The disclosed embodiments include downhole wet connection systems, and methods and apparatuses to provide an electrical connection between two downhole strings. In one embodiment, a wet connection system having a first electrode coupled to a load and deployed in a wellbore is disclosed. The wet connection system also includes a second electrode deployed along a string deployed in the wellbore and proximate to the first electrode. Further, the first electrode and the second electrode form a wet connection to transmit alternating current from the second electrode to the first electrode.

The disclosed embodiments include downhole wet connection systems, and methods and apparatuses to provide an electrical connection between two downhole strings. In one embodiment, a wet connection system having a first electrode coupled to a load and deployed in a wellbore is disclosed. The wet connection system also includes a second electrode deployed along a string deployed in the wellbore and proximate to the first electrode. Further, the first electrode and the second electrode form a wet connection to transmit alternating current from the second electrode to the first electrode.

An electronic rack includes a back panel, a number of server slots, and a number of server blades inserted therein. The back panel includes a heat removal liquid manifold to provide heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain an information technology (IT) component and a self-fitting coupling assembly having a first liquid intake connector and a first liquid outlet connector to self-align with a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold mounted on the back panel. The first liquid intake connector and the first liquid outlet connector are capable of moving around within a predetermined tolerance space with respect to the server tray.

An electronic rack includes a back panel, a number of server slots, and a number of server blades inserted therein. The back panel includes a heat removal liquid manifold to provide heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain an information technology (IT) component and a self-fitting coupling assembly having a first liquid intake connector and a first liquid outlet connector to self-align with a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold mounted on the back panel. The first liquid intake connector and the first liquid outlet connector are capable of moving around within a predetermined tolerance space with respect to the server tray.

Examples disclosed herein relate to an electrical connector interfacing a solid conductor and a liquid conductor. One example provides a connector for connecting to a liquid metal circuit element, the connector having a body defining a channel configured to contain a liquid metal, the body being configured to interface mechanically with the liquid metal circuit element, and a conductive path disposed within the channel and exposed to an interior of the channel to form a first electrical interface configured to interface with the liquid metal circuit element, the conductive path also comprising a second electrical interface.

Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.

Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.

An electronic rack includes a back panel, a number of server slots, and a number of server blades inserted therein. The back panel includes a heat removal liquid manifold to provide heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain an information technology (IT) component and a self-fitting coupling assembly having a first liquid intake connector and a first liquid outlet connector to self-align with a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold mounted on the back panel. The first liquid intake connector and the first liquid outlet connector are capable of moving around within a predetermined tolerance space with respect to the server tray.

An electronic rack includes a back panel, a number of server slots, and a number of server blades inserted therein. The back panel includes a heat removal liquid manifold to provide heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain an information technology (IT) component and a self-fitting coupling assembly having a first liquid intake connector and a first liquid outlet connector to self-align with a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold mounted on the back panel. The first liquid intake connector and the first liquid outlet connector are capable of moving around within a predetermined tolerance space with respect to the server tray.

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate with a first surface and a second surface opposite from the first surface. In an embodiment, pads are on the first surface of the package substrate, where the pads have a first width. In an embodiment, a layer is on the first surface of the package substrate, where the layer comprises wells through the layer, and where the wells have a second width that is wider than the first width. In an embodiment, a liquid metal is in the wells and in contact with the pads.