This invention provides a polymer thick film electrically conductive paste composition, comprising conductive metal powder, a resin blend of polyol and phenoxy resin, blocked aliphatic polyisocyanate and one or more polar, aprotic solvents. In one embodiment the paste composition is used to form electrically conductive adhesive. In another embodiment the paste composition is used to form an electrically conductive polymer thick film.

A coaxial cable connector assembly includes a coupler defining an inner channel extending through the coupler and an outer conductor engagement feature extending inwardly from the inner channel, a rear body, positioned rearward of the coupler, defining a cable channel extending through the rear body, and structurally configured to receive the coaxial cable, and an adhesive reservoir positioned at least partially within the cable channel of the rear body, the adhesive reservoir including an adhesive and an adhesive reservoir breakable material that encapsulates the adhesive, where the adhesive reservoir breakable material is structurally configured to fracture upon the application of force exceeding a predetermined threshold, thereby releasing the adhesive from the adhesive reservoir to adhesively couple the coaxial cable to the rear body.

A coaxial cable connector assembly includes a coupler defining an inner channel extending through the coupler and an outer conductor engagement feature extending inwardly from the inner channel, a rear body, positioned rearward of the coupler, defining a cable channel extending through the rear body, and structurally configured to receive the coaxial cable, and an adhesive reservoir positioned at least partially within the cable channel of the rear body, the adhesive reservoir including an adhesive and an adhesive reservoir breakable material that encapsulates the adhesive, where the adhesive reservoir breakable material is structurally configured to fracture upon the application of force exceeding a predetermined threshold, thereby releasing the adhesive from the adhesive reservoir to adhesively couple the coaxial cable to the rear body.

A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board.

A light-emitting device according to an embodiment is provided with: a light-emitting panel including a first board that is light transmissive and flexible, a plurality of conductor patterns formed on a surface of the first board, a plurality of light-emitting elements connected to one of the conductor patterns, and a second board that is light transmissive and flexible and that holds the light-emitting elements relative to the first board; and a flexible wiring board including a circuit pattern that is electrically connected via an anisotropic conductive layer to an exposed part of the conductor patterns formed on the first board, the exposed part being exposed by the end of the second board.

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

An adhesive film including a first adhesive layer, wherein the first adhesive layer contains a first adhesive component and a plurality of conductive particles, wherein the plurality of conductive particles include first conductive particles that are dendritic conductive particles, and second conductive particles that are conductive particles other than the first conductive particles, each conductive particle containing a non-conductive core and a conductive layer provided on the core, and a part of the plurality of conductive particles is disposed to protrude from one surface of the first adhesive layer.

An adhesive film including a first adhesive layer, wherein the first adhesive layer contains a first adhesive component and a plurality of conductive particles, wherein the plurality of conductive particles include first conductive particles that are dendritic conductive particles, and second conductive particles that are conductive particles other than the first conductive particles, each conductive particle containing a non-conductive core and a conductive layer provided on the core, and a part of the plurality of conductive particles is disposed to protrude from one surface of the first adhesive layer.

An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.