A contact system includes a support body, a heat sink configured to contact the support body in an electrically insulated and/or heat-conducting manner, and an electrically insulating layer arranged between the heat sink and the support body. The heat sink has a first surface which is embodied substantially as a flat area and formed with a recess in a region intended for contacting a periphery of a contact area of the support body. The recess forms an unbroken track on the first surface of the heat sink. The contact area of the support body is located on the heat sink in such a way that the recess extends completely along the periphery of the contact area. The insulating layer between the heat sink and the support body is configured to cover the recess in such a way that a dosed channel is formed by the recess and the insulating layer.

A first busbar includes a first electrical connection portion that is electrically connected to a main relay, a first heat transfer connection portion that is thermally connected to the insulating plate, and a first detour portion that connects the first electrical connection portion and the first heat transfer connection portion to each other. A second busbar includes a second electrical connection portion that is electrically connected to the main relay, a second heat transfer connection portion that is thermally connected to the insulating plate, and a lateral detour portion and a lower detour portion that connect the second electrical connection portion and the second heat transfer connection portion to each other.

A first busbar includes a first electrical connection portion that is electrically connected to a main relay, a first heat transfer connection portion that is thermally connected to the insulating plate, and a first detour portion that connects the first electrical connection portion and the first heat transfer connection portion to each other. A second busbar includes a second electrical connection portion that is electrically connected to the main relay, a second heat transfer connection portion that is thermally connected to the insulating plate, and a lateral detour portion and a lower detour portion that connect the second electrical connection portion and the second heat transfer connection portion to each other.

Cooling system for bus bars, in particular cell connectors or module connectors of batteries, comprising a bus bar with a first connection area for a pole of a first battery, a second connection area for a connection of an electrical component, an insulation encasing the bus bar between the connection areas, wherein the bus bar is free of the insulation at least in the two connection areas, characterized in that on a side facing away from the pole of at least one of the connection areas, a gel-shaped heat conducting agent is applied directly to the surface of the bus bar.

Cooling system for bus bars, in particular cell connectors or module connectors of batteries, comprising a bus bar with a first connection area for a pole of a first battery, a second connection area for a connection of an electrical component, an insulation encasing the bus bar between the connection areas, wherein the bus bar is free of the insulation at least in the two connection areas, characterized in that on a side facing away from the pole of at least one of the connection areas, a gel-shaped heat conducting agent is applied directly to the surface of the bus bar.

This disclosure is directed to power systems for transferring power between electrical components. An exemplary power system includes a first electrical component (e.g., an electric motor), a second electrical component (e.g., an inverter system), and a terminal block assembly adapted to electrically couple the first and second electrical components. The terminal block assembly includes an internal cooling channel configured to receive coolant for providing direct liquid cooling of the bus bar.

A rigid bus duct comprising a pair of side rails extending in a longitudinal direction, a plurality of support members extending between the side rails in a transverse direction, and a plurality of insulated conductors extending longitudinally, and held in a fixed relationship to one another by the plurality of support members. The plurality of insulated conductors are arranged in groups including a plurality of high current phase groups and a neutral group, and a plurality of shielding structures connected between the support members and positioned with at least one shielding structure located between the insulated conductors of each high current phase group.

Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

Embodiments of busbar assemblies for use in immersion cooling apparatuses are described herein. In one embodiment, a busbar assembly may include an insulator block and a busbar. The insulator block may include a first barrier having a first barrier height, a second barrier having a second barrier height, a channel located between the first barrier and the second barrier, and a slot formed in the channel. The busbar may be positioned in the slot and have an effective busbar height that is less than the first barrier height and less than the second barrier height. Other examples may be described and claimed.