A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

This anisotropic conductive sheet has: an insulation layer that has a first surface and a second surface and that is formed of a first resin composition; a plurality of resinous columns that are formed of a second resin composition and that are disposed so as to extend in the thickness direction within the insulation layer; and a plurality of conductive layers that are disposed between the insulation layer and the plurality of resinous columns and that are exposed outside the second surface and the first surface.

A housing includes: a box-shaped main body portion accommodating an electronic circuit substrate and including an opening portion; a lid portion covering the opening portion so as to be able to open or close the opening portion; a jumper detachably attached to the electronic circuit substrate; a window portion different from the opening portion, the window portion being opposed to the jumper and being open at the main body portion; and a cover portion covering the window portion so as to be able to open or close the window portion.

A housing includes: a box-shaped main body portion accommodating an electronic circuit substrate and including an opening portion; a lid portion covering the opening portion so as to be able to open or close the opening portion; a jumper detachably attached to the electronic circuit substrate; a window portion different from the opening portion, the window portion being opposed to the jumper and being open at the main body portion; and a cover portion covering the window portion so as to be able to open or close the window portion.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

A bus-bar system 100 includes at least one bus-bar terminal 10. Each Bus-bar terminal 10 includes a first portion 10a, a second portion 10b and an intermediate portion 10c. The first portion 10a is connected to a heating element 20 of a heating block 22. The second portion 10b is connected to a Printed Circuit Board (PCB) 30 held within a casing 32 and the intermediate portion 10c connects the first portion 10a to the second portion 10b. The first portion 10a and the second portion 10b are offset from each other and the offset is based on desired position and orientation of the Printed Circuit Board (PCB) 30 held inside the casing 32 with respect to the heating elements 20.

A bus-bar system 100 includes at least one bus-bar terminal 10. Each Bus-bar terminal 10 includes a first portion 10a, a second portion 10b and an intermediate portion 10c. The first portion 10a is connected to a heating element 20 of a heating block 22. The second portion 10b is connected to a Printed Circuit Board (PCB) 30 held within a casing 32 and the intermediate portion 10c connects the first portion 10a to the second portion 10b. The first portion 10a and the second portion 10b are offset from each other and the offset is based on desired position and orientation of the Printed Circuit Board (PCB) 30 held inside the casing 32 with respect to the heating elements 20.

One aspect of the present invention is an adhesive film comprising: a first adhesive layer comprising a first adhesive component, a first conductive particle that is a dendritic conductive particle, and a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body; and a second adhesive layer comprising a second adhesive component, wherein a volume proportion of the second adhesive component in the second adhesive layer is larger than a volume proportion of the first adhesive component in the first adhesive layer.

The present invention provides covered particles wherein insulating layers cover the surfaces of electroconductive particles, and the covered particles are excellent in the adhesion between the surfaces of the electroconductive particles and the insulating layers. The covered particles includes: electroconductive particles in which metal films are formed on the surfaces of core materials, and a triazole-based compound is disposed on the outer surfaces on the sides opposite to the core materials in the metal films; and insulating layers covering the electroconductive particles, and the insulating layers comprise a compound having phosphonium groups.