A surge protection system includes a receptacle body, at least one power output jack, a power obtaining device, at least one surge protection module, a microcontroller unit, and a surge detection circuit. The at least one surge protection module includes a housing, a memory element, and a surge protection circuit that includes a surge absorption element and a thermal fuse connected in series and parallel. The surge absorption element absorbs a surge inputted from an external power supply, and the memory element records a number of surges carried by the surge absorption element. When the surge enters the surge protection system from the external power supply, the surge absorption element absorbs the surge, and the surge detection circuit outputs a signal to the microcontroller unit that writes the number of surges carried by the surge absorption element into the memory element.

A surge protection system includes a receptacle body, at least one power output jack, a power obtaining device, at least one surge protection module, a microcontroller unit, and a surge detection circuit. The at least one surge protection module includes a housing, a memory element, and a surge protection circuit that includes a surge absorption element and a thermal fuse connected in series and parallel. The surge absorption element absorbs a surge inputted from an external power supply, and the memory element records a number of surges carried by the surge absorption element. When the surge enters the surge protection system from the external power supply, the surge absorption element absorbs the surge, and the surge detection circuit outputs a signal to the microcontroller unit that writes the number of surges carried by the surge absorption element into the memory element.

A protection system for an electromagnetic relay mounted on a vehicle is configured to protect the electromagnetic relay from causing a coupling failure due to freezing of the electromagnetic relay. The system includes a temperature detector, a cooler, and a control unit. The temperature detector sequentially measures an ambient temperature of a location in which the electromagnetic relay is disposed and outputs information on a change in the ambient temperature. The cooler cools an electric power line coupled to a fixing terminal of the electromagnetic relay. The control unit activates the cooler to cool the electric power line in a case where the control unit determines that the electromagnetic relay has a possibility of freezing on the basis of the information on the change in the ambient temperature from the temperature detector.

A wiring system for a vehicle is specified, which has a voltage source and an electrical load, whereby a need for the electrical load depends on an external condition. Furthermore, the wiring system has a load path with an electrical line, which connects the voltage source to the electrical load, and a first switching element, which is arranged in the load path, for disconnecting the electrical load from the voltage source, wherein a working range of the external condition is defined, within which the function of the electrical load is reasonable, and a control unit is arranged, which is designed in such a way that a switching on of the electrical load is prevented if the external condition lies outside the working range. Furthermore, a method for the design of an electrical line of such a wiring system is given.

A control and protection circuit of a heater, a towel heating barrel and a control method thereof are provided in this disclosure. The control and protection circuit of the heater includes a power module, a power supply module, a control module, a temperature detection module and a heating module. The power module, the power supply module and the heating module are connected in series to supply power to the heating module, the control module is in signal connection with the power supply module to control on and off of the power supply module, and the temperature detection module in signal connection with the control module. The power supply module includes a high-temperature protection switch, a fuse and a relay. The control and protection circuit of the whole heater has three levels of protection, which can not only effectively provide high-temperature protection, but also ensure service life of the heater.

A power supply control device controls power supply from a DC power source to a load, by turning on or off a MOSFET. A current regulation circuit regulates a current flowing through a device resistor to a current proportional to a voltage between the drain and the source of the MOSFET. A drive circuit turns off the MOSFET when a voltage across a resistor circuit exceeds a predetermined voltage. The on-resistance of the MOSFET varies according to an ambient temperature of the MOSFET. The resistance of the resistor circuit varies in a direction different from a direction in which the on-resistance of the MOSFET varies, according to the ambient temperature of the MOSFET.

The present application provides method and circuit for monitoring a voltage of a power supply, which adopts a divided voltage circuit to obtain a divided voltage from an input voltage of an input power source generated from the power supply, for detecting the input voltage according to the divided voltage by adopting a first detection circuit and a second detection circuit. Also, judging whether the divided voltage is clamped according to a clamp threshold value to determine the first detection circuit or the second detection circuit detecting a detection current and determine another detection circuit detecting the divided voltage. Hereby, the input voltage transmitted from a rectification circuit to the power supply is monitored, and the dependence between the two detection circuits is avoided.

A communication apparatus includes a communication unit, a power supply unit, a temperature monitoring unit, and a control unit. The communication unit communicates with an additional apparatus. The power supply unit supplies power to components mounted in the communication apparatus. The temperature monitoring unit monitors a temperature in the communication apparatus to detect presence or absence of a temperature abnormality. In a case where the temperature monitoring unit detects the temperature abnormality, the control unit performs power supply stop processing of stopping the power supply from the power supply unit to at least some of the components. Furthermore, the control unit stops or decreases communication of the communication unit in a case where the temperature monitoring unit detects the temperature abnormality.

A communication apparatus includes a communication unit, a power supply unit, a temperature monitoring unit, and a control unit. The communication unit communicates with an additional apparatus. The power supply unit supplies power to components mounted in the communication apparatus. The temperature monitoring unit monitors a temperature in the communication apparatus to detect presence or absence of a temperature abnormality. In a case where the temperature monitoring unit detects the temperature abnormality, the control unit performs power supply stop processing of stopping the power supply from the power supply unit to at least some of the components. Furthermore, the control unit stops or decreases communication of the communication unit in a case where the temperature monitoring unit detects the temperature abnormality.

A semiconductor device 100 has a power transistor N1 of vertical structure and a temperature detection element 10a configured to detect abnormal heat generation by the power transistor N1. The power transistor N1 includes a first electrode 208 formed on a first main surface side (front surface side) of a semiconductor substrate 200, a second electrode 209 formed on a second main surface side (rear surface side) of the semiconductor substrate 200, and pads 210a-210f positioned unevenly on the first electrode 208. The temperature detection element 10a is formed at a location of the highest heat generation by the power transistor N1, the location (near the pad 210b where it is easiest for current to be concentrated) being specified using the uneven positioning of the pads 210a-210f.