An optoelectronic component includes an optical module and a host circuit board. The optical module includes a module circuit board and a gold finger that is located on a first surface of the module circuit board. The host circuit board includes a conductive elastomer corresponding to the gold finger and that is located on a first surface of the host circuit board. The module circuit board is located on the host circuit board, the first surface of the module circuit board and the first surface of the host circuit board face each other, and the gold finger is in contact with the conductive elastomer.

Flexible and low cost power interconnects. The interconnect includes a plug with an insulative support and a plurality of electrical contacts mounted to exterior surfaces of the insulative support. The plug may be simply formed with molding and stamping operations. In use, the plug may be connected in an electrical assembly to support one or multiple power circuits in a compact space. A receptacle for receiving the plug may have an opening with sides bounded by rows of independent electrical contacts that may similarly be connected to one or more power circuits within a printed circuit board to which the receptacle is mounted. The plug and receptacle may be configured such that, when the receptacle connector and plug are each mounted to substrates and the connectors are mated, the substrates are spaced 6 mm, 5 mm, or less.

Flexible and low cost power interconnects. The interconnect includes a plug with an insulative support and a plurality of electrical contacts mounted to exterior surfaces of the insulative support. The plug may be simply formed with molding and stamping operations. In use, the plug may be connected in an electrical assembly to support one or multiple power circuits in a compact space. A receptacle for receiving the plug may have an opening with sides bounded by rows of independent electrical contacts that may similarly be connected to one or more power circuits within a printed circuit board to which the receptacle is mounted. The plug and receptacle may be configured such that, when the receptacle connector and plug are each mounted to substrates and the connectors are mated, the substrates are spaced 6 mm, 5 mm, or less.

In embodiments of the invention, the invention comprises a light tip cable including a cartridge assembly affixed to a medial end of the cable, the cartridge assembly including an emitter housing where the emitter housing includes an opening at a medial end of the housing and a flange at a lateral end of the housing. In embodiments of the invention, the cartridge assembly includes a light emitting element in the housing extending to the opening, retention features covering at least a portion of the housing, including the flange, the retention features comprising a lateral face and a lobe and at least one load bearing strand extending from the cable to the emitter; and electrical connectors extending from the cable to the light emitting element.

In embodiments of the invention, the invention comprises a light tip cable including a cartridge assembly affixed to a medial end of the cable, the cartridge assembly including an emitter housing where the emitter housing includes an opening at a medial end of the housing and a flange at a lateral end of the housing. In embodiments of the invention, the cartridge assembly includes a light emitting element in the housing extending to the opening, retention features covering at least a portion of the housing, including the flange, the retention features comprising a lateral face and a lobe and at least one load bearing strand extending from the cable to the emitter; and electrical connectors extending from the cable to the light emitting element.

An I/O device includes an I/O base, at least two I/O modules supported on the I/O base, and a duplex terminal block assembly supported on the I/O base. The at least two I/O modules include a first I/O module and a second I/O module coupled to the duplex terminal block assembly in parallel. The duplex terminal block assembly can include connectors for connecting to a field device. The duplex terminal block assembly can include conductive structures for coupling the connectors with each of the first and second I/O modules. The duplex terminal block can be installed in a pair of ports in an I/O base to connect two I/O modules in parallel.

An I/O device includes an I/O base, at least two I/O modules supported on the I/O base, and a duplex terminal block assembly supported on the I/O base. The at least two I/O modules include a first I/O module and a second I/O module coupled to the duplex terminal block assembly in parallel. The duplex terminal block assembly can include connectors for connecting to a field device. The duplex terminal block assembly can include conductive structures for coupling the connectors with each of the first and second I/O modules. The duplex terminal block can be installed in a pair of ports in an I/O base to connect two I/O modules in parallel.

A method for manufacturing an electro-mechanical device includes creating a plurality of substrates using a first additive manufacturing process. Each of the substrates includes a polymeric material. The substrates include a first substrate and a second substrate. The first substrate includes a first main body and defines a protrusion extending from the first main body. The second substrate includes a second main body and a recess defined in the second main body. The method includes coupling the first substrate to the second substrate by inserting the protrusion into the recess such that the protrusion elastically deforms to an elastically averaged configuration. The protrusion and the recess together form an elastic averaging coupling. The method includes creating a plurality of electrically conductive components using a second additive manufacturing process and then coupling the electrically conductive components to at least one of the substrates.

An electrical connector includes a plurality of cylindrical electrical terminals connected to ends of a plurality of first electrical cables, a housing defining a plurality of housing terminal cavities in which the plurality of cylindrical electrical terminals is disposed, and a cover attached to the housing having a plurality of cover cavities that is axially aligned with the plurality of housing terminal cavities. The plurality of cover cavities is configured to receive the plurality of cylindrical electrical terminals as it is inserted within the plurality of housing terminal cavities.

A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly that is subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via a downward force. The second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. The connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.