H01S5/20

METHOD FOR PRODUCING A RESONANT STRUCTURE OF A DISTRIBUTED-FEEDBACK SEMICONDUCTOR LASER
20170324217 · 2017-11-09 ·

A reproducible method for producing a resonant structure of a distributed-feedback semiconductor laser exhibiting a narrow waveguide of the order of some ten micrometers, the production of the diffraction grating being carried out subsequent to the step of producing the strip is provided. In a last step, a diffraction grating is engraved as a function of a desired precise wavelength.

LIGHT MODULE COMPRISING A LASER ELEMENT
20170324214 · 2017-11-09 · ·

The invention relates to a light module including a semiconductor laser element emitting a laser beam in a first cone of light, a photoluminescent element, and an optical means for transforming the light coming from the photoluminescent element into an exit light beam. The optical means has a guiding portion arranged to guide at least a portion of the light emitted in the first cone of light into a second cone of light and a device for detection of incident light. The light module comprises a means of deviation designed to deviate the light of the second cone of light toward a third cone of light directed toward the detection device arranged outside of the second cone of light.

Edge-emitting semiconductor laser and method for the production thereof

An edge-emitting semiconductor laser includes a semiconductor structure having a waveguide layer with an active layer, the waveguide layer extending in a longitudinal direction between first and second side facets of the semiconductor structure, the semiconductor structure has a tapering region adjacent to the first side facet, a thickness of the waveguide layer in the tapering region increases longitudinally, the waveguide layer is arranged between first and second cladding layers, a thickness of the second cladding layer in the tapering region of the semiconductor structure increases longitudinally, the tapering region includes first and second subregions, the first subregion is arranged closer to the first side facet than the second subregion, thickness of the waveguide layer increases longitudinally in the first subregion, thickness of the waveguide layer is constant in the longitudinal direction in the second subregion, and thickness of the second cladding layer increases longitudinally in the second subregion.

Semiconductor laser device
11211769 · 2021-12-28 · ·

A front facet of the semiconductor laser device includes a resonator facet portion containing an end of an active layer, and a protruding portion which protrudes beyond the resonator facet portion in a resonator length direction by a predetermined protrusion amount and has a stepped bottom surface portion. The resonator facet portion and the stepped bottom surface portion are connected to each other to form a corner portion. The distance from a thickness center position of the active layer to the stepped bottom surface portion is defined by a bottom surface portion depth. The bottom surface portion depth is set to be equal to a predetermined specific depth or deeper than the specific depth.

Reflector structure for tunable laser and tunable laser
11211767 · 2021-12-28 · ·

A reflector structure for a tunable laser and a tunable laser. A super structure grating is used as a reflector structure, and a suspended structure is formed around a region in which the super structure grating is located, to implement, using the suspended structure, thermal isolation around the region in which the super structure grating is located, and increase thermal resistance, such that less heat is lost, and heat is concentrated in the region in which the super structure grating is located, thereby improving thermal tuning efficiency of the reflector structure. Moreover, lateral support structures are disposed on two sides of the suspended structure, to provide a mechanical support for the suspended structure. In addition, regions in the super structure grating that correspond to any two lateral support structures on a same side of the suspended structure fall at different locations in a spatial period of the super structure grating.

Light emitting device, optical device, and information processing apparatus

A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

Highly Stable Semiconductor Lasers and Sensors for III-V and Silicon Photonic Integrated Circuits

Building blocks are provided for on-chip chemical sensors and other highly-compact photonic integrated circuits combining interband or quantum cascade lasers and detectors with passive waveguides and other components integrated on a III-V or silicon. A MWIR or LWIR laser source is evanescently coupled into a passive extended or resonant-cavity waveguide that provides evanescent coupling to a sample gas (or liquid) for spectroscopic chemical sensing. In the case of an ICL, the uppermost layer of this passive waveguide has a relatively high index of refraction that enables it to form the core of the waveguide, while the ambient air, consisting of the sample gas, functions as the top cladding layer. A fraction of the propagating light beam is absorbed by the sample gas if it contains a chemical species having a fingerprint absorption feature within the spectral linewidth of the laser emission.

INDEX AND GAIN COUPLED DISTRIBUTED FEEDBACK LASER
20210391692 · 2021-12-16 ·

A method of forming a laser involves forming, on a substrate, a first epitaxial part of the laser that includes at least an active region layer surrounded by first and second waveguide layers. A dielectric layer is formed over the first epitaxial part. Two or more mask openings are patterned within the dielectric layer. The mask openings extend normal to a light-propagation direction of the laser and are spaced apart in the light-propagation direction of the laser. A second epitaxial part of the laser is formed in the mask openings using selective area epitaxy. The second epitaxial part includes a refractive grating with three-dimensional grating features.

Semiconductor laser

The invention relates to a semiconductor laser comprising a layer structure comprising an active zone, wherein the active zone is configured to generate an electromagnetic radiation, wherein the layer structure comprises a sequence of layers, wherein two opposite end faces are provided in a Z-direction, wherein at least one end face is configured to at least partly couple out the electromagnetic radiation, and wherein the second end face is configured to at least partly reflect the electromagnetic radiation, wherein guide means are provided for forming an optical mode in a mode space between the end faces, wherein means are provided which hinder a formation of an optical mode outside the mode space, in particular modes comprising a propagation direction which do not extend perpendicularly to the end faces.

VERTICAL CAVITY SURFACE EMITTING LASER AND CORRESPONDING FABRICATING METHOD

A method of fabricating vertical cavity surface emitting laser, comprising: providing a first substrate formed with a dielectric DBR and a first bonding layer, and a second substrate formed with a etch-stop layer, a heavily doped layer, an active region, a current-confinement layer, and an arsenide DBR firstly, then sticking a third substrate on the arsenide DBR, then removing the second substrate and the etch-stop layer, next bonding the heavily doped layer to the dielectric DBR, next removing the third substrate, finally forming a p-type electrode contact and an n-type electrode contact.