In order to obtain an electromagnetic transmission device and an electromagnetic transmission system that emit high-power continuous microwaves stably onto a material or an irradiation target in electromagnetic heating systems and electromagnetic power transmission systems that are required to emit electromagnetic waves such as high-power microwaves, the electromagnetic transmission device, the power amplification device, and the electromagnetic transmission system emit, onto an irradiation target, electromagnetic waves that are modulated by a repeating pulse with a predetermined transmission duty cycle, or electromagnetic waves that are modulated by a repeating pulse with a predetermined transmission duty cycle and are amplified.

One of a transmitting array antenna and a receiving array antenna includes a first antenna group and a second antenna group. The first antenna group includes one or more first antenna elements of which the phase centers of the antenna elements are laid out at each first layout spacing following a first axis direction, and a shared antenna element. The second antenna group includes a plurality of second antenna elements and the one shared antenna element, and the phase centers of the antenna elements are laid out in two columns at each second layout spacing following a second axis direction that is different from the first axis direction. The phase centers of the antenna elements included in each of the two columns differ from each other regarding position in the second axis direction.

Techniques of designing an antenna array or antenna system are described. The antenna system includes a plurality of antenna units structured in a way to form a desired antenna pattern. According to one aspect of the present invention, each of the antenna units includes two antennas disposed orthogonally or in parallel. These antenna units are arranged in a pre-defined geometric pattern to create two substantially similar main beam radiation characteristics for independent polarizations.

An antenna system is provided. The antenna system comprises at least two antenna elements. In this context, the at least two antenna elements are arranged around an inner diameter. In addition to this, each of the at least two antenna elements is configured to be controlled separately from each other. Exemplarily, each of the at least two antenna elements is connected to a corresponding amplifier.

An antenna system is provided. The antenna system comprises at least two antenna elements. In this context, the at least two antenna elements are arranged around an inner diameter. In addition to this, each of the at least two antenna elements is configured to be controlled separately from each other. Exemplarily, each of the at least two antenna elements is connected to a corresponding amplifier.

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

Millimeter-wave (mmWave) and sub-mmWave technology, apparatuses, and methods that relate to receivers for wireless communications are described. The various aspects include an apparatus of a communication device including an antenna array and switching circuitry coupled to each antenna of the antenna array. The switching circuitry is configured to switch at a rate based on the center frequency of incoming communications on each respective antenna to generate at least two antenna patterns and provide the at least two antenna patterns to processing circuitry for decoding.

Millimeter-wave (mmWave) and sub-mmWave technology, apparatuses, and methods that relate to receivers for wireless communications are described. The various aspects include an apparatus of a communication device including an antenna array and switching circuitry coupled to each antenna of the antenna array. The switching circuitry is configured to switch at a rate based on the center frequency of incoming communications on each respective antenna to generate at least two antenna patterns and provide the at least two antenna patterns to processing circuitry for decoding.

Methods and devices for performing dynamic compensation of a phased array RFID reader are disclosed herein. An example method includes configuring an RFID reader having an antenna array to compensate for determined antenna element phase-shift errors. The method includes exciting a reference antenna element of the antenna array, emitting an emitted signal, receiving the emitted signal via a receiver antenna element of the antenna array, and generating a received signal. The method further includes determining, by a processor, a phase shift of the received signal relative to the emitted signal, and determining a phase-shift error. The method then includes configuring the RFID reader to compensate for the determined phase-shift error associated with the receiver antenna element in response to receiving an RFID tag signal.

A wiring board includes an insulating layer comprising organic resin with inorganic particles, a first metal layer on a first surface, and a second metal layer disposed on a second surface. The insulating layer has a thickness of 75-1000 μm and a storage modulus of 4 GPa-7 GPa. The first metal layer has a thickness of 1.5-10 μm and a coverage of 5%-25%. The second metal layer has a thickness of 3-10 μm or 25-100 μm and a coverage of 85% or more. A surface part of the insulating layer on the first metal layer side has a higher ratio of organic resin than a surface part of the insulating layer on the second metal layer side.