The invention concerns an electrical assembly comprising a cooling module, in particular an active cooling module comprising a network in which a cooling liquid flows and an electrical busbar, where the said electrical busbar is attached directly to a portion for receiving the cooling module, where the said electrical assembly is configured to be added in a frame of a first electrical device.

The invention concerns an electrical assembly comprising a cooling module, in particular an active cooling module comprising a network in which a cooling liquid flows and an electrical busbar, where the said electrical busbar is attached directly to a portion for receiving the cooling module, where the said electrical assembly is configured to be added in a frame of a first electrical device.

A busbar assembly includes a mesh busbar configured to electrically couple a first component to a second component. An electrical coupling method including securing a mesh busbar to a first component and a second component to electrical couple the first component to the second component.

A busbar assembly includes a mesh busbar configured to electrically couple a first component to a second component. An electrical coupling method including securing a mesh busbar to a first component and a second component to electrical couple the first component to the second component.

A bus bar module includes a bus bar that is formed of a plate-shaped piece of metal, a thermally conductive sheet that is in close contact with an outer periphery of the bus bar and that has an extension portion extending outward from the bus bar, and an insulating case that covers the bus bar and the thermally conductive sheet. An accommodation space S in which the extension portion is accommodated with a gap left between the extension portion and the bus bar is provided between the bus bar and the case. Through holes through which the accommodation space S is in communication with an external space are formed penetrating the case.

For dissipating heat a cladding includes a dissipation tape and a particle coating. The dissipation tape includes dissipation ridges that dissipate infrared radiation at a dissipation angle. The particle coating is deposited on the dissipation tape.

For dissipating heat a cladding includes a dissipation tape and a particle coating. The dissipation tape includes dissipation ridges that dissipate infrared radiation at a dissipation angle. The particle coating is deposited on the dissipation tape.

An electric device includes a partition wall configured to partition between a motor chamber having a relatively high pressure and an inverter chamber having a relatively low pressure; an inverter, which is provided in the inverter chamber, and is configured to supply power; a motor, which is provided in the motor chamber, and is configured to operate with supply of power from the inverter; and a bus-bar device, which is mounted to the partition wall by being inserted into a partition wall through hole formed in the partition wall, and is configured to connect the inverter and the motor to each other. The bus-bar device includes a bus bar configured to connect the inverter and the motor to each other; a plate portion into which the bus bar is inserted; and a resin portion.

An electrical junction box configured to be disposed between a power supply and a load includes a cooling case that has an opening, a circuit assembly that is disposed closing the opening of the cooling case, and a liquid coolant that is stored in the cooling case. The circuit assembly has a case-facing surface that faces the cooling case, and includes a plurality of busbars that are disposed on the case-facing surface and constitute a conductive path between the power supply and the load. The busbars are immersed in the liquid coolant R.

An electrical junction box configured to be disposed between a power supply and a load includes a cooling case that has an opening, a circuit assembly that is disposed closing the opening of the cooling case, and a liquid coolant that is stored in the cooling case. The circuit assembly has a case-facing surface that faces the cooling case, and includes a plurality of busbars that are disposed on the case-facing surface and constitute a conductive path between the power supply and the load. The busbars are immersed in the liquid coolant R.