An apparatus can dynamically adjust, in a card edge connector including first and second positions, an opening configured to receive a printed-circuit card. The apparatus may also include a set of contacts configured to connect with a set of edges of the printed-circuit card in the second position. The apparatus may also include a set of electroactive polymers configured to adjust the set of contacts between the first position and the second position by changing thickness in response to voltages applied to electrodes positioned adjacent to opposing faces of the set of electroactive polymers. The set of electroactive polymers can also include an electroactive polymer configured to control a single contact of the set of contacts.

A terminal having memory function, including a memory contact section that includes a plurality of contact claws. All or part of the contact claw is made of a memory alloy. The plurality of contact claws are arranged at intervals in a circumferential direction of the memory contact section, and the plurality of contact claws are capable of radially contracting. The terminal having memory function can realize a butting without an insertion force, and ensure a contact area and a contact force between a terminal and a mating terminal by a temperature rise during working, and improve contact reliability. Since the insertion force is not required, the work is easier and the working efficiency is improved.

Connector devices or connectors for use in interconnection to a circuit board may be configured in an open or closed configuration. The connectors devices may utilize a shape memory alloy (SMA) actuator to move clamping portions with respect to each other into one or both of the open or closed positions.

Connector devices or connectors for use in interconnection to a circuit board may be configured in an open or closed configuration. The connectors devices may utilize a shape memory alloy (SMA) actuator to move clamping portions with respect to each other into one or both of the open or closed positions.

The disclosure relates to a modular plug connector which has a plug comprising a plurality of plug modules and has a mating plug comprising a plurality of mating plug modules, in which each plug module forms a plug module pair with a mating plug module, wherein the plug and the mating plug can assume an interconnected state and wherein at least one of the plug module pairs has at least one locking device, which can assume a locking state in the interconnected state of the plug and the mating plug, in which locking state the locking device prevents the plug module and the mating plug module of said plug module pair from separating from each other.

A flexible electronic circuit includes a shape memory material disposed within a flexible dielectric material.

An electrical arrangement (10), including: a first conductor (12) having a first generally planar contact area (34); a second conductor (12) having a second generally planar contact area (40); an intermediate conductor (44) having a first faying area (84) overlying the first contact area and a second faying area (86) overlying the second contact area; a compression arrangement configured to compress the first faying area and the first contact area toward each other and to compress the second faying area and the second contact area toward each other; and a dimpling structure (46) effective to create plural contact points (74) between the first faying area and the first contact area and between the second faying area and the second contact area when the first and the second faying areas and the first and second contact areas are compressed toward each other by the compression arrangement.

A circuit interconnect generally comprises an electrical connection pad, a shape memory material, and a flowable conductor. The electrical connection pad has an upper surface, a portion of which is covered by the shape memory material. The flowable conductor extends through the shape memory material and is electrically coupled to the electrical connection pad. The shape memory material has a first configuration at a first temperature and a second configuration at a second temperature. In the instance of the second temperature being greater than the first, the shape memory material has a first configuration that is substantially planar and a second configuration that is cupped.

A circuit interconnect generally comprises an electrical connection pad, a shape memory material, and a flowable conductor. The electrical connection pad has an upper surface, a portion of which is covered by the shape memory material. The flowable conductor extends through the shape memory material and is electrically coupled to the electrical connection pad. The shape memory material has a first configuration at a first temperature and a second configuration at a second temperature. In the instance of the second temperature being greater than the first, the shape memory material has a first configuration that is substantially planar and a second configuration that is cupped.

The present embodiments relate to a shape memory alloy (SMA) actuator with a reduced number of materials for manufacturing the actuator. In some instances, elements of the SMA actuator can comprise a dielectric material disposed on the actuator via an injection molding process. In other instances, the SMA actuator can dispose SMA wires above a base of the SMA actuator without the use of any dielectric material. In a first example, an SMA actuator can include a carriage and a base. The base can include a fixed end fixed to the carriage, a free end, a beam connecting the fixed end and the free end, and at least one SMA wire. The SMA actuator can also include an insulator comprising a dielectric material electrically isolating a set of electrical contacts at the fixed end.