Patent classifications
A61K2800/34
Alcohol containing non-antimicrobial cleansing composition
A non-antimicrobial cleansing composition is disclosed comprising from about 10.0 wt. % to less than about 40 wt. % of one or more C.sub.1-C.sub.8 alcohols; about 0.5 wt. % to about 10.0 wt. % of at least one primary surfactant; 0 wt. % to about 10.0 wt. % of at least one secondary surfactant, with the primary and secondary surfactants having an HLB value greater than 8; a pH adjusting agent; and water. The composition does not achieve a microbial kill level greater than 2.0 log.
PRESSED POWDER COMPOSITION
Provided are cosmetic powder compositions which contain at least one butter, such as shea butter, at least one butter treated powder and a high mass content of spherical powder particles.
Deodorant Compositions
Described herein are deodorant compositions comprising an odor-reducing agent comprising a non-aluminum compound, an emollient comprising a non-volatile ether compound, calcium silicate, and an emulsifier. Methods of making and using these compositions are also described herein.
ANTIPERSPIRANT FORMULATIONS COMPRISING HEMISQUALANE
Provided herein antiperspirant composition formulations that contain hemisqualane and lack organosilicon compounds. The hemisqualane provides the carrier and emollient activities that are typically supplied by an organosilicon compound. The antiperspirant formulations provided herein have a benefit of not releasing organosilicon compounds into the environment during and after their use.
ACRYLATE AND SILICONE-FREE COSMETIC O/W EMULSION
The present application relates to a cosmetic emulsion.
Alcohol containing non-antimicrobial cleansing composition
A non-antimicrobial cleansing composition is disclosed comprising from about 10.0 wt. % to less than about 40 wt. % of one or more C.sub.1-C.sub.8 alcohols; about 0.5 wt. % to about 10.0 wt. % of at least one primary surfactant; 0 wt. % to about 10.0 wt. % of at least one secondary surfactant, with the primary and secondary surfactants having an HLB value greater than 8; a pH adjusting agent; and water. The composition does not achieve a microbial kill level greater than 2.0 log.
A PERSONAL CARE COMPOSITION
A personal care composition and its process of preparation wherein the composition comprises (a) polyglycerol ester product of 5 weight parts of lactic acid, 5 weight parts of lauric acid and 90 weight parts of polyglycerol; (b) one or more ingredient(s) and (c) water; wherein the polyglycerol is with an average polymeric degree of .sub.2-5.
LIQUID CRYSTAL SULFATE-FREE SHAMPOO
A shampoo composition comprising a. 3% to 35% of an anionic surfactant, wherein the anionic surfactant is substantially free of sulfated surfactants; b. 3% to 15% of an amphoteric surfactant; and c. 0.01% to 2% of a cationic polymer having a charge density 2.0 to 10.0 meq/g; and wherein the composition is isotropic and forms a lyotropic liquid crystal coacervate upon dilution.
HAIR COMPOSITION
A rinse off hair treatment composition comprising; a. a pressure sensitive adhesive emulsion comprising one or more pressure sensitive polymer, wherein the pressure sensitive polymer is not silicone pressure sensitive polymer, and b. at least one material selected from the group consisting of i) a hair conditioning agent; ii) a hair cleansing agent, and, c. a deposition aid.
SHAMPOO COMPOSITION CONTAINING A GEL NETWORK
A shampoo composition and a method of making a shampoo composition which delivers both good conditioning benefits and good lather performance. The shampoo composition comprises a dispersed gel network phase comprising: from about 2.8 weight % to about 8 wt % of one or more fatty alcohols; at least 0.01% of one or more secondary surfactants, wherein the secondary surfactant comprises sodium laureth-n sulfate wherein n is from about 0 to about 5; and water; and from about 5% to about 50% of a detersive surfactant; from about 0.02% to about 1.50% of a material selected from the group consisting of structurants, suspending agents and mixtures thereof, from about 0.5 to about 1% of a cationic deposition polymer; and at least 20% of an aqueous carrier.