A radiator for an antenna comprises a feed board and a metal radiating arm The feed board comprises an electrically conductive segment, through which the feed board feeds the metal radiating arm by means of capacitive coupling. The radiating arm includes a first arm segment extending in a first direction, and a second arm segment extending from an outer side region of the first arm segment in a second direction different from the first direction.

An electronic device having an antenna, according to one embodiment, is provided. An antenna module of the electronic device is arranged on a side surface or at a display of the electronic device and can be configured to radiate a specific-directional polarized signal in the front or side direction of the electronic device. The antenna module comprises: a first array antenna arranged in a first region of a flexible substrate to radiate a signal of a millimeter wave band, and configured to form a beam in a first direction; and a second array antenna arranged in a second region adjacent to the first region, and configured to form a beam in a second direction, wherein the first region of the flexible substrate can be formed to be bent at a predetermined angle with respect to the second region.

Techniques for antenna disposition in computing devices are described, in an example, a knuckle hinge coupled to a first component allows rotation of the first component relative to a second component. The knuckle hinge may be separated from the first component by a gap. An antenna may be disposed on the first component.

Techniques for antenna disposition in computing devices are described, in an example, a knuckle hinge coupled to a first component allows rotation of the first component relative to a second component. The knuckle hinge may be separated from the first component by a gap. An antenna may be disposed on the first component.

An antenna arrangement is disclosed, comprising a first body comprising a communications device including an antenna for transmitting and/or receiving signals via the antenna, and a second body comprising a conductive parasitic element for electromagnetic coupling with the antenna. The first body is physically separate from, or is removably attachable from, the second body. An associated method of transmitting and/or receiving signals is further disclosed.

An antenna arrangement is disclosed, comprising a first body comprising a communications device including an antenna for transmitting and/or receiving signals via the antenna, and a second body comprising a conductive parasitic element for electromagnetic coupling with the antenna. The first body is physically separate from, or is removably attachable from, the second body. An associated method of transmitting and/or receiving signals is further disclosed.

An electronic device according to various embodiments may include: a column-shaped housing including a processor and a communication module comprising communication circuitry disposed therein; a rollable display wound on a column face of the housing, wherein a printed circuit board is disposed on the housing; an array antenna mounted or embedded on the printed circuit board as a module; and a director unit including at least one director comprising a conductive material corresponding to a beam being formed by the array antenna and disposed on at least a part of the rollable display in a state in which the rollable display is wound.

An antenna structure is disclosed. The antenna structure includes a first radiator in a shape corresponding to a circle and a plurality of second radiators each in a shape corresponding to an arc. The first radiator has a first feed-in point and a second feed-in point. One of the plurality of second radiators has a third feed-in point, and another of the plurality of second radiators has a fourth feed-in point.

Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.