A system is disclosed. The system includes a substrate, and a first chip on the substrate, where a load circuit is integrated on the first chip. The system also includes a second chip on the substrate, where a power delivery circuit is configured to deliver current to the load circuit according to a regulated voltage at a node. The power delivery circuit includes a first circuit configured to generate an error signal based at least in part on the regulated voltage, and a voltage generator including power switches configured to modify the regulated voltage according to the error signal, where the first circuit of the power delivery circuit is integrated on the first chip, and where at least a portion of the power switches of the power delivery circuit are integrated on the second chip.

A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

A plasma deposition system comprising a wafer platform, a second electrode, a first electrode, a first high voltage pulser, and a second high voltage pulser. In some embodiments, the second electrode may be disposed proximate with the wafer platform. In some embodiments, the second electrode can include a disc shape with a central aperture; a central axis, an aperture diameter, and an outer diameter. In some embodiments, the first electrode may be disposed proximate with the wafer platform and within the central aperture of the second electrode. In some embodiments, the first electrode can include a disc shape, a central axis, and an outer diameter. In some embodiments, the first high voltage pulser can be electrically coupled with the first electrode. In some embodiments, the second high voltage pulser can be electrically coupled with the second electrode.

A power convertor has a casing and a power conversion circuit arranged in an internal chamber of the casing. The casing has a first wall member as a specific side wall. A plurality of connector opening parts are formed in the first wall member. At least two of the plurality of connector opening parts formed in the first wall member are arranged at different positions facing a different direction from each other.

A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.

An electronics assembly includes a plurality of planar conductive metal sheets including a first conductive metal sheet, a second conductive metal sheet attached and electrically coupled to the first metal sheet, and a third conductive metal sheet attached and electrically coupled to the second metal sheet. The second metal sheet is located between the first and third conductive metal sheets. Air gaps are defined in the plurality of planar conductive metal sheets to form metal traces that define electrically isolated conductive paths from an outer surface of the first conductive metal sheet to an outer surface of the third conductive metal sheet in a multilevel conductive wiring network. The multilevel conductive wiring network can be attached and electrically coupled to a microchip and to one or more capacitors to form a power converter.

Obtain an electric power converter by which a downsizing and a low cost can be realized in such a way that main components are standardized. A transformer and rectifier elements of a rectifier circuit are configured by using a single module, and a center tap is configured by laminating one pullout portion of a first secondary winding and one pullout portion of a second secondary winding, and a central connecting component is connected to a center tap and a terminal of a smoothing coil which composes a smoothing reactor.

Disclosed herein is an inductor component that includes a magnetic core having magnetic thin ribbons laminated in a z-direction, a first coil conductor inserted into first and second through holes penetrating the magnetic core in the z-direction, and a second coil conductor inserted into third and fourth through holes penetrating the magnetic core in the z-direction. Each of the magnetic thin ribbons is divided into a plurality of small pieces by net-shaped cracks. A periphery of each of the first to fourth through holes is surrounded by the plurality of small pieces without being circumferentially divided by a slit having a size larger than the crack.

Disclosed herein is an improved flyback converter that separates the magnetic components of the converter into a transformer and a separate, discrete energy storage inductor. This arrangement can improve the operating efficiency of the converter by reducing the commutation losses as compared to a conventional flyback converter. The magnetic components may be constructed on separate magnetic cores or may be constructed on magnetic cores having at least one common element, thereby allowing for at least partial magnetic flux cancellation in a portion of the core, reducing core losses.

To provide a power converter and a breaking mechanism which can break a DC current and can suppress that a fused material scatter to other circuits at fusing, in the case where the breaking mechanism of excess current is formed by a circuit pattern of a circuit board. In a power converter, a supporting member is provided with a support body part; a fixation projection part which projected from the support body part and to which the multilayer circuit board was fixed; and a support projection part which projected from the support body part and supports an one side circuit board face, wherein the fuse pattern is provided in an inner layer, and the support projection part overlaps with at least one part of a fusing part of the fuse pattern, viewing in a normal direction of the circuit board face of the multilayer circuit board.