The invention relates to a building automation device which can be recessed in an electrical box, which adapts to the various communication requirements, which comprises a communication module with a communication bus, an application module which implements the functionality of the device, and a bus connector between the two modules, in which said bus connector serves to supply and transfer data, the communication module comprises a first base, the application module comprises a second base, during use, second side faces of the second base are inserted into a first opening of the first base, and the first base is joined to the second base via first attachment means.

The invention relates to a building automation device which can be recessed in an electrical box, which adapts to the various communication requirements, which comprises a communication module with a communication bus, an application module which implements the functionality of the device, and a bus connector between the two modules, in which said bus connector serves to supply and transfer data, the communication module comprises a first base, the application module comprises a second base, during use, second side faces of the second base are inserted into a first opening of the first base, and the first base is joined to the second base via first attachment means.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

A load center assembly is provided. The load center assembly comprises a frame, an electrical panel assembly, and a plurality of electrical wire harnesses. The frame includes a first side and a second side. The first side and the second side are substantially parallel and connected by a plurality of cross members. The electrical panel assembly is connected to the first side and the second side. The electrical panel assembly includes a plurality of breakers. The plurality of electrical wires harnesses is connected to the frame. Each of the plurality of electrical wire harnesses includes a plurality of wires. A first end of each wire of the plurality of wires is routed into the electrical panel assembly and is terminated in a corresponding breaker. The load center assembly is configured to be disposed in a wall frame.

A load center assembly is provided. The load center assembly comprises a frame, an electrical panel assembly, and a plurality of electrical wire harnesses. The frame includes a first side and a second side. The first side and the second side are substantially parallel and connected by a plurality of cross members. The electrical panel assembly is connected to the first side and the second side. The electrical panel assembly includes a plurality of breakers. The plurality of electrical wires harnesses is connected to the frame. Each of the plurality of electrical wire harnesses includes a plurality of wires. A first end of each wire of the plurality of wires is routed into the electrical panel assembly and is terminated in a corresponding breaker. The load center assembly is configured to be disposed in a wall frame.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

A bushing for a metal clad medium voltage switchgear includes: a hollow body. The body is made of polyamide. A first end of the body connects to a compartment of the medium voltage switchgear. A second end of the body connects to a T-off and pin. In an embodiment, a body portion extends from the first end of the body to the second end of the body. The body portion is circular shaped about an axis extending from the first end of the body to the second end of the body.

A bushing for a metal clad medium voltage switchgear includes: a hollow body. The body is made of polyamide. A first end of the body connects to a compartment of the medium voltage switchgear. A second end of the body connects to a T-off and pin. In an embodiment, a body portion extends from the first end of the body to the second end of the body. The body portion is circular shaped about an axis extending from the first end of the body to the second end of the body.