A bus bar for a plurality of capacitor elements having an equal impedance includes a positive electrode bus bar and a negative electrode bus bar. The positive electrode bus bar and the negative electrode bus bar each includes a main bus bar and branch bus bars. The main bus bar is electrically connected to an electric circuit having a switching element. First ends of the branch bus bars are connected to the main bus bar at different positions, and second ends of the branch bus bars are connected to the capacitor elements. The branch bus bars are configured so that an impedance between the first end and the second end reduces as an impedance between a connecting portion of the main bus bar to the electric circuit and a connecting portion of the first end of the branch bus bar to the main bus bar increases.

A power converter includes a control circuit executing feedback control of a first inverter based on a detected value of a first sensor adapted to a first rotating electrical machine. The first sensor detects a current of a first busbar adapted to the first rotating electrical machine. The first busbar connects the first inverter and the first rotating electrical machine. A second busbar adapted to a second rotating electrical machine connects a second inverter and the second rotating electrical machine. The second busbar is arranged to be apart from the first sensor interposed with a converter busbar between the second busbar and the first sensor. A current of the converter flows through the converter busbar.

A power converter includes an inverter, a converter, an electrical-machine busbar, an electrical-machine sensor, an electrical-machine-sensor housing, a converter, a converter busbar, a converter-sensor housing. The inverter supplies a three-phase alternating current to a rotating electrical machine. The converter converts a voltage between a direct current power supply and the inverter. The electrical-machine busbar passes a current between the inverter and the rotating electrical machine. The electrical-machine sensor detects the current flowing through the electrical-machine busbar based on a magnetic field. The electrical-machine-sensor housing accommodates the electrical-machine sensor and the electrical-machine busbar together. The converter sensor detects the current flowing through the converter based on a magnetic field. The converter-sensor housing is disposed apart from the electrical-machine-sensor housing, and accommodates the converter sensor and the converter busbar together.

The present disclosure relates to a technical idea for efficiently using space of a power supply unit of a charging/discharging system by facilitating arrangement and design in a unit module. A modular high-precision charger/discharger sub-rack assembly structure includes: a base plate fixed in a state of being vertically erected to a sub-rack of a high precision charger/discharger; and at least one charger/discharger power supply unit or electrically or physically detachably attached to one surface of the base plate, configured to perform charging or discharging through bi-directional AC-DC conversion or bi-directional DC-DC conversion between a battery and a power source, including constituent circuits arranged in a first direction to have an elongated shape in the first direction and to perform charging or discharging, and arranged in parallel in a second direction perpendicular to the first direction on the base plate.

A capacitor unit includes: a base portion with a mount surface, and a locking member. The locking member includes a shaft portion to be inserted in a hole provided in the mount surface and a head portion. A first guide member and a second guide member guide along an anteroposterior direction, a first end and a second end of the base portion in a lateral direction, respectively. The hole is located between the capacitor and the first end in the lateral direction, and arranged at a position more distant from an opening than the first guide member in the anteroposterior direction. At a first engagement position, the locking member abuts on the first guide member. At a second engagement position, abutment of the locking member on the first guide member is canceled.

A semiconductor assembly includes a semiconductor package that includes first and second transistor dies embedded within a package body, the first and second transistor dies being arranged laterally side by side within the package body such that a first load terminal of the first transistor die faces an upper surface of the package body and such that a second load terminal of the second transistor die faces the upper surface of the package body, and a discrete capacitor mounted on the semiconductor package such that a first terminal of the discrete capacitor is directly over and electrically connected to the first load terminal of the first semiconductor die and such that a second terminal of the discrete capacitor is directly over and electrically connected with the second load terminal of the second semiconductor die.

A direct current to direct current (DC-DC) converter can include a chip embedded integrated circuit (IC), one or more switches, and an inductor. The IC can be embedded in a PCB. The IC can include driver, switches, and PWM controller. The IC and/or switches can include eGaN. The inductor can be stacked above the IC and/or switches, reducing an overall footprint. One or more capacitors can also be stacked above the IC and/or switches. Vias can couple the inductor and/or capacitors to the IC (e.g., to the switches). The DC-DC converter can offer better transient performance, have lower ripples, or use fewer capacitors. Parasitic effects that prevent efficient, higher switching speeds are reduced. The inductor size and overall footprint can be reduced. Multiple inductor arrangements can improve performance. Various feedback systems can be used, such as a ripple generator in a constant on or off time modulation circuit.

Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

Provided is a power conversion device capable of observing a chip temperature with high accuracy without increasing a cost of the power conversion device mounted with a current sense element for observing a main current of a power device. A main control MOSFET 11, a current MOSFET 12, and a diode 13 connected to a source electrode 8 of the main control MOSFET 11 and a source electrode 9 of the current MOSFET 12 are mounted in a chip of a power device, a temperature measurement circuit 3 is connected to the source electrode 9 of the current MOSFET 12, and when the main control MOSFET 11 is in an off state, a forward current (I.sub.f) is caused to flow through the diode 13, and an anode potential is observed to measure the chip temperature.

A power conversion system including a triple active bridge (TAB) is provided. The system includes a power factor correction (PFC) module and a three port converter (TPC) module, with no post-regulation or additional stages required. The TPC module includes an OBC full-bridge and an APM full-bridge, each being inductively coupled to the output of the PFC full-bridge, thereby forming the TAB. The OBC full-bridge is adapted to convert an AC input into a high-voltage DC output for a high-voltage battery, and the APM full-bridge is adapted to convert an AC input into a low-voltage DC output for a low-voltage battery. The power conversion system can accept a single-phase AC input and a three-phase AC input, has a lower current stress as compared to prior art TPCs, and freely transfers power from among any ports.