Patent classifications
H01S5/005
PASSIVELY Q-SWITCHED LASER WITH VARIABLE OUTPUT PULSE ENERGY
A passively Q-switched laser with adjustable pulse parameters and a method of controlling the pulse parameters is described. The laser has a pumped spot size in a gain element that may be adjusted to control the pulse energy. The laser has a laser resonator that may have a variable resonator length to control the pulse duration.
Optical module
This application provides an optical module, and relates to the field of optical communication. An optical module provided in the embodiments of this application includes a laser box and a silicon photonic chip that are enclosed and packaged by an upper enclosure part and a lower enclosure part. The laser box is disposed on and is in contact with the surface of the silicon photonic chip by the side wall or the base. The laser chip is disposed on the top plane of the laser box. The top plane is in contact with the upper enclosure part for heat dissipation, so as to help heat generated by the laser chip be conducted to the upper enclosure part via the top plane, so that the heat generated by the laser chip is dissipated not via the silicon photonic chip.
Acousto-optic modulator system and device with connections and related methods
An acousto-optic system may include a laser source, and an AOM coupled to the laser source and having an acousto-optic medium and transducer electrodes carried by the medium. The acousto-optic system may also include an interface board with a dielectric layer and signal contacts carried by the dielectric layer, and connections coupling respective signal contacts with respective transducer electrodes. Each connection may include a dielectric protrusion extending from the AOM, and an electrically conductive layer on the dielectric protrusion for coupling a respective transducer electrode to a respective signal contact.
Multi-Functional Ingester System For Additive Manufacturing
A method and an apparatus for collecting powder samples in real-time in powder bed fusion additive manufacturing may involves an ingester system for in-process collection and characterizations of powder samples. The collection may be performed periodically and uses the results of characterizations for adjustments in the powder bed fusion process. The ingester system of the present disclosure is capable of packaging powder samples collected in real-time into storage containers serving a multitude purposes of audit, process adjustments or actions.
OPTICAL FIBER STRUCTURES AND METHODS FOR VARYING LASER BEAM PROFILE
In various embodiments, the beam parameter product and/or numerical aperture of a laser beam is adjusted utilizing a step-clad optical fiber having a central core, a first cladding, an annular core, and a second cladding.
Manufacturable multi-emitter laser diode
A multi-emitter laser diode device includes a carrier chip singulated from a carrier wafer. The carrier chip has a length and a width, and the width defines a first pitch. The device also includes a plurality of epitaxial mesa dice regions transferred to the carrier chip from a substrate and attached to the carrier chip at a bond region. Each of the epitaxial mesa dice regions is arranged on the carrier chip in a substantially parallel configuration and positioned at a second pitch defining the distance between adjacent epitaxial mesa dice regions. Each of the plurality of epitaxial mesa dice regions includes epitaxial material, which includes an n-type cladding region, an active region having at least one active layer region, and a p-type cladding region. The device also includes one or more laser diode stripe regions, each of which has a pair of facets forming a cavity region.
Techniques for laser alignment in photonic integrated circuits
Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.
Widely tunable infrared source system and method
A system and method for tuning and infrared source laser in the Mid-IR wavelength range. The system and method comprising, at least, a plurality of individually tunable emitters, each emitter emitting a beam having a unique wavelength, a grating, a mirror positioned after the grating to receive at least one refracted order of light of at least one beam and to redirect the beam back towards the grating, and a micro-electro-mechanical systems device containing a plurality of adjustable micro-mirrors.
ULTRA-COMPACT HIGH POWER FIBER PUMP MODULE
An ultra-compact, high power, fiber pump module apparatus has a heatsink with a stepped outer shape. The heatsink has at least one interior cooling channel. A plurality of single emitter diodes is positioned on one step of the stepped outer shape of the heatsink, respectively. At least two beam-shifting structures are positioned in a beam path of each of the plurality of single emitter diodes. The at least two beam-shifting structures fold each beam emitted from the plurality of single emitter diodes in at least three dimensions. At least one beam combining structure is positioned in the beam path, wherein the at least one beam combining structure combines the beams from each of the plurality of single emitter diodes into a single, combined beam. The single, combined beam is output from the ultra-compact, high power, fiber pump module apparatus.
SHARED OPTIC ASSEMBLY FOR COMBINED DOT AND FLOOD ILLUMINATION MODULES
A shared optic assembly for combined flood and dot illumination modules is disclosed. The shared optic assembly includes a first high-powered VCSEL element for providing a flood beam and a second high-powered VCSEL element for providing a dot beam, where both the first and second VCSEL elements share the same optics and are incorporated onto the same module for space savings.