Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements.

Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements.

A connection component can be firmly secured to an adherend member, in a state where a conductive member is compressed, to prevent a bubble from remaining in a securing member. The connection component includes a metal terminal, the conductive member provided on one surface of the metal terminal and deformable by compression, the securing member bonded to one surface of the metal terminal, and an exhaust path provided in at least one of the metal terminal and the securing member. The exhaust path is connected to or provided in at least one of a first securing surface of the securing member that is bonded to the metal terminal, and a second securing surface that is opposite to the first securing surface. The exhaust path exhausts a bubble generated in at least one of the first securing surface and the second securing surface.

Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements

Disclosed is an elastic electric contact terminal comprising: an elastic core; a polymer film which is bonded while covering the core, with an adhesive layer being interposed therebetween; and a copper foil capable of being soldered, which is bonded while covering the polymer film. A metal plating layer is formed on every surface exposed outwardly from the copper foil.

A receptacle includes a first and a second insulating housing, and a shielding plate. The first housing has a first base and a first tongue extending forwardly, the first tongue having a slant connection portion located close to the first base. The second housing has a second base and a second tongue extending forwardly, the second tongue has a slant connection portion located close to the second base. A plurality of first contacts is carried within the first housing, a plurality of second contacts is carried within the second housing. Each contact has a contacting portion, an affixed portion, and a soldering portion. The plate is sandwiched between the first and second housing and has a slant connection portion sandwiched between the connection portions of the two housing. The first housing defines a first stepping portion going through an opening on the plate and pressing against the second housing.

In some aspects, the techniques described herein relate to an apparatus for connecting cables to Input Output (IO) connector pins, including: a first Printed Circuit Board (PCB) configured to receive terminal ends of a plurality of cables, wherein the terminal ends of the plurality of cables are electrically isolated from one another in the first PCB; a second PCB configured to receive a plurality of IO connector pins, wherein the plurality of IO connector pins are electrically isolated from one another in the second PCB; and wherein the first PCB is configured to join to the second PCB to connect each of the terminal ends of the plurality of cables to corresponding pins of the plurality of IO connector pins.

A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.

A method for transferring objects onto a substrate, or running substrate, the objects to be transferred being placed in a transfer area containing a carrier liquid forming a conveyor, the objects being held by a compact film of particles floating on the carrier liquid of the transfer area, within which the objects are displaced with the film of particles to be transferred onto the substrate, making at least one connector on at least one of the objects, the connector being made by a substance comprising a polymerizable compound, put in contact with the object arranged within the transfer area, and then by polymerization of the substance.

A contact connection structure includes: a first contact portion including an indent portion spherically protruding, the first contact portion including a plating layer formed on a surface of the first contact portion; and a second contact portion including a plating layer formed on a surface of the second contact portion. The indent portion of the first contact portion is slidable on a contact surface of the second contact portion. The indent portion of the first contact portion at a terminal insertion completed position is in contact with the second contact portion. The contact surface of the second contact portion includes an oxide-film shaving portion having an annular arc portion curved along a circumference portion of the indent portion.