A remote suppression unit retains a first set of surge suppression modules. A base suppression unit retains a second set of surge suppression modules. An over voltage protection (OVP) board in the remote suppression unit includes power strips that couple the first set of surge suppression modules to remote ends of DC power cables. A configurable terminal assembly in the base suppression unit couples the second set of suppression modules to local ends of the DC power cables. The surge suppression modules in combination with the OVP board and terminal assembly provide more suppression protection in both the remote and base suppression units. A remote voltage monitor circuit in the remote suppression unit measures voltages on remote ends of the DC power cables and transmits the voltages and alarm status to a monitor circuit in the base suppression unit.

A remote suppression unit retains a first set of surge suppression modules. A base suppression unit retains a second set of surge suppression modules. An over voltage protection (OVP) board in the remote suppression unit includes power strips that couple the first set of surge suppression modules to remote ends of DC power cables. A configurable terminal assembly in the base suppression unit couples the second set of suppression modules to local ends of the DC power cables. The surge suppression modules in combination with the OVP board and terminal assembly provide more suppression protection in both the remote and base suppression units. A remote voltage monitor circuit in the remote suppression unit measures voltages on remote ends of the DC power cables and transmits the voltages and alarm status to a monitor circuit in the base suppression unit.

The present invention is a spark gap protection capable of integrating into multiple layer semiconductor substrate packaging. The initial gap in the spark gap is solid and it can be converted into air, meaning gaseous, and the air gap is achieved by having the gap initially be filled with a solid and then running a voltage through the spark gap so that the gap explodes and the solid is replaced by an air cavity.

The present invention is a spark gap protection capable of integrating into multiple layer semiconductor substrate packaging. The initial gap in the spark gap is solid and it can be converted into air, meaning gaseous, and the air gap is achieved by having the gap initially be filled with a solid and then running a voltage through the spark gap so that the gap explodes and the solid is replaced by an air cavity.

A switch assembly for high voltage applications, where the switch assembly includes a traditional mechanical switch and a triggered gap device electrically coupled in parallel. The mechanical switch includes a first switch contact and a second switch contact, where one or both of the first switch contact and the second switch contact are movable to engage and disengage the first and second switch contacts to allow or prevent current flow therethrough. The triggered gap device includes a vacuum enclosure, a first stationary contact positioned within the enclosure and a second stationary contact positioned within the enclosure, where a gap is defined between the first and second stationary contacts. The triggered gap device further includes a plasma control device that allows creation of a plasma in the gap that causes an arc between the stationary contacts on the order of micro-seconds that allows current flow between the contacts.

A gas arrester is disclosed. In an embodiment a gas arrester for data line systems includes a discharge electrode, a plurality of individual electrodes for connection to data lines and a common gas discharge region formed between the individual electrodes and the discharge electrode.

A gas arrester is disclosed. In an embodiment a gas arrester for data line systems includes a discharge electrode, a plurality of individual electrodes for connection to data lines and a common gas discharge region formed between the individual electrodes and the discharge electrode.

An aircraft drive device (10) for creating propulsion and/or lift of an aircraft, the drive device comprising a rotating shaft (12), a rotating shaft bearing (14, 16), a rotating shaft drive machine (18) for rotationally driving the rotating shaft (12), and a housing (20), wherein the rotating shaft bearing (14,16) and the rotating shaft drive device (18) are arranged in an interior of the housing (44) and the rotating shaft (12) protrudes to the outside of the housing (20) through a housing opening (42) of the housing (20), wherein in the region of the housing opening (42) an overvoltage arrester device (52) is arranged which is designed for diverting an overvoltage present at the rotating shaft (12).

An aircraft drive device (10) for creating propulsion and/or lift of an aircraft, the drive device comprising a rotating shaft (12), a rotating shaft bearing (14, 16), a rotating shaft drive machine (18) for rotationally driving the rotating shaft (12), and a housing (20), wherein the rotating shaft bearing (14,16) and the rotating shaft drive device (18) are arranged in an interior of the housing (44) and the rotating shaft (12) protrudes to the outside of the housing (20) through a housing opening (42) of the housing (20), wherein in the region of the housing opening (42) an overvoltage arrester device (52) is arranged which is designed for diverting an overvoltage present at the rotating shaft (12).

A feedthrough device for protecting a system from an electrical transient may include a housing having a first end and a second end spaced apart from the first end in a longitudinal direction. A conductive line may extend through the housing from the first end to the second end of the housing. The conductive line may define an input end proximate the first end of the housing and an output end proximate the second end of the housing for connecting the feedthrough device with the system to be protected. A filter may be disposed within the housing and coupled with the conductive line at a first location. A gas discharge tube may be disposed within the housing and coupled with the conductive line at a second location on the conductive line that is proximate the filter and between the input end of the conductive line and the first location.