A dipole antenna includes a reflector, a radiating element, and a feed element. The radiating element includes first and second dipoles above a surface of the reflector. The first and second dipoles respectively include arm segments and are arranged in a crossed dipole arrangement. The feed element includes first and second conductive transmission lines that are electrically isolated from one another and are capacitively coupled to the arm segments of the first and second dipoles, respectively. The arm segments of the first and second dipoles are between the feed element and the surface of the reflector.

This document describes techniques, apparatuses, and systems for a wave-shaped ground structure for antenna arrays. A radar system may include a ground structure with a first surface having a wave shape and a second surface opposite the first surface. The ground structure includes multiple antenna arrays separated in a longitudinal direction on the first surface. Each antenna array includes one or more antenna elements configured to emit or receive electromagnetic (EM) energy. The ground structure also includes antenna feeds separated in the longitudinal direction on the second surface and operably connected to the antenna arrays. The wave shape of the ground structure configures the radar system to provide an antenna radiation pattern that provides a uniform radiation pattern among the antenna arrays. The wave shape can also be configured to provide an asymmetrical radiation pattern or a narrow beamwidth for specific applications.

The inventive subject matter provides apparatus, systems and methods in which a high port count base station antenna uses an array of spherical lenses with multiple ports per frequency band, containing multiple frequency bands, and capable of multiple beam operation. In a preferred embodiment, the antenna system comprises a plurality of spherical, dielectric lenses, stacked vertically, where each lens is surrounded by four or more lower frequency radiating elements, or one circular element. The circular element can have multiple sub-elements, along with feed gaps.

An electronic device that communicates a packet or a frame is described. This electronic device includes: at least an antenna having an antenna radiation pattern; an interface circuit; and an antenna cover that includes an integrated static lens, where the antenna cover is selected from a set of antenna covers that includes different integrated static lenses. During operation, the interface circuit may transmit, from the antenna, wireless signals corresponding to the packet or the frame, where the integrated static lens modifies the antenna radiation pattern of the antenna. For example, the integrated static lens may cause the wireless signals to converge or diverge. Alternatively, the integrated static lens may change an angular elevation of the antenna radiation pattern and/or may provide a correction for pathloss as a function of angle. Note that the integrated static lens may be a stepwise approximation to a predefined function.

An electronic device that communicates a packet or a frame is described. This electronic device includes: at least an antenna having an antenna radiation pattern; an interface circuit; and an antenna cover that includes an integrated static lens, where the antenna cover is selected from a set of antenna covers that includes different integrated static lenses. During operation, the interface circuit may transmit, from the antenna, wireless signals corresponding to the packet or the frame, where the integrated static lens modifies the antenna radiation pattern of the antenna. For example, the integrated static lens may cause the wireless signals to converge or diverge. Alternatively, the integrated static lens may change an angular elevation of the antenna radiation pattern and/or may provide a correction for pathloss as a function of angle. Note that the integrated static lens may be a stepwise approximation to a predefined function.

An antenna and radiation unit thereof, and balun structure of radiation unit are disclosed. The radiation unit has two dipoles belonging to a same polarization and two feeding components respectively feeding the two dipoles. One end of each of the two feeding components is electrically connected to its corresponding dipole, and the other end of each of the two feeding components is combined through a same physical combining port inherent in the radiation unit. By arranging a combining port inherent to the radiation unit and connecting it to a respective end of two feeding components connected to two dipoles of the same polarization, the signals of the two dipoles are divided/combined through the combining port.

An antenna and radiation unit thereof, and balun structure of radiation unit are disclosed. The radiation unit has two dipoles belonging to a same polarization and two feeding components respectively feeding the two dipoles. One end of each of the two feeding components is electrically connected to its corresponding dipole, and the other end of each of the two feeding components is combined through a same physical combining port inherent in the radiation unit. By arranging a combining port inherent to the radiation unit and connecting it to a respective end of two feeding components connected to two dipoles of the same polarization, the signals of the two dipoles are divided/combined through the combining port.

An example semiconductor package comprises a patch antenna formed in a first conductor layer of a multilayer package substrate. The multilayer package substrate comprises conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers. The multilayer package substrate has a board side surface opposite a device side surface. The semiconductor package further comprises a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the patch antenna. An antenna horn is mounted to the device side surface and aligned with the patch antenna using a mounting structure. The semiconductor package further comprises a reflector formed on a second conductor layer in the multilayer package substrate. The second conductor layer is positioned closer to the board side surface of the multilayer package substrate compared to the patch antenna.

An example semiconductor package comprises a patch antenna formed in a first conductor layer of a multilayer package substrate. The multilayer package substrate comprises conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers. The multilayer package substrate has a board side surface opposite a device side surface. The semiconductor package further comprises a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the patch antenna. An antenna horn is mounted to the device side surface and aligned with the patch antenna using a mounting structure. The semiconductor package further comprises a reflector formed on a second conductor layer in the multilayer package substrate. The second conductor layer is positioned closer to the board side surface of the multilayer package substrate compared to the patch antenna.

A twin beam base station antenna includes a first array that has a plurality of columns of first frequency band radiating elements, the first array configured to form a first antenna beam that provides coverage throughout a first sub-sector of a three-sector base station. The radiating elements in a first of the columns in the first array have a first azimuth boresight pointing direction and the radiating elements in a second of the columns in the first array have a second azimuth boresight pointing direction that is offset from the first azimuth boresight pointing direction by at least 10°. The radiating elements in the second of the columns in the first array are electrically steered.