A circuit system includes an electronic device having a first external terminal, a second external terminal, a third external terminal, and a power supply rail coupled to the first external terminal, the second external terminal, and the third external terminal. The circuit system also includes a capacitor coupled to the power supply rail in the electronic device through the third external terminal of the electronic device. The capacitor is configured to provide voltage overshoot protection to an integrated circuit die coupled to the first external terminal during an electrostatic discharge event occurring in the power supply rail. The capacitor is external to the integrated circuit die.

A semiconductor package includes a metallic pad and leads, a semiconductor die including a semiconductor substrate attached to the metallic pad, and a conductor including a sacrificial fuse element above the semiconductor substrate, the sacrificial fuse element being electrically coupled between one of the leads and at least one terminal of the semiconductor die, a shock-absorbing material over a profile of the sacrificial fuse element, and mold compound covering the semiconductor die, the conductor, and the shock-absorbing material, and partially covering the metallic pad and leads, with the metallic pad and the leads exposed on an outer surface of the semiconductor package. Either a glass transition temperature of the shock-absorbing material or a melting point of the shock-absorbing material is lower than a melting point of the conductor.

The disclosure relates to a solid-state circuit breaker with negative temperature coefficient NTC temperature data acquisition, wherein the solid-state circuit breaker includes: a plurality of first NTC temperature data acquisition circuits, each connected with an input end and an output end of power supply terminals and configured to acquire a first resistance value indicating temperature data of the power supply terminals; a plurality of second NTC temperature data acquisition circuits, each connected to both ends of a switch and configured to acquire a second resistance value indicating temperature data of the switch; a voltage follower, configured to output a voltage value corresponding to the second resistance value; a voltage/frequency V/F conversion circuit, configured to output an amplitude-frequency converted voltage value; an isolator, configured to output a digitally isolated voltage value; and a microcontroller MCU, connected to the first NTC temperature data acquisition circuit and the isolator.

An electronic device is provided. The electronic device includes at least one processor, memory, comprising one or more storage media, storing instructions, a display module, a first power management module for controlling a first voltage power supply and a second voltage power supply provided to the display module, and a second power management module including a regulator power supply and controlling power supplied to at least one processor, wherein the instructions, when executed by the at least one processor individually or collectively, cause the electronic device to while the first voltage power supply is turned on, switch a first mode in which the regulator power supply is operating to a second mode in which the regulator power supply operates as a bypass, receive an interrupt generated based on a first voltage outputted by the first voltage power supply, and determine an abnormality of the display module based on the interrupt.

A threshold voltage adjustment circuit of an embodiment includes a reference current circuit and a trans-impedance circuit. The reference current circuit is formed on a substrate and outputs a reference current. The trans-impedance circuit has a plurality of resistors on the substrate, and outputs a threshold voltage that is expressed as a function of a reference current and a combined resistance of the plurality of resistors and an external resistor.

A leakage detection and interruption device includes a switch module to control power connection between input and output terminals of a power line; a leakage detection module to generates a leakage fault signal when the leakage current on the power line exceeds a threshold; a power module, including a first current limiting element, coupled in series between the power line and the leakage detection module, to supply power to the leakage detection module; the driving module includes a electromagnetic coil and a switching semiconductor device, to drive the switching module to disconnect the power connection in response to a leakage fault signal. The first end of the first current limiting element is coupled to the power line, and the second end is coupled to the first end of the switching semiconductor device through at least one first diode and/or second current limiting element.