C.sub.2) connected to an amplification loop cannot be set to an optimal value, a current value of a current (I.sub.2) flowing on the amplification loop can be made sufficiently large by setting the capacitors (C.sub.1, C.sub.2) based on any of an optimal C2 curved line, an optimal C1 curved line, and an optimal C1 straight line that pass through an optimal point (C.sub.1.sup.opt, C.sub.2.sup.opt) of the capacitors (C.sub.1, C.sub.2) and extend along a ridge of contour lines each joining the points where the magnitude of the current (I.sub.2) is equal on a diagram showing a relation of values of the capacitors (C.sub.1, C.sub.2) with the magnitude of the current (I.sub.2).

An antenna array assembly comprises a ground plate, an array of radiator elements disposed in a spaced relationship with a first face of the ground plate between first and second substantially parallel conductive walls projecting from the first face of the ground plate, and a first and second conductive plate. Each of the first and second conductive plates is electrically isolated from the ground plate, and each is disposed in an upstanding relationship to the first face of the ground plate in a substantially parallel relationship with the first and second conductive walls. This provides reduced radiation in at least one direction in the hemisphere on the opposite side of the ground plate to the first face.

An antenna structure according to the present disclosure includes an antenna substrate including a first surface and a second surface located on an opposite side to the first surface, a transmissive filter located over the first surface, and control substrates located on the second surface. The transmissive filter includes first annular patterns located on a surface facing the first surface, and second annular patterns located on a surface on an opposite side to the surface facing the first surface. The first annular pattern and the second annular pattern are located overlapping each other in a plane perspective. The control substrates are identical in number to the first annular patterns, and are located overlapping the first annular patterns in a plane perspective.