Electrical connections are created between the actuator frame of a piezoelectric MEMS scanning mirror system and the substrate separate from the structural adhesive creating the mechanical bond between the actuator frame and the substrate. A structural bond (with no conducive properties) is formed between the actuator frame and the substrate. After the bond is fully formed, separate electric connections can be created by one or both of: 1) coating the actuator frame with a coating that enables a surface of the actuator frame to be wire bondable and creating a wire bond between the actuator frame and the substrate; or 2) depositing a trace of conductive material on the outside edge of the mechanical bond between the actuator frame and the substrate and a final protection layer may be applied over the conductive trace to protect the trace from mechanical or environmental damage.

A MEMS component is described herein, which according to one exemplary embodiment includes: a semiconductor body; an insulation layer arranged on the semiconductor body; a boundary structure arranged on the insulation layer, the semiconductor body including an opening below the boundary structure; first and second structured electrodes arranged on the insulation layer; and a piezoelectric layer comprising a thermoplastic, and at least partially bounded by the boundary structure and arranged on the insulation layer and on the first and second electrodes.

A glass membrane deformation assembly configured to deform a glass membrane includes: a deformable glass membrane having a first surface and a second surface; a piezoelectric layer affixed to at least a portion of the first surface of the deformable glass membrane, wherein the piezoelectric layer is controllably deformable via a voltage potential; and a structural layer affixed to at least a portion of the second surface of the deformable glass membrane; wherein the controllably deformation of the piezoelectric layer is configured to controllably deform the deformable glass membrane.

A method of making a MEMS actuator with a monolithic body of semiconductor material includes forming a supporting portion of semiconductor material, orientable with respect to first and second rotation axes, the first rotation axis being transverse with respect to the second rotation axis, and forming a first frame of semiconductor material. The method further includes forming first deformable elements, of semiconductor material, coupled to the first frame, and configured to control a rotation of the supporting portion about the first rotation axis. The method also includes forming a second frame of semiconductor material, and forming second deformable elements, of semiconductor material, coupled to the first frame and to the second frame, and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements are formed to carry respective first and second piezoelectric actuation elements.

Micro-Electro-Mechanical System (MEMS) devices for harvesting sound energy and methods for fabricating MEMS devices for harvesting sound energy are provided. In an embodiment, a method for fabricating a MEMS device for harvesting sound energy includes forming a pressure sensitive MEMS structure disposed over a semiconductor substrate and including a suspended structure in a cavity. Further, the method includes etching the semiconductor substrate to form an acoustic port through the semiconductor substrate configured to allow acoustic pressure to deflect the suspended structure.

A vibration-type actuator capable of suppressing reduction in holding torque or holding force under influence of humidity. A vibration-type actuator 10 includes a vibrating body 2 and a driven body 1. The vibrating body 2 has a piezoelectric element 2c and an elastic body 2b. The driven body 1 is in contact with the vibrating body 2. The vibration-type actuator 10 moves the vibrating body 2 and the driven body 1 relatively to each other by vibration excited to the vibrating body 2. At least one of a first contact portion of the vibrating body 2 and a second contact portion of the driven body 1 includes a stainless-steel sintered body with pores and at least some of the pores are impregnated with a resin.

A piezoelectric driving device includes a substrate, a plurality of piezoelectric elements disposed on the substrate, a first groove section provided between the plurality of piezoelectric elements, and a first wire provided in at least a part of a side surface and a bottom section of the first groove section.

An aspect of the present invention relates to a vibration element comprising: a substrate; a ceramic layer containing glass and provided on the substrate; and a piezoelectric element comprising an electrode layer fixed to the substrate with the ceramic layer therebetween and a piezoelectric layer, wherein the piezoelectric layer, the electrode layer, the substrate, and the ceramic layer are integrated by the piezoelectric layer, the electrode layer, the substrate, and the ceramic layer being sintered together at a sintering temperature of from 800° C. or higher to 940° C. or lower.

A vibration type actuator providing a satisfactory actuator performance even when an increase in speed is achieved and having a contact spring. The actuator includes a vibrator equipped with an electrical-mechanical energy conversion element, an elastic member to which the electrical-mechanical energy conversion element is fixed, and a protrusion provided on the elastic member. The vibrator can generate an elliptic movement in the protrusion. A driven body is configured to come into contact with the protrusion and to make a relative movement with respect to the vibrator. The protrusion includes a contact portion having a contact surface contacting the driven body, a continuous side wall portion protruding with respect to one end surface of the elastic member and forming a hollow structure, and a connection portion connecting the contact portion and the side wall portion and exhibiting flexibility in a direction normal to the contact surface.

An energy harvester for converting vibration energy into electrical energy and harvesting the electrical energy includes: a base; a clamping structure which is supported by the base and is spaced apart from the base; an elastic member which is disposed between the base and the clamping structure and allows the clamping structure to be elastically moved relative to the base; and a cantilever structure including a cantilever beam having one side fixed to the clamping structure and the other side which is elastically bendable, and a mass body disposed on the cantilever beam.