A sheet type conductive member includes a tongue portion projecting in a tongue shape in a predetermined plane, a contact arrangement region in which a contact of a connector is arranged being laid out on a front surface of the sheet type conductive member, a first flexible conductor being exposed on the contact arrangement region, a second flexible conductor being exposed on a rear surface of the tongue portion, at least part of the tongue portion being folded back to a front surface side of the sheet type conductive member so that a contact connecting portion composed of part of the first flexible conductor and part of the second flexible conductor is formed in the contact arrangement region.

A mating connector that is rotatable and wet-mateable is disclosed herein. The connector has mating components that can be characterized as male and female. The connector may have one or more electrical and/or non-electrical contacts. As used herein, wet-mateable or wet-connectable means proper mating of the male and female components can be achieved even in the presence of conductive fluid. Being rotatable means the male and female components can be rotated independently during the mating process. A male component of a rotatable and wet-mateable mating connector is provided that has conductive and non-conductive sealing elements. A female component of the rotatable and wet-mateable mating connector is provided having conductive elements that are complementary to the male component. The male component is inserted into a chamber within the female component to produce the rotatable and wet-mateable mating connector.

An improved method and structure is provided for constructing elastomeric pin arrays using a non-conductive medium and compression limiters. Pin to pin of the same elastomeric material, pin to pin of similar elastomeric material, or pin to metal cap structure interconnects are constructed using an elastomeric connection through a non-conductive medium. Compression limiting structures are mated to the non-conductive medium. This structure eliminates the need for PCB structures as the medium reducing manufacturing cost.

The present invention relates to a method for producing at least one high-frequency contact element or a high-frequency contact element arrangement comprising at least one such high-frequency contact element. The method includes producing a basic body part of each high-frequency contact element from a dielectric material by means of an additive manufacturing method, wherein the basic body part has a bushing between a first end and a second end of a longitudinal extent of the basic body part. In addition, the method includes coating the dielectric basic body part with an electrically conductive layer and removing the electrically conductive layer in a region surrounding the bushing at the first end and at the second end of the basic body part so as to form an electrically conductive coating on the outer conductor side and an electrically conductive coating on the inner conductor side. The present invention also relates to a high-frequency contact element or a high-frequency contact element arrangement.

The present invention relates to a method for producing a high-frequency connector. The method includes producing a basic body part from a dielectric material by means of an additive manufacturing method. The basic body part has a bushing between a first end and a second end of a longitudinal extent of the basic body part and an end face at the first end for making contact with a mating connector. In addition, the method includes coating the dielectric basic body part with an electrically conductive layer and removing the electrically conductive layer in a region surrounding the bushing in each case at the end face at the first end and at the second end of the basic body part so as to form an electrically conductive coating on the outer conductor side and an electrically conductive coating on the inner conductor side. The present invention also relates to a high-frequency connector.

Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements.

A contact element (1) for establishing electric contact between two contact pieces (K1, K2) comprises a support strip (2), which extends in a longitudinal direction (L) and is designed in such a way that the length of the support strip (2) changes in the longitudinal direction (L) when a force (F) is applied to the support strip (2), as well as a plurality of contact parts (5, 5a, 5b), each of which has a first contact section (6) for contacting one of the two contact pieces (K1, K2), a second contact section (7) for contacting the other one of the two contact pieces (K2, K1), and a fastening section (8) for securing the contact part (5, 5a, 5b) to the support strip (2).

A contact element (1) for establishing electric contact between two contact pieces (K1, K2) comprises a support strip (2) extending in a longitudinal direction (L) as well as a plurality of contact parts (5, 5a, 5b), each of which has a first contact section (6) for contacting one of the two contact pieces (K1, K2), a second contact section (7) for contacting the other one of the two contact pieces (K2, K1), and a fastening section (8) for securing the contact part (5, 5a, 5b) to the support strip (2).

Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements.

A contact and a manufacturing method thereof are provided. The contact includes a metal cylinder formed as a single body, the metal cylinder has an undulant sidewall having a slit, the sidewall of the metal cylinder includes a plurality of inward-concave structures and a plurality of outward-convex structures extending in a length direction of the metal cylinder, the plurality of inward-concave structures are recessed toward a central axis of the metal cylinder, and the plurality of outward-convex structures protrude away from the central axis of the metal cylinder. The contact according to the present disclosure may transmit a large current or signal, and have low loss in electric power.