A dispenser apparatus for a curable liquid material is disclosed. The apparatus comprises a flexible bag defining a first compartment for accommodating a first component of a curable liquid material, and a second compartment for accommodating a second component of the curable liquid material and adapted to communicate with the first chamber to enable mixing of the first and second components to initiate curing of the curable liquid material. A first clamp temporarily prevents mixing of the first and second components, and an elongate nozzle communicates with the second compartment to dispense the mixed curable liquid material therefrom. A second clamp temporarily prevents passage of the curable liquid material from the second compartment to the nozzle.

A dispenser apparatus for a curable liquid material is disclosed. The apparatus comprises a flexible bag defining a first compartment for accommodating a first component of a curable liquid material, and a second compartment for accommodating a second component of the curable liquid material and adapted to communicate with the first chamber to enable mixing of the first and second components to initiate curing of the curable liquid material. A first clamp temporarily prevents mixing of the first and second components, and an elongate nozzle communicates with the second compartment to dispense the mixed curable liquid material therefrom. A second clamp temporarily prevents passage of the curable liquid material from the second compartment to the nozzle.

A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa.Math.s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.

An electrical penetrator assembly is shown, configured to feed electrical voltage and current through a wall separating a first volume and a second volume, which may have different pressure and/or may be filled with different fluids. The connector comprises a wall or partition having a through opening. An electrical conductor surrounded by a tubular insulator body passes the opening through the wall. A conductive or semi-conductive coating is arranged on the exterior of the insulator body, the coating surrounding the insulator body for a portion of its length, the coating in electrical contact with the wall, wherein the coated portion of the insulator body is shaped to displace the electric field around the conductor away from the wall and reduce the electric field strength around the insulator body by increasing the electric field strength inside the insulator body.

An electrical penetrator assembly is shown, configured to feed electrical voltage and current through a wall separating a first volume and a second volume, which may have different pressure and/or may be filled with different fluids. The connector comprises a wall or partition having a through opening. An electrical conductor surrounded by a tubular insulator body passes the opening through the wall. A conductive or semi-conductive coating is arranged on the exterior of the insulator body, the coating surrounding the insulator body for a portion of its length, the coating in electrical contact with the wall, wherein the coated portion of the insulator body is shaped to displace the electric field around the conductor away from the wall and reduce the electric field strength around the insulator body by increasing the electric field strength inside the insulator body.

A method for attaching a contact element comprises steps for providing an electrical conductor with a conductive core and an insulating sheath, for detaching a sheath section of the sheath in an end region of the conductor for displacing the sheath section against the core in such a way that the sheath section protrudes beyond a longitudinal end of the core, and for crimping a contact element to the end region of the conductor in such a way that at least a part of the sheath section is being enclosed between the contact element and the core.

A method for attaching a contact element comprises steps for providing an electrical conductor with a conductive core and an insulating sheath, for detaching a sheath section of the sheath in an end region of the conductor for displacing the sheath section against the core in such a way that the sheath section protrudes beyond a longitudinal end of the core, and for crimping a contact element to the end region of the conductor in such a way that at least a part of the sheath section is being enclosed between the contact element and the core.

The apparatus 50 comprises a flange 52 which is fastened to a housing 12, a cable clamp 54 which has a first through hole through which the cable 14 is passed and which is arranged between the housing 12 and the flange 52, and an elastic member 56 which has a second through hole through which the cable 14 is passed and which is arranged between the housing 12 and the cable clamp 54. The flange 2 has a cable hole 66 which opens at an outer peripheral edge of the flange 52 and holds the cable 14. The elastic member 56 is sandwiched between the cable clamp 54 and the housing 12 when the flange 52 is fastened to the housing 12, elastically deforms, holds the cable 14 at the inside of the second through hole, and seals the cable lead-out hole 66.

The apparatus 50 comprises a flange 52 which is fastened to a housing 12, a cable clamp 54 which has a first through hole through which the cable 14 is passed and which is arranged between the housing 12 and the flange 52, and an elastic member 56 which has a second through hole through which the cable 14 is passed and which is arranged between the housing 12 and the cable clamp 54. The flange 2 has a cable hole 66 which opens at an outer peripheral edge of the flange 52 and holds the cable 14. The elastic member 56 is sandwiched between the cable clamp 54 and the housing 12 when the flange 52 is fastened to the housing 12, elastically deforms, holds the cable 14 at the inside of the second through hole, and seals the cable lead-out hole 66.

A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel. At least two waterproof sealing rings are used to isolate an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB.