A power conversion apparatus includes: a semiconductor module including a built-in switching element; and a pair of bus bars connected to a power terminal of the semiconductor module. The pair of bus bars has body plate parts that are arranged so as to at least partially face each other in a thickness direction, and pluralities of terminal connection parts that are branched from the body plate parts and to which the power terminal is connected. At least one of the pair of bus bars has a plurality of annular parts that are annularly formed so as to include the plurality of terminal connection parts.

A system for plasma ignition and maintenance of an atmospheric pressure plasma. The system has a variable frequency alternating current (AC) power source, a transformer, a cable connected to a secondary winding of the transformer, a programmed microprocessor for control of power to the atmospheric pressure plasma. The microprocessor is configured to a) at pre-ignition, power the AC power source at an operational frequency f.sub.op higher than the resonant frequency f.sub.r, b) decrease the operational frequency f.sub.op of the AC power source until there is plasma ignition, and c) after the plasma ignition, further decrease the operational frequency f.sub.op of the AC power source to a frequency lower than the resonant frequency f.sub.r.

A battery charger for vehicles comprises one outer container, one electronic appliance housed inside the container, operatively connectable to an electric battery of a vehicle and configured for the recharge of the battery, and one cooling circuit of the electronic appliance, wherein the electronic appliance comprises one electronic board provided with an insulated metal substrate associated with the cooling circuit, with a layer of electrically insulating material made on one portion of the insulated metal substrate, and with one electronic circuit made on the layer of electrically insulating material, in which the electronic board comprises one conductive metal bar for the transport and the distribution of current, electrically connected to the electronic circuit and provided with one portion arranged in direct contact with one surface portion of the electronic board, for the cooling of the conductive metal bar by the cooling circuit.

In a power conversion device in which cell converters are connected in series, each cell converter includes: main circuit conductors connecting switching elements and a capacitor to each other; a bypass portion disposed between two external terminals connected to other cell converters; external output conductors connecting the external terminals and the main circuit conductors to each other; and bypass connection conductors connecting the external output conductors and the bypass portion to each other. The bypass connection conductors or the external output conductors are disposed so as to oppose each other at a high-potential side and a low-potential side thereof. The conductors are bent so as to have portions at which currents in parts of the conductors have the same direction. Thus, mutual inductances and self-inductances are increased, whereby short-circuit current flowing to the bypass portion at the time of double failures is suppressed.

A dielectric film includes a substrate being a film including a resin material, and a plurality of microscopic members on a first surface of the substrate. Each of the plurality of microscopic members includes a first portion spaced from the first surface, and a second portion extending from the first surface and supporting the first portion.

A heat dissipation structure for the reactor includes a housing, a reactor body, and one or more heat dissipation pipes. Each of the one or more heat dissipation pipes is disposed in a cavity of the housing and is connected to the housing in a leak-tight manner, a closed cavity is formed between the one or more heat dissipation pipes and the housing, and the reactor body is disposed in the closed cavity. The above heat dissipation structure for the reactor allows to improve the heat dissipation effect of the reactor under the premise that protection requirements are met. The current carrying density of the coil of the reactor body can be increased and the diameter of copper wires can be reduced under the same conditions, thereby reducing the usage of copper and effectively reducing the cost and weight.

The present disclosure includes drive modules for motor-drive assemblies of an industrial automation system. The drive modules may include a housing having a cavity and may also include power circuitry and control circuitry. The power circuitry may convert input DC power to three-phase controlled frequency AC power and may supply the three-phase controlled frequency AC power to a motor. The control circuitry may apply control signals to control operation of the motor. The drive module may also include an adapter that couples to a first end of the housing and couples the housing to the motor. The adapter may be removable and sized according to a frame size of the motor such that the drive module is compatible with the motor. The housing may be independent of the frame size of the motor. As such, the housing may be interchangeable for any motor frame size and/or motor power.

A power semiconductor module includes: an electrically insulative frame having opposite mounting sides and a border wall that defines a periphery of the frame; a substrate seated in the frame; power semiconductor dies attached to the substrate; signal pins attached to the substrate and electrically connected to the power semiconductor dies; a busbar attached to the substrate and extending through the border wall; a receptable in the border wall configured to receive a current sensor module and that exposes part of the busbar, the exposed part of the busbar having an opening; and a rotation bar jutting out from a sidewall of the receptable and onto the exposed part of the busbar without obstructing the opening in the busbar, wherein the rotation bar forms an axis of rotation within the receptable. A power electronic assembly that incorporates the power semiconductor module and corresponding method of production are also described.

A converter comprises a housing having a mounting structure for mounting the converter to a DIN rail. A converter circuit is disposed within the housing and comprises one or several wide-bandgap semiconductor based active switching element(s). The converter circuit is adapted to perform a total harmonic voltage distortion measurement and to perform a control function based thereon.

A power converter includes a PCB having opposing first and second sides, and a plurality of first commutation units and first capacitor unit disposed on the PCB. Each first commutation unit includes a first discrete component and a second discrete component. The second end of the first discrete component is electrically coupled to the first end of the second discrete component, and the first capacitor unit is electrically coupled to the first ends of the first discrete components and the second ends of the second discrete components in the plurality of first commutation units, respectively. The first discrete components and the second discrete components in the plurality of first commutation units are arranged in a row. The first discrete component and the second discrete component in each first commutation unit form a commutation loop together with the first capacitor unit.