A connector includes: a contact batch that is composed of two or more groups of contacts; an inner shield that electrically separates the two or more groups of contacts from each other; a body in which the contact batch and the inner shield are press-fitted and fixed; and a shell that covers the contact batch, the inner shield, and the body.

A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

A connector includes a housing; a cage surrounding the housing; first contacts that are located in the housing and that transmit high-speed signals; second contacts that are located in the housing, that transmit low-speed signals, and that each include a portion that extends from a top surface of the housing; first cables connected to the first contacts; and second cables connected to the second contacts.

A plug connector (1) for connection of a data line, having a plug housing (2) with one or more connection elements (3) each connection element being for connection of a respective wire of the data line. The connection elements have one or more contact elements (4), and one or more conductor elements (5), via each of which a connection element (3) is electrically conductively connected to a contact element (4). Return damping of the plug connector (1) is reduced in that at least one portion (6) of the individual conductor elements (5) or at least one portion of the individual contact elements (4) is designed and arranged such that the wave impedance of the portion (6) is purposefully mismatched so that the value of the wave impedance deviates from the nominal wave impedance of the data line.

A plug connector (1) for connection of a data line, having a plug housing (2) with one or more connection elements (3) each connection element being for connection of a respective wire of the data line. The connection elements have one or more contact elements (4), and one or more conductor elements (5), via each of which a connection element (3) is electrically conductively connected to a contact element (4). Return damping of the plug connector (1) is reduced in that at least one portion (6) of the individual conductor elements (5) or at least one portion of the individual contact elements (4) is designed and arranged such that the wave impedance of the portion (6) is purposefully mismatched so that the value of the wave impedance deviates from the nominal wave impedance of the data line.

The semiconductor chip includes a semiconductor substrate having a surface, a circuit formed on the surface, and a plurality of pillars coupled to the surface adjacent to the circuit. The plurality of pillars is thermally conductive and is thermally coupled to the circuit so as to dissipate heat generated by the circuit. The semiconductor substrate, circuit, and plurality of pillars are integral parts of the integrated semiconductor chip. A method of fabricating the integrated semiconductor chip includes providing a semiconductor substrate having a surface. The method includes forming a circuit on the surface, and forming a plurality of pillars thermally coupled to the surface adjacent to the circuit.

The semiconductor chip includes a semiconductor substrate having a surface, a circuit formed on the surface, and a plurality of pillars coupled to the surface adjacent to the circuit. The plurality of pillars is thermally conductive and is thermally coupled to the circuit so as to dissipate heat generated by the circuit. The semiconductor substrate, circuit, and plurality of pillars are integral parts of the integrated semiconductor chip. A method of fabricating the integrated semiconductor chip includes providing a semiconductor substrate having a surface. The method includes forming a circuit on the surface, and forming a plurality of pillars thermally coupled to the surface adjacent to the circuit.

The invention is applicable to the technical field of connectors, and in particular, relates to a terminal structure for a high-speed data transmission connector and a connector thereof. The terminal structure for a high-speed data transmission connector comprises an upper row terminal and a lower row terminal respectively assembled at an upper end and a lower end of an insulating body of the high-speed data transmission connector, and electrically connected to a PCB motherboard of the high-speed data transmission connector, the upper row terminal comprising a front-end terminal and a rear-end terminal connected to each other, and the terminal structure further comprises: a first anti-resonance module comprising a first conducting member disposed on the front-end terminal; and a second anti-resonance module comprising a second conducting member disposed on the rear-end terminal; wherein an exterior angle at connection of the front-end terminal and the rear-end terminal is from 55° to 80°. In view of this, the application improves anti-resonance effect of the terminal structure and the connector.

An interposer includes a housing having a plurality of through-holes penetrating a first surface and a second surface and a signal contact pair composed of a pair of signal contacts. Each of the signal contacts includes a base portion press-fitted in one of the through-holes, a first contact beam extending from the base portion beyond the first surface, and a second contact beam extending from the base portion beyond the second surface. The pair of signal contacts are positioned adjacently to each other widthwise and are each asymmetrical with respect to a width direction. A first minimum spacing between the first contact beams of the pair of signal contacts is narrower than a second minimum spacing between the base portions of the pair of signal contacts. The signal contact pair has a plane-symmetrical shape with respect to the width direction.