An antenna module includes a first antenna element disposed at a first dielectric substrate, a second antenna element disposed at a second dielectric substrate, a joint connecting the first dielectric substrate and the second dielectric substrate, and a power supply line. The second dielectric substrate is different from the first dielectric substrate with respect to the normal direction. The power supply line extends from the first dielectric substrate via the joint to the second antenna element and is configured to communicate a radio-frequency signal to the second antenna element. At least a part of the power supply line at the joint is formed in a direction crossing the polarization plane of radio waves radiated by the first antenna element and the second antenna element.

The disclosed technology provides a computing device with a slot antenna assembly including a slot formed in a metal exterior surface of a computing device case; an acoustic transceiver positioned to transmit an acoustic wave out through the slot and to receive a reflected portion of the acoustic wave in through the slot when the acoustic wave is reflected by an object; a proximity detector coupled to the acoustic transceiver that determines a physical separation between the object and the slot antenna based on a temporal separation between transmission of the acoustic wave and receipt of the reflected portion of the acoustic wave; and a transmission power controller that adjusts transmission power of the slot antenna based on the determined physical separation.

A radiating element comprises a radiator, a feed stalk and a parasitic element. The radiator is fed by the feed stalk, and the parasitic element includes an electrically conductive structure that includes a meandered electrically conductive path. A coupling capacitor is formed between the electrically conductive structure and the radiator, and a center frequency of an operating frequency band of the radiator is higher than a center frequency of a first operating frequency band of the parasitic element.

A radiating element comprises a radiator, a feed stalk and a parasitic element. The radiator is fed by the feed stalk, and the parasitic element includes an electrically conductive structure that includes a meandered electrically conductive path. A coupling capacitor is formed between the electrically conductive structure and the radiator, and a center frequency of an operating frequency band of the radiator is higher than a center frequency of a first operating frequency band of the parasitic element.

The manufacturing method of the antenna pattern has: a step of forming a dipole antenna on a front surface of a continuous substrate while conveying the continuous substrate; and a step of forming a sub-element on a back surface of the continuous substrate.

The present disclosure provides an antenna system including an antenna assembly embedded in a grounding foundation plate. The antenna assembly includes a first printed circuit board, a second printed circuit board, a third printed circuit board, a first conductive layer, a feed sheet, a second conductive layer, a first radiation gap disposed in the second conductive layer, and a second radiation gap disposed in the second conductive layer. The antenna assembly further includes a feed point disposed at one end of the feed sheet for electrically connecting to an external circuit and transferring the power to the second conductive layer via the feed sheet, by which, the first radiation gap works at a first frequency band, and the second radiation gap works at a second frequency band. Both of the first and second frequency bands are included in 5G frequency bands.

A patch antenna includes: a ground conductor pattern lying in a plane and set to ground potential; a feeding conductor pattern lying in a plane and disposed in a manner so as to face the ground conductor pattern, the feeding conductor pattern having feed points that are opposite to each other with respect to a center point of the feeding conductor pattern; feed lines that are connected in parallel between the feed points and are of different lengths; and a frequency selection circuits disposed on a path of at least one of the feed lines, the frequency selection circuits being configured to allow passage of radio-frequency signals in one frequency band and to attenuate radio-frequency signals in another frequency band.

A radio module for a wireless communication node comprises (i) a phased antenna array comprising a first set of antenna elements having a first polarization and a second set of antenna elements having a second polarization, (ii) a radio frequency (RF) module comprising a plurality of RF chains that are configured to feed the first and second sets of antenna elements in the phased antenna array, and (iii) a control unit that is configured to control an activation state of each antenna element in the phased antenna array. The radio module further comprises at least one beam narrowing module that is configured to (i) receive signals emitted by any active antenna element in the phased antenna array and (ii) consolidate the received signals into a respective narrow beam composite signal.

Technologies directed to overlaid shared aperture array with improved total efficiency are described. One RF structure includes a first antenna with a first set of antenna elements disposed on a first plane of a support structure and a second antenna with a second set of antenna elements disposed on a second plane of the support structure. A set of parasitic antenna elements are disposed on the first plane. Two adjacent antenna elements, including one from the first plurality of antenna elements and another one from the plurality of parasitic antenna elements, are separated by the second distance.

An antenna includes a dielectric substrate, a ground element, a feed element, a microstrip line, and a feed point. The ground element is disposed on a first surface of the dielectric substrate. The ground element includes a slit. The feed element is disposed on a second surface of the dielectric substrate. The microstrip line extends from the feed element toward the slit. The feed point is disposed on the second surface of the dielectric substrate, and connected to the feed element via the microstrip line. The feed point is positioned between the feed element and the slit, and disposed at an end of the microstrip line.