H01R4/02

Electrical Contact Part and Method for Manufacturing an Electrical Contact Part
20230107114 · 2023-04-06 ·

An electrical contact part comprising, a carrier substrate of a metallic material, a metallic coating applied to the carrier substrate, and a coating barrier material applied to the carrier substrate in a partial area of the carrier substrate, wherein the coating barrier material substantially prevents coating of the carrier substrate in the portion.

WIRE HARNESS

A wire harness including: a core wire having a parent braided wire obtained by braiding together assembled wires including twisted wires; and a metal terminal welded to the parent braided wire of the core wire, wherein the twisted wires forming the parent braided wire include a first twisted wire twisted in a first rotation direction and a second twisted wire twisted in a second rotation direction opposite to the first rotation direction.

CABLE CONNECTION STRUCTURE
20220319960 · 2022-10-06 ·

A cable connection structure is provided with an electronic component including electrodes on an electrode-forming surface, a cable including electric wires connected to the electrodes respectively, and a buried member which is composed of a cured resin and embedded with the electric wires. At least three electric wires are separating wires including separating regions being separated from each other in the normal direction as being distant from the electrode-forming surface. At least three electrodes are arranged side by side on a virtual circle. At least three separating wires are connected to the at least three electrodes. The separating regions of the at least three separating wires are provided to be located eccentric radially outwardly in the virtual circle as being distant from the electrode surface in the normal direction of the electrode-forming surface. An angle between the separating region and the normal direction of the electrode-forming surface is 10 degrees or more and 45 degrees or less.

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

A semiconductor module includes an insulating sheet which has a first surface and extends in a first direction and a first terminal. The first terminal has a first region disposed on the first surface of the insulating sheet and having a first width in a second direction perpendicular to the first direction, a second region extending from the first region and having a second width in the second direction narrower than the first width, and a third region located away from the first surface and being electrically connected to both the first region and the second region.

Terminal assembly

A terminal assembly is disclosed. The terminal assembly comprises a main body having a welding platform and a first electrical conductive member having a connection terminal. According to the present invention, a welded structure is formed between the main body and the first electrical conductive member by making the connection terminal be welded on the welding platform. Briefly speaking, when utilizing this terminal assembly to make two electrical nodes be electrically connected to each other, one electrical conductive end of the main body and the first electrical conductive member are firstly connected to the two electrical nodes, respectively. Next, a welding process is applied to the welding platform and the connection terminal, such that an electrical connection is therefore established between the two electrical nodes.

Grounding block and grounding method for electrified vehicle traction battery

An electrified vehicle assembly includes, among other things, a grounding block secured to a frame member of an electrified vehicle. The grounding block includes a bore configured to receive a fastener to hold a grounding strap connector relative to the grounding block.

Method for forming a connection between a busbar and a contact section, a busbar having a contact section and power distribution system having such busbar
20230208089 · 2023-06-29 ·

A method for forming a connection between a busbar (1) and a contact section (20) comprising: providing a first conductive section (11) made from aluminum, providing a second conductive section (12) made from aluminum, wherein the second conductive section (12) includes the contact section (20) or is connected to the contact section (20) and wherein the second conductive section (12) is at least partially covered with nickel and/or tin creating a laser welding bond, in particular a laser welding seam (10), between the first conductive section (11) and the second conductive section (12), by laser welding.

System including a sensor and an electrical cable

A system including a sensor and an electrical cable including electrical conductors, which are provided with an electrically insulating sheathing, the sensor being accommodated in a housing, the conductors of the cable are exposed from the sheathing at certain locations and the housing is fastened in an integrally bonded or form-fitting manner on the conductors of the cable at the exposed locations in the sheathing, and an electrically insulating sheathing is provided, which encloses the housing in a form-fitting manner and covers at least the cable in the area of the housing.

System including a sensor and an electrical cable

A system including a sensor and an electrical cable including electrical conductors, which are provided with an electrically insulating sheathing, the sensor being accommodated in a housing, the conductors of the cable are exposed from the sheathing at certain locations and the housing is fastened in an integrally bonded or form-fitting manner on the conductors of the cable at the exposed locations in the sheathing, and an electrically insulating sheathing is provided, which encloses the housing in a form-fitting manner and covers at least the cable in the area of the housing.

Flexible printed circuit and printed circuit board soldered structure

A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.