H03B5/08

Transformer based shielded oscillator

An oscillator includes a first output node and a second output node. There is a tank circuit coupled between the first output node and the second output node. There is a first transistor having a first node, a second node coupled to a current source, and a control node coupled to the second output node. There is a second transistor having a first node, a second node coupled to the current source, and a control node coupled to the first output node. There is a first inductor coupled in series between the first node of the first transistor and the first output node. There is a second inductor coupled in series between the first node of the second transistor and the second output node.

Transformer based shielded oscillator

An oscillator includes a first output node and a second output node. There is a tank circuit coupled between the first output node and the second output node. There is a first transistor having a first node, a second node coupled to a current source, and a control node coupled to the second output node. There is a second transistor having a first node, a second node coupled to the current source, and a control node coupled to the first output node. There is a first inductor coupled in series between the first node of the first transistor and the first output node. There is a second inductor coupled in series between the first node of the second transistor and the second output node.

Segmentation Superposition Technique for Binary Error Compensation

Systems and methods for compensating a non-linearity of a digitally controlled oscillator (DCO) are presented. Data comprising a plurality of silicon measurements is received. Each silicon measurement in the plurality of silicon measurements is compared to an ideal value. Based on the comparing, a plurality of compensation vectors is generated. Each compensation vector comprises at least one silicon measurement. At least one frequency is adjusted based on a compensation vector in the plurality of compensation vectors. A digitally-controlled oscillator frequency is generated based on the adjusted at least one frequency.

Segmentation Superposition Technique for Binary Error Compensation

Systems and methods for compensating a non-linearity of a digitally controlled oscillator (DCO) are presented. Data comprising a plurality of silicon measurements is received. Each silicon measurement in the plurality of silicon measurements is compared to an ideal value. Based on the comparing, a plurality of compensation vectors is generated. Each compensation vector comprises at least one silicon measurement. At least one frequency is adjusted based on a compensation vector in the plurality of compensation vectors. A digitally-controlled oscillator frequency is generated based on the adjusted at least one frequency.

HIGH Q-FACTOR INDUCTOR
20200234864 · 2020-07-23 · ·

Described is a high Q-factor inductor. The inductor is formed as a unit cell coil, which is copied twice for a dual-coil inductor and copied four times for a quad-coil inductor. For each copy of the unit cell coil, the coil is rotated a subsequent substantially 90 degrees or substantially 90 degrees. The rotation enables the terminals of the inductor to be routed equal-distant to a circuit that is placed in the line of symmetry between the two coils.

HIGH Q-FACTOR INDUCTOR
20200234864 · 2020-07-23 · ·

Described is a high Q-factor inductor. The inductor is formed as a unit cell coil, which is copied twice for a dual-coil inductor and copied four times for a quad-coil inductor. For each copy of the unit cell coil, the coil is rotated a subsequent substantially 90 degrees or substantially 90 degrees. The rotation enables the terminals of the inductor to be routed equal-distant to a circuit that is placed in the line of symmetry between the two coils.

Proximity sensor and method of changing detection distance

A proximity sensor and a method of changing a detection distance are provided to suppress changes in a consumption current of an oscillation circuit. The proximity sensor includes an oscillation circuit having an oscillation amplitude that changes with a feedback current, a comparing part comparing the oscillation amplitude with a threshold, a detecting part detecting a target object based on a comparison result of the comparing part, a voltage value signal generating part generating a voltage value signal based on the feedback current and the detection distance, a threshold setting part setting an analog signal converted from the voltage value signal as the threshold, a current value signal generating part generating a current value signal based on the detection distance and the voltage value signal, and a current value setting part setting an analog signal converted from the current value signal as a current value of the feedback current.

Proximity sensor and method of changing detection distance

A proximity sensor and a method of changing a detection distance are provided to suppress changes in a consumption current of an oscillation circuit. The proximity sensor includes an oscillation circuit having an oscillation amplitude that changes with a feedback current, a comparing part comparing the oscillation amplitude with a threshold, a detecting part detecting a target object based on a comparison result of the comparing part, a voltage value signal generating part generating a voltage value signal based on the feedback current and the detection distance, a threshold setting part setting an analog signal converted from the voltage value signal as the threshold, a current value signal generating part generating a current value signal based on the detection distance and the voltage value signal, and a current value setting part setting an analog signal converted from the current value signal as a current value of the feedback current.

MULTI-DIE MODULE WITH CONTACTLESS COUPLER AND A COUPLING LOSS REDUCTION STRUCTURE
20200203314 · 2020-06-25 ·

A multi-die module includes a first die with a first device and a second die with a second device. The multi-die module also includes a contactless coupler configured to convey signals between the first device and the second device. The multi-die module also includes a coupling loss reduction structure.

MULTI-DIE MODULE WITH CONTACTLESS COUPLER AND A COUPLING LOSS REDUCTION STRUCTURE
20200203314 · 2020-06-25 ·

A multi-die module includes a first die with a first device and a second die with a second device. The multi-die module also includes a contactless coupler configured to convey signals between the first device and the second device. The multi-die module also includes a coupling loss reduction structure.